Silicon-based strain-symmetrized GE-SI quantum lasers

Claim 2

A laser comprising: (a) a silicon platform; (b) a silicon-germanium graded relaxed buffer layer formed upon said silicon platform; (c) collector means including a highly doped stably strained SiGe or germanium collector layer formed over said silicon-germanium graded relaxed buffer layer; (d) an intrinsic strain-symmetric Ge--Si superlattice positioned over said SiGe or germanium collector layer; (e) emitter means including a heavily doped stably strained SiGe emitter layer positioned over said Ge--Si superlattice; and (f) foward biasing means coupled to said emitter means and said collector means for enabling light production by said laser.

Claim 3

The laser of claim 1 wherein each strain symmetric superlattice period of numerous stacked periods within said superlattice includes a layer of Ge of a thickness of between 8-15 atomic monolayers and a layer of Si having a thickness of between 8-15 atomic monolayers and wherein each Ge layer is in compression and each Si layer is in tension.

Claim 4

The laser of claim 1 wherein said superlattice includes a first silicon layer, in contact with said SiGe collector layer, thin enough for carrier tunnelling from the superlattice to the SiGe collector layer, and a second silicon layer, in contact with said SiGe emitter layer, thin enough for tunneling of carriers from the emitter into the superlattice.

Claim 5

The laser of claim 2 wherein said superlattice includes a first silicon layer, in contact with said SiGe collector layer, thin enough for carrier tunnelling from the superlattice to the SiGe collector layer, and a second silicon layer, in contact with said SiGe emitter layer, thin enough for tunneling of carriers from the emitter into the superlattice.

Claim 6

The laser of claim 1 wherein said silicon-germanium graded relaxed buffer layer is graded up to a maximum of 60 percent Ge.

Claim 7

The laser of claim 2 wherein said silicon-germanium graded relaxed buffer layer is graded up to a maximum of 60 percent Ge.

Claim 8

The laser of claim 3 wherein said silicon-germanium graded relaxed buffer layer is graded up to a maximum of 60 percent Ge.

Claim 9

The laser of claim 4 wherein said silicon-germanium graded relaxed buffer layer is graded up to a maximum of 60 percent Ge.

Claim 10

The laser of claim 1 wherein said silicon-germanium relaxed buffer layer has a thickness of between 1-2 microns.

Claim 11

The laser of claim 2 wherein said silicon-germanium relaxed buffer layer has a thickness of between 1-2 microns.

Claim 12

The laser of claim 3 wherein said silicon-germanium relaxed buffer layer has a thickness of between 1-2 microns.

Claim 13

The laser of claim 4 wherein said silicon-germanium relaxed buffer layer has a thickness of between 1-2 microns.

Claim 14

The laser of claim 1 wherein said heavily doped Si--Ge emitter layer has a thickness of less than 20 nanometers.

Claim 15

The laser of claim 2 wherein said heavily doped Si--Ge emitter layer has a thickness of less than 20 nanometers.

Claim 16

The laser of claim 3 wherein said heavily doped Si--Ge emitter layer has a thickness of less than 20 nanometers.

Claim 17

A laser comprising: (a) a silicon platform; (b) a silicon-germanium or germanium graded relaxed buffer layer formed upon said silicon platform; (c) silicon-germanium or germanium stably strained collector means formed over said graded relaxed buffer layer; (d) an intrinsic strain-symmetric Ge--Si superlattice positioned over said germanium collector layer; (e) emitter means including a stably strained SiGe emitter layer positioned over said Ge--Si superlattice; and (f) foward biasing means coupled to said emitter means and said collector means for enabling light production by said laser.

Claim 18

A laser comprising: (a) a silicon platform; (b) a silicon-germanium or germanium graded relaxed buffer layer formed upon said silicon platform; (c) silicon-germanium or germanium stably strained collector means formed over said graded relaxed buffer layer; (d) an intrinsic strain-symmetric Ge--Si superlattice positioned over said germanium collector layer; (e) emitter means including a stably strained SiGe emitter layer positioned over said Ge--Si superlattice; and (f) foward biasing means coupled to said emitter means and said collector means for enabling light production by said laser.

Claim 19

The laser of claim 16 wherein each strain symmetric superlattice period of numerous stacked periods within said superlattice includes a layer of Ge of a thickness of between 8-15 atomic monolayers and a layer of Si having a thickness of between 8-15 atomic monolayers and wherein each Ge layer is in compression and each Si layer is in tension.

Claim 20

The laser of claim 16 wherein said superlattice includes a first silicon layer, in contact with said collector means, thin enough for carrier tunnelling from the superlattice to the collector means, and a second silicon layer, in contact with said emitter layer, thin enough for tunneling of carriers from the emitter into the superlattice.

Claim 21

The laser of claim 17 wherein said superlattice includes a first silicon layer, in contact with said collector means, thin enough for carrier tunnelling from the superlattice to the collector means, and a second silicon layer, in contact with said emitter layer, thin enough for tunneling of carriers from the emitter into the superlattice.

Claim 22

The laser of claim 16 wherein said silicon-germanium graded relaxed buffer layer is graded up to a maximum of 60 percent Ge.

Claim 23

The laser of claim 17 wherein said silicon-germanium graded relaxed buffer layer is graded up to a maximum of 60 percent Ge.

Claim 24

The laser of claim 18 wherein said silicon-germanium graded relaxed buffer layer is graded up to a maximum of 60 percent Ge.

Claim 25

The laser of claim 19 wherein said silicon-germanium graded relaxed buffer layer is graded up to a maximum of 60 percent Ge.

Claim 26

The laser of claim 23 wherein said silicon-germanium relaxed buffer layer has a thickness of between 1-2 microns.

Claim 27

A laser comprising: (a) a silicon platform; (b) a silicon-germanium graded relaxed buffer layer formed upon said silicon platform; (c) carrier emitter means and carrier collector means supported by said graded relaxed buffer layer; (d) an intrinsic strain-symmetric Ge--Si superlattice positioned between said carrier emitter means and said carrier collector means and wherein each strain symmetric superlattice period of numerous stacked periods within said superlattice includes a layer of Ge of a thickness of between 8-15 atomic monolayers and a layer of Si having a thickness of between 8-15 atomic monolayers and wherein each Ge monolayer is in compression and each Si monolayer is in tension; and (e) electrical biasing means coupled to said emitter means and said collector means for enabling light production by said laser.

Claim 28

A laser comprising: (a) a silicon platform; (b) a silicon-germanium graded relaxed buffer layer formed upon said silicon platform; (c) carrier emitter means and carrier collector means supported by said graded relaxed buffer layer; (d) an intrinsic strain-symmetric Ge--Si superlattice positioned between said carrier emitter means and said carrier collector means and wherein each strain symmetric superlattice period of numerous stacked periods within said superlattice includes a layer of Ge of a thickness of between 8-15 atomic monolayers and a layer of Si having a thickness of between 8-15 atomic monolayers and wherein each Ge monolayer is in compression and each Si monolayer is in tension; and (e) electrical biasing means coupled to said emitter means and said collector means for enabling light production by said laser.

Claim 29

The laser of claim 25 wherein said superlattice includes a first silicon layer, in contact with said collector means, thin enough for carrier tunnelling from the superlattice to the collector means and a second silicon layer, in contact with said emitter means, thin enough for tunneling of carriers from the emitter means into the superlattice.