Lead frame for resin-sealed semiconductor device

Abstract

Abstract PURPOSE:To improve quality of a semiconductor device, by gold- or silver-plating an element mounting part of an internal lead for a lead frame, tin-plating an external lead, and forming a narrow part reinforced by a nonconductor in a part of internal leads. CONSTITUTION:A stitching part 5 and a die mounting part 2 of an internal lead for a lead frame are gold- or silver-plated. An external lead is tin-plated. A narrow part 9 is formed so that an internal lead and a die support en route from the stitch 5 and the die mounting part 2 to a resin-sealed end are remarkably narrower than the other parts. This part 9 is reinforced by an electrical and thermal nonconductor 10. This prevents resin from forcing out in resin molding. A tin-plating process is not needed after sealing. The manufacturing process is facilitated and the quality is improved.

Inventors

• 👤 Mitsuru Imai

Bibliographic Details