Patent US6199563B1 successfully refreshed from Google Patents.
US6199563B1
Expired / Lapsed
US
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Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
Assignee: Canon Inc
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Filing: 1998-02-18
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Granted: 2001-03-13
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Expires: 2018-02-18
Abstract
Abstract An ultrasonic bath ( 30 ) is arranged below a wafer processing bath ( 10 ). Wafers ( 40 ) are processed while ultrasonic waves are transmitted from the ultrasonic bath ( 30 ) to the wafer processing bath ( 10 ). The wafers ( 40 ) are processed while being entirely dipped into the wafer processing bath ( 10 ) and rotated by wafer rotating rods ( 53 ).
Inventors
- 👤 Fumio Uehara
- 👤 Kiyofumi Sakaguchi
- 👤 Kazutaka Yanagita
- 👤 Masakazu Harada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:39
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0406; H10P72/0411; H10P72/0416; B; B08; B08B; B08B3/00; B08B3/04; B08B3/10; B08B3/12; H10P50/00; H10P50/60; H10P50/64; H10P50/642; H10P50/644; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
102 words
A wafer processing apparatus for processing a wafer by dipping the wafer into a processing solution, comprising: a processing bath having a depth that allows to completely dip the wafer into the processing solution; a wafer rotating mechanism for rotating one or a plurality of wafers held by a wafer holder by using at least one rod member substantially parallel to and apart from an axis shifted from a portion below a barycenter of the one or plurality of wafers, said at least one rod member rotating about the axis; and an ultrasonic generator for generating ultrasonic waves in said processing bath.
Claim 2
Dependent Claim
102 words
A wafer processing apparatus for processing a wafer by dipping the wafer into a processing solution, comprising: a processing bath having a depth that allows to completely dip the wafer into the processing solution; a wafer rotating mechanism for rotating one or a plurality of wafers held by a wafer holder by using at least one rod member substantially parallel to and apart from an axis shifted from a portion below a barycenter of the one or plurality of wafers, said at least one rod member rotating about the axis; and an ultrasonic generator for generating ultrasonic waves in said processing bath.
Claim 3
Dependent Claim
39 words
The apparatus according to claim 1 , wherein said at least one rod member has a diameter much smaller than a diameter of a cylinder virtually formed upon rotation of said at least one rod member about the axis.
Claim 4
Dependent Claim
26 words
The apparatus according to claim 1 , wherein said at least one rod member has a groove which engages with a peripheral portion of the wafer.
Claim 5
Dependent Claim
14 words
The apparatus according to claim 3 , wherein the groove has a V shape.
Claim 6
Dependent Claim
28 words
The apparatus according to claim 1 , wherein a section of said at least one rod member taken along a longitudinal direction thereof has a substantially sine-wave shape.
Claim 7
Dependent Claim
29 words
The apparatus according to claim 1 , wherein a section of said at least one rod member taken along a longitudinal direction thereof has a substantially full-wave rectifying shape.
Claim 8
Dependent Claim
54 words
The apparatus according to claim 1 , wherein said wafer rotating mechanism further comprises a driving force generator arranged outside said processing bath, and a driving force transmission for transmitting a driving force generated by said driving force generator to said at least one rod member and rotating said at least one rod member.
Claim 9
Dependent Claim
33 words
The apparatus according to claim 7 , further comprising a dividing member for dividing an interior of said processing bath into a processing wafer side and a side of said driving force transmission.
Claim 10
Dependent Claim
26 words
The apparatus according to claim 7 , wherein said driving force transmission transmits the driving force generated by said driving force generator through a crank mechanism.
Claim 11
Dependent Claim
19 words
The apparatus according to claim 1 , wherein said processing bath comprises a circulating mechanism having an overflow bath.
Claim 12
Dependent Claim
22 words
The apparatus according to claim 10 wherein said circulating mechanism comprises contamination reducing means for reducing contamination of the wafer by particles.
Claim 13
Dependent Claim
15 words
The apparatus according to claim 11 , wherein said contamination reducing means comprises a filter.
Claim 14
Dependent Claim
25 words
The apparatus according to claim 11 , wherein said contamination reducing means comprises means for adjusting flow of the processing solution in said processing bath.
Claim 15
Dependent Claim
36 words
The apparatus according to claim 1 , wherein said ultrasonic generator comprises an ultrasonic bath and an ultrasonic source, and said processing bath receives ultrasonic waves through an ultrasonic transmitting medium set in said ultrasonic bath.
Claim 16
Dependent Claim
28 words
The apparatus according to claim 1 , further comprising a driving mechanism for changing a relative positional relationship between said ultrasonic source and a wafer to be processed.
Claim 17
Dependent Claim
19 words
The apparatus according to claim 15 , wherein said driving mechanism moves said ultrasonic source within said ultrasonic bath.
Claim 18
Dependent Claim
47 words
The apparatus according to claim 1 , wherein at least portions of a constituent members of said processing bath and said wafer rotating mechanism which may come into contact with the processing solution are made of one material selected from the group consisting of quartz and plastic.
Claim 19
Dependent Claim
55 words
The apparatus according to claim 1 , wherein at least portions of constituent members of said processing bath and said wafer rotating mechanism which may come into contact with the processing solution are made of one material selected from the group consisting of a fluorine resin, vinyl chloride, polyethylene, polypropylene, polybutyleneterephthalate (PBT), and polyetheretherketone (PEEK).
Claim 20
Dependent Claim
53 words
A method of processing a wafer, while supplying ultrasonic waves to the wafer with the wafer processing apparatus of claim 1 , the method comprising: processing the wafer while entirely dipping the wafer into a processing solution in the processing bath, and rotating and vertically moving the wafer by the wafer rotating mechanism.
Claim 21
Dependent Claim
21 words
The method according to claim 19 , wherein the wafer is cleaned using a wafer cleaning solution as the processing solution.
Claim 22
Dependent Claim
21 words
The method according to claim 19 , wherein the wafer is etched using a wafer etching solution as the processing solution.
Claim 23
Dependent Claim
32 words
The method according to claim 19 , wherein a porous silicon layer of a wafer having said porous silicon layer is etched using a porous silicon etching solution as the processing solution.
Claim 24
Dependent Claim
80 words
The method according to claim 19 , wherein a porous silicon layer of a wafer having said porous silicon layer is etched using, as the processing solution: hydrofluoric acid, a solution mixture prepared by adding at least one of alcohol and hydrogen peroxide to hydrofluoric acid, a buffered hydrofluoric acid, a solution mixture prepared by adding at least one of alcohol and hydrogen peroxide to buffered hydrofluoric acid, or a solution mixture of hydrofluoric acid, nitric acid, and acetic acid.
References Cited (Backward Citations)
US3964957A
Cited
JPS53144265A
Cited
US4325394A
Cited
US4736760A
Cited
JPS62283632A
Cited
US4804007A
Cited
EP0319806A1
Cited
JPH01187931A
Cited
US4854337A
Cited
JPH01304733A
Cited
JPH03121925A
Cited
JPH03257826A
Cited
US5286657A
Cited
JPH05243203A
Cited
US5327921A
Cited
JPH07142439A
Cited
US5672212A
Cited
US5593537A
Cited
JPH08117702A
Cited
JPH08293478A
Cited
US5593505A
Cited
JPH0938079A
Cited
JPH0938080A
Cited
US5727582A
Cited
US5791357A
Cited
US5816274A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-03-12 | 2004-09-11 | 2005-03-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-03-12 | 2008-09-11 | 2009-03-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-03-12 | 2012-09-11 | 2013-03-13 | $7700.00 | Window Closed / Lapsed |