Patent EP0899737A2 successfully refreshed from Google Patents.
Patent US6399415B1 successfully refreshed from Google Patents.
US6399415B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrical isolation in panels of leadless IC packages
Assignee: National Semiconductor Corp
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Filing: 2000-03-20
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Granted: 2002-06-04
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Expires: 2020-03-20
Abstract
Abstract A variety of techniques for electrically debussing conductive substrate panels used in the formation of a matrix of leadless integrated circuit packages are described. Generally, after a matrix of leadless packages have been fabricated in panel form on a conductive substrate panel, tie bars that are used to support contacts and potentially other structures on the conductive substrate are removed after plastic caps have been molded over the matrix, but before separating the packaged devices. This serves to electrically isolate the contacts from one another while leaving sufficient portions of the molded substrate structure in tact to facilitate handling the structure in panel form. With the described arrangement, the packaged devices may be tested in panel form. After testing and any other desired panel based operations, the packaged devices may be separated using conventional techniques. The removal of the tie bars can be accomplished by any suitable technique including, for example, sawing or etching.
Inventors
- 👤 Jaime Bayan
- 👤 Peter Howard Spalding
- 👤 Harry Cheng Hong Kam
- 👤 Ah Lek Hu
- 👤 Sharon Mei Wan Ko
- 👤 Santhiran Nadarajah
- 👤 Aik Seng Kang
- 👤 Yin Yen Bong
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:15
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W74/00; H10W74/10; H10W74/111; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
164 words
A method of packaging integrated circuits comprising: fabricating an array of leadless integrated circuit devices using a conductive substrate panel having a matrix of device areas thereon, each device area including a plurality of contacts formed from the substrate panel and a die, each die being electrically connected to associated contacts within the same device area, wherein the conductive substrate panel further defines a plurality of tie bars that support the contacts during fabrication; molding at least one cap over the substrate, each cap being arranged to encapsulate an array of the device areas, thereby forming a molded substrate structure having an array of packaged devices, wherein molding material used in the molding serves to hold the contacts and die in place relative to one another; and removing at least portions of the tie bars to electrically isolate the contacts from one another after the molding operation while leaving sufficient portions of the molded structure intact to facilitate handling the structure in panel form.
Claim 2
Independent Claim
164 words
A method of packaging integrated circuits comprising: fabricating an array of leadless integrated circuit devices using a conductive substrate panel having a matrix of device areas thereon, each device area including a plurality of contacts formed from the substrate panel and a die, each die being electrically connected to associated contacts within the same device area, wherein the conductive substrate panel further defines a plurality of tie bars that support the contacts during fabrication; molding at least one cap over the substrate, each cap being arranged to encapsulate an array of the device areas, thereby forming a molded substrate structure having an array of packaged devices, wherein molding material used in the molding serves to hold the contacts and die in place relative to one another; and removing at least portions of the tie bars to electrically isolate the contacts from one another after the molding operation while leaving sufficient portions of the molded structure intact to facilitate handling the structure in panel form.
Claim 3
Dependent Claim
16 words
A method as recited in claim 1 further comprising testing the packaged devices in panel form.
Claim 4
Dependent Claim
17 words
A method as recited in claim 2 further comprising singulating the packaged devices after the testing operation.
Claim 5
Dependent Claim
17 words
A method as recited in claim 1 wherein a saw is used to remove the tie bars.
Claim 6
Dependent Claim
18 words
A method as recited in claim 1 wherein an etching operation is used to remove the tie bars.
Claim 7
Independent Claim
168 words
A method of packaging integrated circuits comprising: fabricating an array of integrated circuit devices using a leadless leadframe panel having a matrix of device areas thereon, each device area including a plurality of contacts formed from the leadless leadframe panel and a die, each die being electrically connected to associated contacts within the same device area, wherein the leadless leadframe panel further defines a plurality of tie bars that mechanically support and electrically connect the contacts during fabrication; molding at least one cap over the substrate, each cap being arranged to encapsulate an array of the device areas, thereby forming a molded substrate structure having an array of packaged devices, wherein molding material used in the molding serves to hold the contacts and die in place relative to one another; and removing at least portions of the tie bars to electrically isolate the contacts from one another after the molding operation while leaving sufficient portions of the molded structure intact to facilitate handling the structure in panel form.
Claim 8
Independent Claim
168 words
A method of packaging integrated circuits comprising: fabricating an array of integrated circuit devices using a leadless leadframe panel having a matrix of device areas thereon, each device area including a plurality of contacts formed from the leadless leadframe panel and a die, each die being electrically connected to associated contacts within the same device area, wherein the leadless leadframe panel further defines a plurality of tie bars that mechanically support and electrically connect the contacts during fabrication; molding at least one cap over the substrate, each cap being arranged to encapsulate an array of the device areas, thereby forming a molded substrate structure having an array of packaged devices, wherein molding material used in the molding serves to hold the contacts and die in place relative to one another; and removing at least portions of the tie bars to electrically isolate the contacts from one another after the molding operation while leaving sufficient portions of the molded structure intact to facilitate handling the structure in panel form.
Claim 9
Dependent Claim
16 words
A method as recited in claim 6 further comprising testing the packaged devices in panel form.
Claim 10
Dependent Claim
17 words
A method as recited in claim 7 further comprising singulating the packaged devices after the testing operation.
Claim 11
Dependent Claim
17 words
A method as recited in claim 6 wherein a saw is used to remove the tie bars.
Claim 12
Dependent Claim
18 words
A method as recited in claim 6 wherein an etching operation is used to remove the tie bars.
References Cited (Backward Citations)
GB2059157A
Cited
JPH03108745A
Cited
US5596231A
Cited
US5367196A
Cited
US5623123A
Cited
US5494207A
Cited
US5741729A
Cited
US5656550A
Cited
US5508556A
Cited
JP3108745B2
Cited
US5866948A
Cited
US5854511A
Cited
US5844315A
Cited
US6133070A
Cited
US6013946A
Cited
US5981314A
Cited
US5990545A
Cited
US6060774A
Cited
US6060778A
Cited
US6177288B1
Cited
US6093960A
Cited
US6188130B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-06-03 | 2005-12-03 | 2006-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-06-03 | 2009-12-03 | 2010-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-06-03 | 2013-12-03 | 2014-06-04 | $7700.00 | Window Closed / Lapsed |