US6163062A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device having a metallic fuse member and cutting method thereof with laser light
Assignee: Renesas Electronics Corp
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Filing: 1998-05-04
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Granted: 2000-12-19
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Expires: 2018-05-04
Abstract
Abstract A semiconductor device has a plurality of fuse members (1a, 1b) composed of a metal that can be cut by laser light (4), disposed over a semiconductor substrate (5). The length L of the fuse members (1a, 1b) is smaller than a value obtained by subtracting an alignment error α of the laser light (4) from a spot diameter D of the laser light (4), i.e., the value (D-α). The fuse members (1a, 1b) are spaced a distance l larger than a value obtained by adding the alignment error α to the half of the spot diameter D, i.e., the value (D/2+α).
Inventors
- 👤 Shigeru Shiratake
- 👤 Hideki Genjo
- 👤 Yasuhiro Ido
- 👤 Atsushi Hachisuka
- 👤 Koji Taniguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 13:35
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W20/493; H10W20/494; H10W20/01; H10W20/031; H10W20/064; H10W20/065
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
134 words
A semiconductor device comprising: a semiconductor substrate; a pair of non-metallic conductive members disposed on said semiconducting substrate; first to Nth (N≧2) metal wiring layers stacked through interlayer insulating film upward in sequence over said semiconductor substrate and said pair of non-metallic conductive members; at least one fuse member formed by said (N-1)th metal wiring layer, said at least one fuse member having ends electrically connected to said pair of non-metallic conductive members through contact holes, said at least one fuse member having a total length L and being cuttable by a laser light having a spot diameter D and an alignment error α; and an insulating layer disposed over said Nth metal wiring layer, said insulating layer including an opening having a diameter S directly above said fuse member, wherein L≦D-α, and S≧L.
Claim 2
Dependent Claim
134 words
A semiconductor device comprising: a semiconductor substrate; a pair of non-metallic conductive members disposed on said semiconducting substrate; first to Nth (N≧2) metal wiring layers stacked through interlayer insulating film upward in sequence over said semiconductor substrate and said pair of non-metallic conductive members; at least one fuse member formed by said (N-1)th metal wiring layer, said at least one fuse member having ends electrically connected to said pair of non-metallic conductive members through contact holes, said at least one fuse member having a total length L and being cuttable by a laser light having a spot diameter D and an alignment error α; and an insulating layer disposed over said Nth metal wiring layer, said insulating layer including an opening having a diameter S directly above said fuse member, wherein L≦D-α, and S≧L.
Claim 3
Dependent Claim
8 words
The semiconductor device of claim 1, wherein S>2L.
Claim 4
Dependent Claim
10 words
The semiconductor device of claim 1, wherein N is 2.
Claim 5
Dependent Claim
8 words
The semiconductor device of claim 1, wherein N≧3.
Claim 6
Dependent Claim
23 words
The semiconductor device of claim 4, wherein said (N-1)th metal wiring layer form a stacked-via type structure with an (N-2)th metal wiring layer.
Claim 7
Dependent Claim
44 words
The semiconductor device of claim 1, wherein said at least one fuse member comprises a first fuse member and a second fuse member adjacent to said first fuse member, said first and second fuse members being spaced apart by a distance l, wherein (D/2)+α≦l.
Claim 8
Dependent Claim
141 words
A semiconductor device comprising: a semiconductor substrate; a pair of non-metallic conductive members disposed on said semiconducting substrate; first to Nth (N≧3) metal wiring layers stacked through interlayer insulation films upward in sequence over said semiconductor substrate, said first to Nth metal wiring layers being disposed over said pair of non-metallic conductive members; a fuse member formed by an (N-2)th metal wiring layer, said fuse member having ends electrically connected to said pair of non-metallic conductive members through contact holes, said fuse member having a total length L and being cuttable by a laser light having a spot diameter D and an alignment error α; and an opening having a diameter M provided in one of said interlayer insulation films between said Nth metal wiring layer and said (N-1)th metal wiring layer, directly above said fuse member, wherein L≦D-α, and M≧2L.
Claim 9
Dependent Claim
141 words
A semiconductor device comprising: a semiconductor substrate; a pair of non-metallic conductive members disposed on said semiconducting substrate; first to Nth (N≧3) metal wiring layers stacked through interlayer insulation films upward in sequence over said semiconductor substrate, said first to Nth metal wiring layers being disposed over said pair of non-metallic conductive members; a fuse member formed by an (N-2)th metal wiring layer, said fuse member having ends electrically connected to said pair of non-metallic conductive members through contact holes, said fuse member having a total length L and being cuttable by a laser light having a spot diameter D and an alignment error α; and an opening having a diameter M provided in one of said interlayer insulation films between said Nth metal wiring layer and said (N-1)th metal wiring layer, directly above said fuse member, wherein L≦D-α, and M≧2L.
Claim 10
Dependent Claim
33 words
The semiconductor device of claim 7, further comprising an insulating layer disposed over said Nth metal wiring layer and including an opening having a diameter S directly above said fuse member, wherein S>M.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-12-19 | 2004-06-19 | 2004-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-12-19 | 2008-06-19 | 2008-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-12-19 | 2012-06-19 | 2012-12-19 | $7700.00 | Window Closed / Lapsed |