Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
282 words
An MIM capacitor for a semiconductor integrated circuit device comprising: a semiconductor substrate; a first insulating film formed on said semiconductor substrate; a lower electrode formed on said first insulating film; a second insulating film formed on said lower electrode; a first opening which penetrates said second insulating film and which reaches said lower electrode; a capacitor insulating film formed on a portion of said lower electrode exposed by said first opening; an upper electrode formed on said capacitor insulating film; a third insulating film formed on said second insulating film and said upper electrode; a second opening which penetrates said second and third insulating films and which reaches said lower electrode; a first lead electrode which fills said second opening, which connects to a portion of said lower electrode exposed via said second opening, and which is drawn out onto the surface of said third insulating film; a third opening which penetrates said third insulating films and which reaches said upper electrode; and a second lead electrode which fills said third opening, which connects to a portion of said upper electrode exposed via said third opening, and which is drawn out onto the surface of said third insulating film; wherein first lead electrode is continuously formed such that said first electrode surrounds at least three sides of said capacitor insulating film, and the width of said capacitor insulating film satisfies the following formula: H<(A/F) ½ where, H designates the width of said capacitor insulating film, A designates a predetermined constant determined depending on a structure and a manufacturing process of said MIM capacitor to obtain desired admittance characteristics, and F designates maximum frequency of a signal used by said MIM capacitor.
Claim 2
Dependent Claim
282 words
An MIM capacitor for a semiconductor integrated circuit device comprising: a semiconductor substrate; a first insulating film formed on said semiconductor substrate; a lower electrode formed on said first insulating film; a second insulating film formed on said lower electrode; a first opening which penetrates said second insulating film and which reaches said lower electrode; a capacitor insulating film formed on a portion of said lower electrode exposed by said first opening; an upper electrode formed on said capacitor insulating film; a third insulating film formed on said second insulating film and said upper electrode; a second opening which penetrates said second and third insulating films and which reaches said lower electrode; a first lead electrode which fills said second opening, which connects to a portion of said lower electrode exposed via said second opening, and which is drawn out onto the surface of said third insulating film; a third opening which penetrates said third insulating films and which reaches said upper electrode; and a second lead electrode which fills said third opening, which connects to a portion of said upper electrode exposed via said third opening, and which is drawn out onto the surface of said third insulating film; wherein first lead electrode is continuously formed such that said first electrode surrounds at least three sides of said capacitor insulating film, and the width of said capacitor insulating film satisfies the following formula: H<(A/F) ½ where, H designates the width of said capacitor insulating film, A designates a predetermined constant determined depending on a structure and a manufacturing process of said MIM capacitor to obtain desired admittance characteristics, and F designates maximum frequency of a signal used by said MIM capacitor.
Claim 3
Dependent Claim
25 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said first lead electrode is a U-shaped electrode.
Claim 4
Dependent Claim
25 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said first lead electrode is a comb-shaped electrode.
Claim 5
Dependent Claim
38 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said first lead electrode is continuously formed such that said first lead electrode surrounds all sides of said capacitor insulating film.
Claim 6
Dependent Claim
39 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said capacitor insulating film is made of a material selected from a group consisting of silicon oxide, silicon oxynitride and silicon nitride.
Claim 7
Dependent Claim
29 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said capacitor insulating film is made of a high dielectric constant material.
Claim 8
Dependent Claim
65 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said capacitor insulating film is made of a material selected from a group consisting of PbZr 1−x Ti x O 3 (0≦x≦1), Pb 1−x La x Zr 1−y Ti y O 3 (0≦x≦1, 0≦y≦1), BaTiO 3 , Ba 1−x Sr x TiO 3 (0≦x≦1), and SrTiO 3 .
Claim 9
Dependent Claim
28 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said lower electrode and said upper electrode are made of polysilicon.
Claim 10
Dependent Claim
38 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said first and second lead electrodes are made of a material selected from a group consisting of aluminum, copper and gold.
Claim 11
Dependent Claim
37 words
An MIM capacitor for a semiconductor integrated circuit device as set forth in claim 1 , wherein said first and second insulating films are made of silicon oxide, and said third insulating film is made of tetraethoxyorthosilicate.