Package for microwave and mm-wave integrated circuits

Claim 2

An integrated circuit package comprising: a dielectric package substrate having a plurality of conductive transmission lines located thereon; at least one integrated circuit die mounted on a top surface of the dielectric package substrate and electrically connected to at least some of the plurality of conductive transmission lines; a continuous outer dielectric wall sealed to the dielectric package substrate and defining a cavity; at least one conductive transmission line, of the plurality of conductive transmission lines, passing under the outer dielectric wall for carrying a signal of frequency F; at least one inner dielectric wall spaced apart a distance from the outer dielectric wall over the at least one conductive transmission line; the at least one inner dielectric wall being of substantially the same width and height as the outer dielectric wall such that in operation it presents a discontinuity effect substantially the same as a discontinuity effect presented by the outer dielectric wall; a plate sealed to a top of the outer dielectric wall and a top of the inner dielectric wall enclosing the cavity created by the outer dielectric wall creating a hermetic enclosure for the integrated circuit die; and an impedance transformer in the conductive transmission line between the outer dielectric wall and the inner dielectric wall; such that at frequency F, the combination of the inner dielectric wall, the distance between the inner dielectric wall and the outer dielectric wall and the impedance transformer cancel out the discontinuity effect created in the at least one conductive transmission line by the outer dielectric wall.

Claim 3

An integrated circuit package as claimed in claim 1 wherein the impedance transformer comprises a widening of the at least one conductive transmission line.

Claim 4

An integrated circuit package as claimed in claim 2 wherein the widening of the at least one conductive transmission line is a rectangular widening which begins at substantially a midpoint of the at least one inner dielectric wall and ends at substantially a midpoint of the outer dielectric wall.

Claim 5

An integrated circuit package as claimed in claim 1 with the additional features of a ground plane embedded in the dielectric substrate, the outer dielectric wall having a metal top surface, the inner dielectric wall having a metal top surface, the top plate being conductive, at least one plated via extending through each of the outer dielectric wall and the inner dielectric wall at substantially the same distance from the at least one conductive transmission line; whereby the plated vias electrically connect the ground plane to the top plate.

Claim 6

An integrated circuit package as claimed in claim 1 wherein the inner dielectric wall comprises a continuous wall defining an inner cavity.

Claim 7

An integrated circuit package as claimed in claim 1 wherein the integrated circuit is a microwave integrated circuit.

Claim 8

An integrated circuit package as claimed in claim 1 wherein the integrated circuit is a mm-wave integrated circuit.

Claim 9

An integrated circuit package as claimed in claim 1 wherein the dielectric package substrate, the outer dielectric wall and the inner dielectric wall are comprised of ceramic.

Claim 10

An integrated circuit package as claimed in claim 8 wherein the dielectric walls are integrally manufactured with the dielectric package substrate.

Claim 11

An integrated circuit package as claimed in claim 8 wherein the dielectric walls are formed separately from the dielectric package substrate and the dielectric walls are attached to the dielectric package substrate by means of an adhesive.

Claim 12

An integrated circuit package as claimed in claim 1 wherein the wavelength of the signal carried by the at least one conductive transmission line is X and the distance between the inner dielectric wall and the outer dielectic wall is substantially λ/4.

Claim 13

An integrated circuit package as claimed in claim 1 wherein the wavelength of the signal is of microwave or mm-wave frequencies.

