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US6160705A
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Ball grid array package and method using enhanced power and ground distribution circuitry
Assignee: Texas Instruments Inc
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Filing: 1998-05-05
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Granted: 2000-12-12
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Expires: 2018-05-05
Abstract
Abstract A structure (10) is provided that is fabricated as a ball grid array substrate that includes a substrate dielectric (14), a power ring (18), a ground ring (20), a plurality of traces, and a second metal layer (16). The substrate dielectric (14) includes a first side, a second side, and a cavity formed therein. The power ring (18), the ground ring (20), and the plurality of traces are provided on the first side of the substrate dielectric (14). The plurality of traces, for example, may include a signal connection (22), a ground connection (24), and a power connection (26). The second metal layer (16) is provided on the second side of the substrate dielectric (14) and is electrically coupled to the first side. For example, the second metal layer (16) may serve as an active ground plane and electrically couple to a variety of ground connections, such as the ground connection (24), and the ground ring (20) through vias in the substrate dielectric (14). The present invention also provides a method for forming a ball grid array package using the structure (10).
Inventors
- 👤 William P. Stearns
- 👤 Nozar Hassanzadeh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 19:54
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W72/00; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/50; H10W72/90; H10W72/931; H10W72/932; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
94 words
A ball grid array substrate package comprising: a substrate dielectric having a first side, a second side, and a cavity formed therein and extending from said first side to said second side; a power ring provided on the first side; a ground ring provided on the first side; a plurality of traces provided on the first side; a solid, contiguous metal layer provided on the second side of the substrate dielectric, the metal layer electrically coupled to the first side; and wherein a semiconductor die is situated in said cavity in said substrate dielectric.
Claim 2
Dependent Claim
94 words
A ball grid array substrate package comprising: a substrate dielectric having a first side, a second side, and a cavity formed therein and extending from said first side to said second side; a power ring provided on the first side; a ground ring provided on the first side; a plurality of traces provided on the first side; a solid, contiguous metal layer provided on the second side of the substrate dielectric, the metal layer electrically coupled to the first side; and wherein a semiconductor die is situated in said cavity in said substrate dielectric.
Claim 3
Dependent Claim
29 words
The ball grid array substrate of claim 1, wherein the metal layer serves as a ground plane and is electrically coupled to the ground ring through a metallized via.
Claim 4
Dependent Claim
28 words
The ball grid array substrate of claim 1, wherein the metal layer serves as a ground plane and is electrically coupled to the ground ring through the cavity.
Claim 5
Dependent Claim
25 words
The ball grid array substrate of claim 1, wherein the metal layer serves as a ground plane and is electrically coupled to the ground ring.
Claim 6
Dependent Claim
48 words
The ball grid array substrate of claim 4, wherein the metal layer that serves as the ground plane is electrically coupled to a finger trace of the plurality of traces to serve as a ground connection and to provide signal isolation between traces of the plurality of traces.
Claim 7
Dependent Claim
60 words
The ball grid array substrate of claim 4, wherein a select number of the plurality of traces serve as ground connections and are electrically coupled to one another on the first side, the select number of the plurality of traces that serve as ground connections are electrically coupled to the metal layer on the second side through a metallized via.
Claim 8
Dependent Claim
31 words
The ball grid array substrate of claim 1, wherein each of the traces of the plurality of traces serve as either a ground connection, a signal connection, or a power connection.
Claim 9
Dependent Claim
29 words
The ball grid array substrate of claim 1, wherein the metal layer serves as a power plane and is electrically coupled to the power ring through a metallized via.
Claim 10
Dependent Claim
28 words
The ball grid array substrate of claim 1, wherein the metal layer serves as a power plane and is electrically coupled to the power ring through the cavity.
Claim 11
Dependent Claim
15 words
The ball grid array substrate of claim 1, wherein the power ring includes extension branches.
Claim 12
Dependent Claim
14 words
The ball grid array substrate of claim 1, wherein the power ring includes segments.
Claim 13
Dependent Claim
46 words
The ball grid array substrate of claim 1, further comprising: an array of solder balls provided on the first side of the substrate dielectric, the array of solder balls coupled to the plurality of traces to provide an external connection to the ball grid array substrate.
Claim 14
Dependent Claim
172 words
A semiconductor package comprising: a heat spreader/stiffener; a ball grid array substrate having a ground ring, a power ring, a plurality of traces, and an array of solder balls on a first side of a substrate dielectric, the array of solder balls coupled to the plurality of traces to provide an external connection to the ball grid array package, the ball grid array substrate having a solid, contiguous metal layer on a second side of the substrate dielectric that is electrically coupled to the first side and is mounted to the heat spreader/stiffener, the substrate dielectric having a cavity formed therein and extending from said first side to said second side; and a die mounted to the heat spreader/stiffener within the cavity of the ball grid array substrate, the die having at least one signal die bond pad coupled to a trace of the plurality of traces, at least one power die bond pad coupled to the power ring, and at least on ground die bond pad coupled to the ground ring.
