US6150221A
Expired / Lapsed
US
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Semiconductor device and method for manufacturing same
Assignee: Adeia Semiconductor Advanced Technologies Inc
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Filing: 1998-02-20
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Granted: 2000-11-21
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Expires: 2018-02-20
Abstract
Abstract It is an object of the invention to provide a CMOS device comprising p-channel FETs having shallow source and drain regions and a method for fabricating the same. A B-doped selective epitaxial layer is grown only on an area, where the source and drain regions of the p-channel FET is to be formed. Growth of the B-doped selective epitaxial layer on an area, where the source and drain regions of a n-channel FET is to be formed, is impeded by forming a amorphous region on the area corresponding to the n-channel FET.
Inventors
- 👤 Tohru Aoyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 01:53
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/0165; H10D30/00; H10D30/01; H10D30/021; H10D30/027; H10D30/0275; H10D84/017; H10D84/0172; H10D84/0177; H10D84/02; H10D84/03; H10D84/038; H10P; H10P14/00; H10P14/20; H10P14/24; H10P14/29; H10P14/2901; H10P14/2902; H10P14/2905; H10P14/34; H10P14/3402; H10P14/3404; H10P14/3411; H10P14/3438; H10P14/3441; H10P14/3444
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
141 words
A method for fabricating a CMOS device comprising: forming an insulator layer on a surface of a substrate, forming gate electrodes on said insulator layer, forming side walls surrounding said gate electrodes, exposing only areas surrounding said gate electrodes on said surface of said substrate, where n-type ions are to be implanted, by processing photoresist, implanting said n-type impurity ions on said exposed areas on said surface of said substrate, amorphizing said exposed areas on said surface of said substrate to inhibit growth of p-type impurity doped epitaxial layers, growing p-type impurity doped selective epitaxial layers on areas surrounding said side walls on said surface of said substrate, where p-type impurity ions are to be doped, and forming source and drain regions by diffusing said p-type impurity into said surface of said substrate from said p-type impurity doped selective epitaxial layer.
Claim 2
Independent Claim
141 words
A method for fabricating a CMOS device comprising: forming an insulator layer on a surface of a substrate, forming gate electrodes on said insulator layer, forming side walls surrounding said gate electrodes, exposing only areas surrounding said gate electrodes on said surface of said substrate, where n-type ions are to be implanted, by processing photoresist, implanting said n-type impurity ions on said exposed areas on said surface of said substrate, amorphizing said exposed areas on said surface of said substrate to inhibit growth of p-type impurity doped epitaxial layers, growing p-type impurity doped selective epitaxial layers on areas surrounding said side walls on said surface of said substrate, where p-type impurity ions are to be doped, and forming source and drain regions by diffusing said p-type impurity into said surface of said substrate from said p-type impurity doped selective epitaxial layer.
Claim 3
Dependent Claim
17 words
A method for fabricating a CMOS device according to claim 1, wherein; said substrate is a Si-substrate.
Claim 4
Dependent Claim
17 words
A method for fabricating a CMOS device according to claim 2, wherein; said p-type impurity is boron.
Claim 5
Dependent Claim
35 words
A method for fabricating a CMOS device according to claim 3, wherein; said steps of growing said B-doped selective epitaxial layer is carried out at such a low temperature that amorphized regions are not crystallized.
Claim 6
Dependent Claim
30 words
A method for fabricating a CMOS device according to claim 3, wherein; said steps of growing B-doped selective epitaxial layer is carried out at a temperature lower than 500° C.
Claim 7
Dependent Claim
31 words
A method for fabricating a CMOS device according to claim 3, wherein; said step of growing said B-doped epitaxial layer is carried out by doping said B-doped epitaxial layer with Ge.
Claim 8
Dependent Claim
29 words
A method for fabricating a CMOS device according to claim 1, wherein; said step of amorphizing is carried out by implanting Si or Ge ions on said exposed areas.
Claim 9
Dependent Claim
39 words
A method for fabricating a CMOS device according to claim 1, wherein; said step of amorphizing is carried out by implanting P or As ions on said exposed areas at dose amount higher than 1×10 15 /cm 2 .
Claim 10
Independent Claim
139 words
A method for fabricating a CMOS device comprising: forming an insulator layer on a surface of a substrate, forming gate electrodes on said insulator layer, forming side walls surrounding said gate electrodes, exposing only areas surrounding said gate electrodes on said surface of said substrate, where n-type impurity ions are to be implanted, by processing photoresists, implanting n-type impurity ions on said exposed areas, introducing dry etching defects to said exposed areas on said surface of said substrate to inhibit growth of p-type impurity doped epitaxial layers, growing p-type impurity doped selective epitaxial layers on areas surrounding said side walls on said surface of said substrate, where p-type impurity ions are to be doped, and forming source and drain regions by diffusing said p-type impurity into said surface of said substrate from said p-type impurity doped selective epitaxial layers.