Claim 14

An integrated circuit package comprising: a multi-layer dielectric package substrate; the dielectric package substrate having a plurality of conductive transmission lines located thereon at least one ground plane, and a plurality of conductive vias interconnecting at least some of said conductive transmission lines to the ground plane; at least one integrated circuit die mounted on a top surface of the dielectric package substrate and electrically connected to at least some of the plurality of conductive transmission lines; a continuous outer dielectric wall sealed to the dielectric package substrate and defining a cavity; the continuous outer dielectric wall having a conductive top surface; at least one conductive transmission line, of the plurality of conductive transmission lines, passing under the outer dielectric wall for carrying a signal of frequency F; at least one inner dielectric wall spaced apart a distance from the outer dielectric wall over the at least one conductive transmission line; the at least one inner dielectric wall being of substantially the same width and height as the outer dielectric wall such that in operation it presents a discontinuity effect substantially the same as a discontinuity effect presented by the outer dielectric wall, and having a conductive top surface; a conductive plate sealed to the top of the outer dielectric wall and to the top of the inner dielectric wall enclosing the cavity created by the outer dielectric wall and creating a hermetic enclosure for the integrated circuit die; at least one electrical connection means electrically connecting the conductive top plate to the at least one ground plane; and an impedance transformer in the at least one conductive transmission line between the outer dielectric wall and the inner dielectric wall; such that at frequency F, the combination of the inner dielectric wall, the distance between the inner dielectric wall and the outer dielectric wall and the impedance transformer cancel out the discontinuity effect created in the at least one conductive transmission line by the outer dielectric wall.

Claim 15

An integrated circuit package comprising: a multi-layer dielectric package substrate; the dielectric package substrate having a plurality of conductive transmission lines located thereon at least one ground plane, and a plurality of conductive vias interconnecting at least some of said conductive transmission lines to the ground plane; at least one integrated circuit die mounted on a top surface of the dielectric package substrate and electrically connected to at least some of the plurality of conductive transmission lines; a continuous outer dielectric wall sealed to the dielectric package substrate and defining a cavity; the continuous outer dielectric wall having a conductive top surface; at least one conductive transmission line, of the plurality of conductive transmission lines, passing under the outer dielectric wall for carrying a signal of frequency F; at least one inner dielectric wall spaced apart a distance from the outer dielectric wall over the at least one conductive transmission line; the at least one inner dielectric wall being of substantially the same width and height as the outer dielectric wall such that in operation it presents a discontinuity effect substantially the same as a discontinuity effect presented by the outer dielectric wall, and having a conductive top surface; a conductive plate sealed to the top of the outer dielectric wall and to the top of the inner dielectric wall enclosing the cavity created by the outer dielectric wall and creating a hermetic enclosure for the integrated circuit die; at least one electrical connection means electrically connecting the conductive top plate to the at least one ground plane; and an impedance transformer in the at least one conductive transmission line between the outer dielectric wall and the inner dielectric wall; such that at frequency F, the combination of the inner dielectric wall, the distance between the inner dielectric wall and the outer dielectric wall and the impedance transformer cancel out the discontinuity effect created in the at least one conductive transmission line by the outer dielectric wall.

Claim 16

An integrated circuit package as claimed in claim 13 wherein the impedance transformer comprises a widening of the at least one conductive transmission line.

Claim 17

An integrated circuit package as claimed in claim 14 wherein the widening of the at least one conductive transmission line is a rectangular widening which begins at substantially a midpoint of the at least one inner dielectric wall and ends at substantially a midpoint of the outer dielectric wall.

Claim 18

An integrated circuit package as claimed in claim 13 wherein the at least one electrical connection means comprises at least one plated via extending through each of the outer dielectric wall and the inner dielectric wall at substantially the same distance from the at least one conductive transmission line; whereby the plated vias electrically connect the ground plane to the top plate.

Claim 19

An integrated circuit package as claimed in claim 13 wherein the inner dielectric wall comprises a continuous wall defining an inner cavity.

Claim 20

An integrated circuit package as claimed in claim 13 wherein the integrated circuit is a microwave integrated circuit.

Claim 21

An integrated circuit package as claimed in claim 13 wherein the integrated circuit is a mm-wave integrated circuit.

Claim 22

An integrated circuit package as claimed in claim 13 wherein the dielectric package substrate, the outer dielectric wall and the inner dielectric wall are comprised of ceramic.

Claim 23

An integrated circuit package as claimed in claim 20 wherein the dielectric walls are integrally manufactured with the dielectric package substrate.

Claim 24

An integrated circuit package as claimed in claim 20 wherein the dielectric walls are formed separately from the dielectric package substrate and the dielectric walls are attached to the dielectric package substrate by means of an adhesive.