Claim 15
Dependent Claim
172 words
A semiconductor package comprising: a heat spreader/stiffener; a ball grid array substrate having a ground ring, a power ring, a plurality of traces, and an array of solder balls on a first side of a substrate dielectric, the array of solder balls coupled to the plurality of traces to provide an external connection to the ball grid array package, the ball grid array substrate having a solid, contiguous metal layer on a second side of the substrate dielectric that is electrically coupled to the first side and is mounted to the heat spreader/stiffener, the substrate dielectric having a cavity formed therein and extending from said first side to said second side; and a die mounted to the heat spreader/stiffener within the cavity of the ball grid array substrate, the die having at least one signal die bond pad coupled to a trace of the plurality of traces, at least one power die bond pad coupled to the power ring, and at least on ground die bond pad coupled to the ground ring.
Claim 16
Dependent Claim
27 words
The semiconductor package of claim 13, wherein the metal layer serves as a ground plane and is electrically coupled to the ground ring through a metallized via.
Claim 17
Dependent Claim
26 words
The semiconductor package of claim 13, wherein the metal layer serves as a ground plane and is electrically coupled to the ground ring through the cavity.
Claim 18
Dependent Claim
23 words
The semiconductor package of claim 13, wherein the metal layer serves as a ground plane and is electrically coupled to the ground ring.
Claim 19
Dependent Claim
46 words
The semiconductor package of claim 16, wherein the metal layer that serves as the ground plane is electrically coupled to a finger trace of the plurality of traces to serve as a ground connection and to provide signal isolation between traces of the plurality of traces.
Claim 20
Dependent Claim
29 words
The semiconductor package of claim 13, wherein each of the traces of the plurality of traces serve as either a ground connection, a signal connection, or a power connection.
Claim 21
Dependent Claim
27 words
The semiconductor package of claim 13, wherein the metal layer serves as a power plane and is electrically coupled to the power ring through a metallized via.
Claim 22
Dependent Claim
26 words
The semiconductor package of claim 13, wherein the metal layer serves as a power plane and is electrically coupled to the power ring through the cavity.
Claim 23
Independent Claim
121 words
A method for forming a structure comprising the steps of: providing a substrate having a first metal layer on a first surface of a substrate dielectric and a solid, contiguous second metal layer on a second surface of the substrate dielectric; forming a power ring, a ground ring, and a plurality of traces using the first metal layer, each of the plurality of traces serving as either a ground connection, a signal connection, or a power connection; forming a cavity in the substrate so as to extend from said first surface to said second surface; forming vias that couple portions of the first metal layer to the second metal layer; and placing a semiconductor die in said cavity in said substrate.
Claim 24
Independent Claim
121 words
A method for forming a structure comprising the steps of: providing a substrate having a first metal layer on a first surface of a substrate dielectric and a solid, contiguous second metal layer on a second surface of the substrate dielectric; forming a power ring, a ground ring, and a plurality of traces using the first metal layer, each of the plurality of traces serving as either a ground connection, a signal connection, or a power connection; forming a cavity in the substrate so as to extend from said first surface to said second surface; forming vias that couple portions of the first metal layer to the second metal layer; and placing a semiconductor die in said cavity in said substrate.
Claim 25
Dependent Claim
46 words
The method of claim 21, wherein the forming vias step includes providing metallized vias that electrically couple the ground ring to the second metal layer, and that electrically couple the traces serving as ground connections to the second metal layer that serves as a ground plane.
Claim 26
Dependent Claim
46 words
The method of claim 21, wherein the forming vias step includes providing metallized vias that electrically couple the power ring to the second metal layer, and that electrically couple the traces serving as power connections to the second metal layer that serves as a power plane.
Claim 27
Dependent Claim
23 words
The method of claim 21, further comprising the step of: forming solder balls to attach to select traces of the plurality of traces.
Claim 28
Dependent Claim
57 words
The method of claim 21, including additional steps to form a ball grid array package, the additional steps comprising: mounting the substrate to a heat spreader/stiffener; mounting a die to the heat spreader/stiffener through the cavity in the substrate; and coupling a signal die bond pad of the die to a trace of the plurality of traces.
Claim 29
Dependent Claim
28 words
The method of claim 25, further comprising the steps of: sealing the die cavity; and forming solder balls to attach to select traces of the plurality of traces.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-12-12 | 2004-06-12 | 2004-12-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-12-12 | 2008-06-12 | 2008-12-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-12-12 | 2012-06-12 | 2012-12-12 | $7700.00 | Window Closed / Lapsed |