Patent US6184465B1 successfully refreshed from Google Patents.
US6184465B1
Expired / Lapsed
US
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Semiconductor package
Assignee: Micron Technology Inc
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Filing: 1998-11-12
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Granted: 2001-02-06
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Expires: 2018-11-12
Abstract
Abstract A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom surface of the substrate. Each semiconductor die is electrically connected to the substrate by electrical connections which extend from bond pads on the semiconductor die to corresponding bond pads on the substrate. An encapsulant is formed over each segment and contains grooves which correspond to the grooves of the substrate. Break points are thus formed at the grooves to permit the segments to be easily detached from the substrate to form individual integrated circuits.
Inventors
- 👤 David J. Corisis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:15
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10P; H10P54/00; H10P72/00; H10P72/70; H10P72/74; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W74/01; H10W74/014; H10W74/016; H10W74/117; H10W99/00; H10W70/62; H10W70/65; H10W70/654; H10W70/656; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/536; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
99 words
A semiconductor package, comprising: a substrate having a top surface and a bottom surface; a plurality of first grooves formed in at least a portion of the bottom surface, the plurality of first grooves dividing the substrate into a plurality of segments; a plurality of semiconductor dice bonded to the top surface, each of the plurality of semiconductor dice being positioned in one of the plurality of segments; an encapsulant formed onto each of the plurality of semiconductor dice; and a plurality of second grooves formed in the encapsulant to be substantially aligned with the plurality of first grooves.
Claim 2
Dependent Claim
99 words
A semiconductor package, comprising: a substrate having a top surface and a bottom surface; a plurality of first grooves formed in at least a portion of the bottom surface, the plurality of first grooves dividing the substrate into a plurality of segments; a plurality of semiconductor dice bonded to the top surface, each of the plurality of semiconductor dice being positioned in one of the plurality of segments; an encapsulant formed onto each of the plurality of semiconductor dice; and a plurality of second grooves formed in the encapsulant to be substantially aligned with the plurality of first grooves.
Claim 3
Dependent Claim
14 words
The semiconductor package of claim 1 , wherein the substrate is formed from ceramic.
Claim 4
Dependent Claim
17 words
The semiconductor package of claim 1 , wherein the encapsulant is formed from a bismaleimide triazine resin.
Claim 5
Dependent Claim
20 words
The semiconductor package of claim 1 , wherein the plurality of first and second grooves are formed at an angle.
Claim 6
Dependent Claim
24 words
The semiconductor package of claim 1 , wherein the package is one of a ball grid array and a fine-pitched ball grid array package.
Claim 7
Dependent Claim
19 words
The semiconductor package of claim 1 , wherein the plurality of semiconductor dice are electrically connected to the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-02-06 | 2004-08-07 | 2005-02-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-02-06 | 2008-08-07 | 2009-02-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-02-06 | 2012-08-07 | 2013-02-06 | $7700.00 | Window Closed / Lapsed |