US4441118A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Composite copper nickel alloys with improved solderability shelf life
Assignee: Olin Corp
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Filing: 1983-01-13
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Granted: 1984-04-03
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Expires: 2003-01-13
Abstract
Abstract A composite structure having improved solderability shelf life and contact resistance is formed by coating a copper alloy substrate material with a tin-containing material. The copper alloy substrate material consists essentially of about 15% to about 30% nickel and the balance essentially copper. The copper alloy may further include up to about 25% zinc. The nickel in the alloy retards the growth of copper-tin and/or copper-zinc-tin intermetallic compounds and the diffusion of the copper through the coating. The coating may be formed from tin or tin alloys including tin solders, e.g. 60% Tin-40% lead solder.
Inventors
- 👤 Julius C. Fister
- 👤 John F. Breedis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 19:30
CPC Classifications
B; B32; B32B; B32B15/00; B32B15/01; B23; B23K; B23K35/00; B23K35/001; B23K35/007; H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; H10W70/457; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/533; H10W72/534; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9265; Y10S428/929; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12687; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/1291
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
93 words
A composite structure having a reduced growth of copper-tin intermetallic compounds, said composite structure comprising: a substrate formed from a copper base alloy; said copper base alloy consisting essentially of 19% to about 28% nickel and the balance essentially copper; a coating covering at least a portion of said substrate; said coating being formed from a tin-containing material; and said nickel in said alloy retarding the growth of said copper-tin intermetallic compounds and diffusion of said copper through said coating and thereby improving the solderability shelf life and contact resistance of said structure.
Claim 2
Dependent Claim
93 words
A composite structure having a reduced growth of copper-tin intermetallic compounds, said composite structure comprising: a substrate formed from a copper base alloy; said copper base alloy consisting essentially of 19% to about 28% nickel and the balance essentially copper; a coating covering at least a portion of said substrate; said coating being formed from a tin-containing material; and said nickel in said alloy retarding the growth of said copper-tin intermetallic compounds and diffusion of said copper through said coating and thereby improving the solderability shelf life and contact resistance of said structure.
Claim 3
Dependent Claim
24 words
The composite structure of claim 1 further comprising: said copper alloy consisting essentially of 19% to about 26% nickel and the balance essentially copper.
Claim 4
Dependent Claim
30 words
The composite structure of claim 1 wherein: said copper alloy further includes up to about 25% zinc, whereby said nickel in said alloy retards the growth of copper-zinc-tin intermetallic compounds.
Claim 5
Dependent Claim
22 words
The composite structure of claim 1 further comprising: said tin-containing material being selected from the group consisting of tin and tin alloys.
Claim 6
Dependent Claim
25 words
The composite structure of claim 1 wherein: said tin-containing material comprises a tin solder consisting essentially of about 40% lead and the balance essentially tin.
Claim 7
Dependent Claim
26 words
The composite structure of claim 1 further comprising: said coating comprising a stripe of said tin-containing material plated on at least one surface of said substrate.
Claim 8
Dependent Claim
33 words
The composite structure of claim 1 wherein: said substrate comprises a composite having a core and a cladding material; and said copper base alloy forming one of said core and said cladding material.
Claim 9
Dependent Claim
82 words
An integrated circuit assembly for electrical applications, said assembly comprising: a lead frame formed from a composite structure; said composite structure having a substrate formed from a copper alloy consisting essentially of 19% to about 28% nickel and the balance essentially copper and a coating covering at least a portion of said substrate; said coating being formed from a tin-containing material; and said nickel in said alloy retarding the growth of copper-tin intermetallic compounds and diffusion of said copper through said coating.
Claim 10
Dependent Claim
82 words
An integrated circuit assembly for electrical applications, said assembly comprising: a lead frame formed from a composite structure; said composite structure having a substrate formed from a copper alloy consisting essentially of 19% to about 28% nickel and the balance essentially copper and a coating covering at least a portion of said substrate; said coating being formed from a tin-containing material; and said nickel in said alloy retarding the growth of copper-tin intermetallic compounds and diffusion of said copper through said coating.
Claim 11
Dependent Claim
44 words
The integrated circuit assembly of claim 8 further comprising: at least one electrical connector; said lead frame being bonded to said at least one electrical connector; and said bond between said lead frame and each said electrical connector being effected at said coated portion.
Claim 12
Dependent Claim
27 words
The integrated circuit assembly of claim 9 further comprising: a semiconductor chip; and said lead frame being connected to said chip by at least one lead wire.
Claim 13
Dependent Claim
24 words
The integrated circuit assembly of claim 8 wherein said coating comprises: a stripe of said tin-containing material plated on a surface of said substrate.
Claim 14
Dependent Claim
24 words
The integrated circuit assembly of claim 8 wherein: said copper alloy consists essentially of 19% to about 26% nickel and the balance essentially copper.
Claim 15
Dependent Claim
18 words
The integrated circuit assembly of claim 8 wherein: said copper alloy further includes up to about 25% zinc.
Claim 16
Dependent Claim
23 words
The integrated circuit assembly of claim 8 further comprising: said tin-containing material being selected from the group consisting of tin and tin alloys.
Claim 17
Dependent Claim
27 words
The integrated circuit assembly of claim 8 further comprising: said tin-containing material comprising a tin solder consisting essentially of about 40% lead and the balance essentially tin.
References Cited (Backward Citations)
US2849310A
Cited
US3006067A
Cited
US3162512A
Cited
US3097965A
Cited
US3490125A
Cited
US3482303A
Cited
US3892637A
Cited
US3808034A
Cited
US4014660A
Cited
US3999955A
Cited
JPS5696045A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-04-03 | 1987-10-03 | 1988-04-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-04-03 | 1991-10-03 | 1992-04-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-04-03 | 1995-10-03 | 1996-04-03 | $7700.00 | Window Closed / Lapsed |