Claim 11
Independent Claim
139 words
A method for fabricating a CMOS device comprising: forming an insulator layer on a surface of a substrate, forming gate electrodes on said insulator layer, forming side walls surrounding said gate electrodes, exposing only areas surrounding said gate electrodes on said surface of said substrate, where n-type impurity ions are to be implanted, by processing photoresists, implanting n-type impurity ions on said exposed areas, introducing dry etching defects to said exposed areas on said surface of said substrate to inhibit growth of p-type impurity doped epitaxial layers, growing p-type impurity doped selective epitaxial layers on areas surrounding said side walls on said surface of said substrate, where p-type impurity ions are to be doped, and forming source and drain regions by diffusing said p-type impurity into said surface of said substrate from said p-type impurity doped selective epitaxial layers.
Claim 12
Dependent Claim
17 words
A method for fabricating a CMOS device according to claim 9, wherein; said substrate is a Si-substrate.
Claim 13
Dependent Claim
17 words
A method for fabricating a CMOS device according to claim 10, wherein; said p-type impurity is boron.
Claim 14
Dependent Claim
26 words
A method for fabricating a CMOS device according to claim 11, wherein; said B-doped selective epitaxial layer is grown at a temperature lower than 700° C.
Claim 15
Dependent Claim
34 words
A method for fabricating a CMOS device according to claim 9, wherein; said step of growing selective epitaxial layers is carried out at such a low temperature that dry etching defects are not crystallized.
Claim 16
Independent Claim
115 words
A method of fabricating a semiconductor device, comprising: forming gate electrodes with corresponding insulating side walls and insulating portions for at least one n-type FET and for at least one p-type FET; selectively implanting n-type impurities in a first subset of source/drain regions corresponding to said at least one n-type FET; selectively treating said first subset of source/drain regions to inhibit growth of a semiconductor layer containing p-type impurities; selectively growing said layer containing p-type impurities on a second subset of source/drain regions corresponding to said at least one p-type FET, wherein said layer does not grow on said first region; and causing p-type impurities to be diffused into said second subset of source/drain regions.
Claim 17
Independent Claim
115 words
A method of fabricating a semiconductor device, comprising: forming gate electrodes with corresponding insulating side walls and insulating portions for at least one n-type FET and for at least one p-type FET; selectively implanting n-type impurities in a first subset of source/drain regions corresponding to said at least one n-type FET; selectively treating said first subset of source/drain regions to inhibit growth of a semiconductor layer containing p-type impurities; selectively growing said layer containing p-type impurities on a second subset of source/drain regions corresponding to said at least one p-type FET, wherein said layer does not grow on said first region; and causing p-type impurities to be diffused into said second subset of source/drain regions.
Claim 18
Dependent Claim
17 words
A method, according to claim 14, wherein selectively treating includes amorphizing said first subset of source/drain regions.
Claim 19
Dependent Claim
20 words
A method, according to claim 15, wherein amorphizing said first subset includes implanting at least one of: Si and Ge.
Claim 20
Dependent Claim
20 words
A method, according to claim 16, wherein implanting includes providing a dose of 1×10 15 /cm 2 at 30 keV.
Claim 21
Dependent Claim
20 words
A method, according to claim 15, wherein amorphizing includes implanting additional n-type impurities in said first subset of source/drain regions.
Claim 22
Dependent Claim
21 words
A method, according to claim 14, wherein selectively treating said first subset of source/drain regions includes introducing dry etching defects thereon.
Claim 23
Dependent Claim
26 words
A method, according to claim 14, wherein growing said layer containing p-type impurities includes using an ultrahigh vacuum chemical vapor deposition for epitaxially growing said layer.
Claim 24
Dependent Claim
35 words
A method, according to claim 20, wherein epitaxially growing said layer includes using Si 2 H 6 , GeH 4 , and B 2 H 6 at a temperature of less than 500 degrees centigrade.
Claim 25
Dependent Claim
22 words
A method, according to claim 14, wherein causing p-type impurities to be diffused includes providing a thermal treatment at 900 degrees centigrade.
Claim 26
Dependent Claim
35 words
A method, according to claim 14, wherein said gate electrodes with corresponding side walls and insulating portions are formed on an Si substrate having areas that provide said first and second subsets of source/drain regions.
Claim 27
Dependent Claim
12 words
A method, according to claim 14, wherein said p-type impurity is boron.
Claim 28
Dependent Claim
18 words
A method, according to claim 14, wherein said n-type impurity contains at least one of: P and As.
Claim 29
Dependent Claim
28 words
A method, according to claim 14, further comprising: after causing p-type impurities to be diffused into said second subset of source/drain regions, removing said layer containing p-type impurities.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2003-11-21 | 2004-05-22 | 2004-11-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-11-21 | 2008-05-22 | 2008-11-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-11-21 | 2012-05-22 | 2012-11-21 | $7700.00 | Window Closed / Lapsed |