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US6340832B2 Expired / Lapsed US ⏱️ 0.0 years remaining

MIM capacitor having reduced capacitance error and phase rotation

Assignee: NEC Electronics Corp
•
Filing: 2001-03-27
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Granted: 2002-01-22
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Expires: 2021-03-27
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Abstract

Abstract An Metal Insulator Metal (MIM) capacitor having improved performance in a high frequency range. The MIM capacitor comprises: a lower electrode; a second insulating film formed on the lower electrode; a capacitor insulating film formed on a portion of the lower electrode; an upper electrode formed on the capacitor insulating film; a third insulating film formed on the second insulating film and the upper electrode; a first lead electrode which connects to a portion of the lower electrode; a second lead electrode which connects to a portion of the upper electrode. The first lead electrode is continuously formed such that the first electrode surrounds at least three sides of the capacitor insulating film, and the width H of the capacitor insulating film and maximum frequency F satisfy the formula: H<(A/F)½, where, A is a predetermined constant determined depending on a structure and manufacturing process of the MIM capacitor to obtain desired admittance characteristics.

Inventors

  • 👤 Tomokazu Kasahara

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 16:54
CPC Classifications
H; H10; H10D; H10D1/00; H10D1/60; H10D1/68; H10D1/682; H10D1/684; H10D84/00; H10D84/201; H10D84/204; H10D84/212

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 282 words
An MIM capacitor for a semiconductor integrated circuit device comprising: a semiconductor substrate; a first insulating film formed on said semiconductor substrate; a lower electrode formed on said first insulating film; a second insulating film formed on said lower electrode; a first opening which penetrates said second insulating film and which reaches said lower electrode; a capacitor insulating film formed on a portion of said lower electrode exposed by said first opening; an upper electrode formed on said capacitor insulating film; a third insulating film formed on said second insulating film and said upper electrode; a second opening which penetrates said second and third insulating films and which reaches said lower electrode; a first lead electrode which fills said second opening, which connects to a portion of said lower electrode exposed via said second opening, and which is drawn out onto the surface of said third insulating film; a third opening which penetrates said third insulating films and which reaches said upper electrode; and a second lead electrode which fills said third opening, which connects to a portion of said upper electrode exposed via said third opening, and which is drawn out onto the surface of said third insulating film; wherein first lead electrode is continuously formed such that said first electrode surrounds at least three sides of said capacitor insulating film, and the width of said capacitor insulating film satisfies the following formula: H<(A/F) ½ where, H designates the width of said capacitor insulating film, A designates a predetermined constant determined depending on a structure and a manufacturing process of said MIM capacitor to obtain desired admittance characteristics, and F designates maximum frequency of a signal used by said MIM capacitor.
Claim 2
Dependent Claim 282 words
An MIM capacitor for a semiconductor integrated circuit device comprising: a semiconductor substrate; a first insulating film formed on said semiconductor substrate; a lower electrode formed on said first insulating film; a second insulating film formed on said lower electrode; a first opening which penetrates said second insulating film and which reaches said lower electrode; a capacitor insulating film formed on a portion of said lower electrode exposed by said first opening; an upper electrode formed on said capacitor insulating film; a third insulating film formed on said second insulating film and said upper electrode; a second opening which penetrates said second and third insulating films and which reaches said lower electrode; a first lead electrode which fills said second opening, which connects to a portion of said lower electrode exposed via said second opening, and which is drawn out onto the surface of said third insulating film; a third opening which penetrates said third insulating films and which reaches said upper electrode; and a second lead electrode which fills said third opening, which connects to a portion of said upper electrode exposed via said third opening, and which is drawn out onto the surface of said third insulating film; wherein first lead electrode is continuously formed such that said first electrode surrounds at least three sides of said capacitor insulating film, and the width of said capacitor insulating film satisfies the following formula: H<(A/F) ½ where, H designates the width of said capacitor insulating film, A designates a predetermined constant determined depending on a structure and a manufacturing process of said MIM capacitor to obtain desired admittance characteristics, and F designates maximum frequency of a signal used by said MIM capacitor.
Claim 3
Dependent Claim 25 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said first lead electrode is a U-shaped electrode.
Claim 4
Dependent Claim 25 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said first lead electrode is a comb-shaped electrode.
Claim 5
Dependent Claim 38 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said first lead electrode is continuously formed such that said first lead electrode surrounds all sides of said capacitor insulating film.
Claim 6
Dependent Claim 39 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said capacitor insulating film is made of a material selected from a group consisting of silicon oxide, silicon oxynitride and silicon nitride.
Claim 7
Dependent Claim 29 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said capacitor insulating film is made of a high dielectric constant material.
Claim 8
Dependent Claim 65 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said capacitor insulating film is made of a material selected from a group consisting of PbZr 1−x Ti x O 3 (0≦x≦1), Pb 1−x La x Zr 1−y Ti y O 3 (0≦x≦1, 0≦y≦1), BaTiO 3 , Ba 1−x Sr x TiO 3 (0≦x≦1), and SrTiO 3 .
Claim 9
Dependent Claim 28 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said lower electrode and said upper electrode are made of polysilicon.
Claim 10
Dependent Claim 38 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said first and second lead electrodes are made of a material selected from a group consisting of aluminum, copper and gold.
Claim 11
Dependent Claim 37 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said first and second insulating films are made of silicon oxide, and said third insulating film is made of tetraethoxyorthosilicate.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2005-01-21 2005-07-23 2006-01-22 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2009-01-21 2009-07-23 2010-01-22 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2013-01-21 2013-07-23 2014-01-22 $7700.00 Window Closed / Lapsed

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