Patent US6232668B1 successfully refreshed from Google Patents.
US6232668B1
Expired / Lapsed
US
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Semiconductor device of chip-on-chip structure and semiconductor chip for use therein
Assignee: ACHLYS TECHNOLOGIES INC.
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Filing: 2000-01-28
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Granted: 2001-05-15
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Expires: 2020-01-28
Abstract
Abstract A semiconductor chip for use in a semiconductor device of chip-on-chip structure in which a second semiconductor chip is stacked on the semiconductor chip and bonded to a surface of the semiconductor chip. The semiconductor chip includes: chip interconnection portions provided on the surface of the semiconductor chip for electrical connection to the second semiconductor chip; and a shielding conductive portion surrounding the chip interconnection portions and connected to a low impedance portion. The chip interconnection portions may be generally evenly arranged in a bonding surface area of the semiconductor chip onto which the second semiconductor chip is bonded.
Inventors
- 👤 Junichi Hikita
- 👤 Hiroo Mochida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:29
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W20/00; H10W20/40; H10W20/41; H10W20/423; H10W42/00; H10W42/20; H10W42/261; H10W42/263; H10W90/00; H10W90/811; H10W72/01; H10W72/071; H10W72/075; H10W72/251; H10W72/50; H10W72/531; H10W72/536; H10W72/541; H10W72/5445; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/9415; H10W72/951; H10W74/00; H10W90/701; H10W90/721; H10W90/722; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
99 words
A semiconductor chip for use in a semiconductor device of chip-on-chip structure in which a second semiconductor chip is stacked on the semiconductor chip and bonded to a surface of the semiconductor chip, the semiconductor chip comprising: chip interconnection portions extending a first height from the surface of the semiconductor chip for electrical connection to the second semiconductor chip; and a shielding conductive portion that extends, at a second height that is substantially the same as said first height, from the surface of the semiconductor chip as surrounding the chip interconnection portions, and connected to a low impedance portion.
Claim 2
Dependent Claim
99 words
A semiconductor chip for use in a semiconductor device of chip-on-chip structure in which a second semiconductor chip is stacked on the semiconductor chip and bonded to a surface of the semiconductor chip, the semiconductor chip comprising: chip interconnection portions extending a first height from the surface of the semiconductor chip for electrical connection to the second semiconductor chip; and a shielding conductive portion that extends, at a second height that is substantially the same as said first height, from the surface of the semiconductor chip as surrounding the chip interconnection portions, and connected to a low impedance portion.
Claim 3
Dependent Claim
36 words
A semiconductor chip as set forth in claim 1 , wherein the chip interconnection portions are generally evenly arranged in a bonding surface area of the semiconductor chip onto which the second semiconductor chip is bonded.
Claim 4
Dependent Claim
37 words
A semiconductor chip as set forth in claim 1 , further comprising dummy bonding portions provided on the surface of the semiconductor chip, the dummy bonding portions not serving for electrical connection to the second semiconductor chip.
Claim 5
Dependent Claim
46 words
A semiconductor chip as set forth in claim 3 , wherein the chip interconnection portions and the dummy bonding portions include metal protuberances formed on the surface of the semiconductor chip, and the metal protuberances are generally evenly arranged on the surface of the semiconductor chip.
Claim 6
Dependent Claim
31 words
A semiconductor chip as set forth in claim 1 , wherein the chip interconnection portions and the shielding conductive portion include metal protuberances formed on the surface of the semiconductor chip.
Claim 7
Dependent Claim
25 words
A semiconductor chip as set forth in claim 1 , wherein the chip interconnection portions and the shielding conductive portion include of the same material.
Claim 8
Dependent Claim
30 words
A semiconductor chip as set forth in claim 1 , wherein the low impedance portion is at least one of the chip interconnection portions which is connected to the ground.
Claim 9
Dependent Claim
28 words
A semiconductor chip as set forth in claim 1 , wherein said shielding conductive portion is a noise shielding portion for shielding noise between said chip interconnection portions.
Claim 10
Dependent Claim
30 words
A semiconductor chip as set forth in claim 8 , wherein said shielding conductive portion is configured as a wall-like shielding interconnection pattern on the surface of said semiconductor chip.
Claim 11
Dependent Claim
114 words
A semiconductor device which includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip and bonded to a surface of the first semiconductor chip, the semiconductor device comprising: chip interconnection portions, each having a first height that extends between opposed surfaces of the first and second semiconductor chips, provided between said opposed surfaces for electrical connection between the first semiconductor chip and second semiconductor chip; and a shielding conductive portion, having a second height that is substantially the same as said first height, provided between the opposed surfaces of the first and second semiconductor chips as surrounding the chip interconnection portions, and connected to a low impedance portion.
Claim 12
Dependent Claim
114 words
A semiconductor device which includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip and bonded to a surface of the first semiconductor chip, the semiconductor device comprising: chip interconnection portions, each having a first height that extends between opposed surfaces of the first and second semiconductor chips, provided between said opposed surfaces for electrical connection between the first semiconductor chip and second semiconductor chip; and a shielding conductive portion, having a second height that is substantially the same as said first height, provided between the opposed surfaces of the first and second semiconductor chips as surrounding the chip interconnection portions, and connected to a low impedance portion.
Claim 13
Dependent Claim
30 words
A semiconductor device as set forth in claim 10 , wherein the chip interconnection portions are generally evenly arranged between the opposed surfaces of the first and second semiconductor chips.
Claim 14
Dependent Claim
42 words
A semiconductor device as set forth in claim 10 , further comprising dummy bonding portions provided between the first semiconductor chip and the second semiconductor chip, the dummy bonding portions not serving for electrical connection between the first and second semiconductor chips.
Claim 15
Dependent Claim
58 words
A semiconductor device as set forth in claim 12 , wherein the chip interconnection portions and the dummy bonding portions include metal protuberances formed on at least one of the opposed surfaces of the first and second semiconductor chips, and the metal protuberances are generally evenly arranged between the opposed surfaces of the first and second semiconductor chips.
Claim 16
Dependent Claim
39 words
A semiconductor device as set forth in claim 10 , wherein the chip interconnection portions and the shielding conductive portion include metal protuberances formed on at least one of the opposed surfaces of the first and second semiconductor chips.
Claim 17
Dependent Claim
26 words
A semiconductor device as set forth in claim 10 , wherein the chip interconnection portions and the shielding conductive portion are composed of the same material.
Claim 18
Dependent Claim
30 words
A semiconductor device as set forth in claim 10 , wherein the low impedance portion is at least one of the chip interconnection portions which is connected to the ground.
Claim 19
Dependent Claim
28 words
A semiconductor device as set forth in claim 10 , wherein said shielding conductive portion is a noise shielding portion for shielding noise between said chip interconnection portions.
Claim 20
Dependent Claim
34 words
A semiconductor device as set forth in claim 17 , wherein said shielding conductive portion is configured as a wall-like shielding interconnection pattern between the opposed surfaces of the first and second semiconductor chips.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-05-14 | 2004-11-13 | 2005-05-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-05-14 | 2008-11-13 | 2009-05-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-05-14 | 2012-11-13 | 2013-05-15 | $7700.00 | Window Closed / Lapsed |