US6157085A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device for preventing exfoliation from occurring between a semiconductor chip and a resin substrate
Assignee: Citizen Watch Co Ltd
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Filing: 1998-04-07
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Granted: 2000-12-05
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Expires: 2018-04-07
Abstract
Abstract A PBGA-type semiconductor device is comprised such that a semiconductor chip is fixedly attached to the front surface of a resin substrate thereof with the use of an adhesive composed mainly of a resin material. As both the resin substrate and the adhesive are composed mainly of resin materials, adhesion therebetween is excellent, and risk of exfoliation of the semiconductor chip from the resin substrate is eliminated owing to strong bonding therebetween. Furthermore, power-source related connection electrodes are formed so as to be extended to a region where the semiconductor chip is fixedly attached onto the front surface of the resin substrate while an electrically conductive adhesive is used as the adhesive. As a result, the body of the semiconductor chip and the power-source related connection electrodes are rendered to be equal in potential while heat generated in the semiconductor chip can be radiated via the electrically conductive adhesive and the power-source related connection electrodes.
Inventors
- 👤 Kazuhiko Terashima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:12
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W70/654; H10W70/656; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07351; H10W72/07353; H10W72/30; H10W72/321; H10W72/325; H10W72/331; H10W72/334; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
108 words
A semiconductor device comprising: a resin substrate; a semiconductor chip fixedly attached to a front surface of the resin substrate; and plural connection electrodes formed on the front surface of the resin substrate and electrically connected with each electrode of the semiconductor chip by connecting wires, said semiconductor chip being fixedly attached to the front surface of the resin substrate with an adhesive composed of a resin material as the main component thereof and without a die pattern, interposed therebetween, wherein at least corner parts of said semiconductor chip are directly attached to a surface of a resin substrate with an adhesive without a die pattern interposed therebetween.
Claim 2
Dependent Claim
108 words
A semiconductor device comprising: a resin substrate; a semiconductor chip fixedly attached to a front surface of the resin substrate; and plural connection electrodes formed on the front surface of the resin substrate and electrically connected with each electrode of the semiconductor chip by connecting wires, said semiconductor chip being fixedly attached to the front surface of the resin substrate with an adhesive composed of a resin material as the main component thereof and without a die pattern, interposed therebetween, wherein at least corner parts of said semiconductor chip are directly attached to a surface of a resin substrate with an adhesive without a die pattern interposed therebetween.
Claim 3
Dependent Claim
50 words
A semiconductor device according to claim 1, wherein an electrically conductive adhesive is used as said adhesive while a part of power-source related connection electrodes among the plural connection electrodes are extended to a region where the semiconductor chip is fixedly attached onto the front surface of the resin substrate.
Claim 4
Dependent Claim
46 words
A semiconductor device according to claim 2, wherein an insulating resin film is formed in the region where said semiconductor chip being fixedly attached onto the front surface of the resin substrate, excluding areas where said a part of power source related connection electrodes are extended.
Claim 5
Dependent Claim
45 words
A semiconductor device according to claim 2, wherein said power-source related connection electrodes among the plural connection electrodes are formed in a ring-like pattern around the periphery of the region where the semiconductor chip is fixedly attached onto the front surface of the resin substrate.
Claim 6
Dependent Claim
45 words
A semiconductor device according to claim 4, wherein an insulating resin film is formed in the region where said semiconductor chip being fixedly attached onto the front surface of the resin substrate, excluding areas where said a part of power-source related connection electrodes are extended.
Claim 7
Dependent Claim
76 words
A semiconductor device according to claim 1, wherein power source related connection electrodes among the plural connection electrodes are formed in a ring-like pattern around the periphery of the region where the semiconductor chip is fixedly attached onto the front surface of the resin substrate; and an electrically conductive adhesive is used as said adhesive while a region where the electrically conductive adhesive is applied is extended to boundaries adjoining to said power-source related connection electrodes.
Claim 8
Dependent Claim
53 words
A semiconductor device according to claim 1, wherein through holes for heat radiation are defined in the region of the resin substrate where the semiconductor chip is fixedly attached, and a terminal for heat radiation is provided at the openings of the respective through holes, facing the back surface of the resin substrate.
Claim 9
Dependent Claim
53 words
A semiconductor device according to claim 2, wherein through holes for heat radiation are defined in the region of the resin substrate where the semiconductor chip is fixedly attached, and a terminal for heat radiation is provided at the openings of the respective through holes, facing the back surface of the resin substrate.
Claim 10
Dependent Claim
53 words
A semiconductor device according to claim 3, wherein through holes for heat radiation are defined in the region of the resin substrate where the semiconductor chip is fixedly attached, and a terminal for heat radiation is provided at the openings of the respective through holes, facing the back surface of the resin substrate.
Claim 11
Dependent Claim
53 words
A semiconductor device according to claim 4, wherein through holes for heat radiation are defined in the region of the resin substrate where the semiconductor chip is fixedly attached, and a terminal for heat radiation is provided at the openings of the respective through holes, facing the back surface of the resin substrate.
Claim 12
Dependent Claim
53 words
A semiconductor device according to claim 5, wherein through holes for heat radiation are defined in the region of the resin substrate where the semiconductor chip is fixedly attached, and a terminal for heat radiation is provided at the openings of the respective through holes, facing the back surface of the resin substrate.
Claim 13
Dependent Claim
53 words
A semiconductor device according to claim 6, wherein through holes for heat radiation are defined in the region of the resin substrate where the semiconductor chip is fixedly attached, and a terminal for heat radiation is provided at the openings of the respective through holes, facing the back surface of the resin substrate.
References Cited (Backward Citations)
US5001542A
Cited
US5113241A
Cited
US5136365A
Cited
US5350947A
Cited
US5311059A
Cited
US5371404A
Cited
US5739588A
Cited
US5796589A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-12-05 | 2004-06-05 | 2004-12-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-12-05 | 2008-06-05 | 2008-12-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-12-05 | 2012-06-05 | 2012-12-05 | $7700.00 | Window Closed / Lapsed |