Claim 25

An integrated circuit package as claimed in claim 13 wherein the wavelength of the signal carried by the at least one conductive transmission line is λ and the distance between the inner dielectric wall and the outer dielectic wall is substantially λ/4.

Claim 26

An integrated circuit package as claimed in claim 13 wherein the wavelength of the signal is of microwave or mm-wave frequencies.

Claim 27

An integrated circuit package comprising: a dielectric package substrate having a plurality of conductive transmission lines located thereon; at least two integrated circuits mounted on a top surface of the dielectric package substrate and electrically connected to at least some of the plurality of conductive transmission lines; an continuous outer dielectric wall sealed to the dielectric package substrate and defining a cavity; a second dielectric wall and a third dielectric wall, of substantially the same height and width, such that in operation they present substantially the same discontinuity effect, separating the at least two integrated circuits and spaced apart a distance; the second and third dielectric walls sealing to the outer dielectric wall and the dielectric package substrate and defining a cavity for each of the integrated circuit dies; at least one conductive transmission line passing under the second and third dielectric walls for carrying a signal of frequency F; a plate sealed to a top of the outer dielectric wall, the second dielectric wall and the third dielectric wall creating hermetic enclosures for each of the integrated circuit dies; and an impedance transformer in the at least one conductive transmission line between the second dielectric wall and the third dielectric wall; such that at frequency F, the combination of the third dielectric wall, the distance between the second dielectric wall and the third dielectric wall, and the impedance transformer cancel out the discontinuity effect created by the second dielectric wall in the at least one conductive transmission line.

Claim 28

An integrated circuit package comprising: a dielectric package substrate having a plurality of conductive transmission lines located thereon; at least two integrated circuits mounted on a top surface of the dielectric package substrate and electrically connected to at least some of the plurality of conductive transmission lines; an continuous outer dielectric wall sealed to the dielectric package substrate and defining a cavity; a second dielectric wall and a third dielectric wall, of substantially the same height and width, such that in operation they present substantially the same discontinuity effect, separating the at least two integrated circuits and spaced apart a distance; the second and third dielectric walls sealing to the outer dielectric wall and the dielectric package substrate and defining a cavity for each of the integrated circuit dies; at least one conductive transmission line passing under the second and third dielectric walls for carrying a signal of frequency F; a plate sealed to a top of the outer dielectric wall, the second dielectric wall and the third dielectric wall creating hermetic enclosures for each of the integrated circuit dies; and an impedance transformer in the at least one conductive transmission line between the second dielectric wall and the third dielectric wall; such that at frequency F, the combination of the third dielectric wall, the distance between the second dielectric wall and the third dielectric wall, and the impedance transformer cancel out the discontinuity effect created by the second dielectric wall in the at least one conductive transmission line.

Claim 29

An integrated circuit package as claimed in claim 25 wherein the impedance transformer comprises a widening of the at least one conductive transmission line.

Claim 30

An integrated circuit package as claimed in claim 26 wherein the widening of the at least one conductive transmission line is a rectangular widening which begins at substantially a midpoint of the at least one inner dielectric wall and ends at substantially a midpoint of the outer dielectric wall.

Claim 31

An integrated circuit package as claimed in claim 25 with the additional features of a ground plane embedded in the dielectric substrate, the outer dielectric wall having a metal top surface, the second dielectric wall having a metal top surface, the third dielectric wall having a metal top surface, the top plate being conductive, at least one plated via extending through the outer dielectric wall, at least one plated via extending through each of the second dielectric wall and the third dielectric wall at substantially the same distance from the at least one conductive transmission line; whereby the plated vias electrically connect the ground plane to the top plate.

Claim 32

An integrated circuit package as claimed in claim 25 wherein the integrated circuits are microwave integrated circuits.

Claim 33

An integrated circuit package as claimed in claim 25 wherein the integrated circuits are mm-wave integrated circuits.

Claim 34

An integrated circuit package as claimed in claim 25 wherein the dielectric package substrate, the outer dielectric wall and the second and third dielectric walls are comprised of ceramic.

Claim 35

An integrated circuit package as claimed in claim 31 wherein the dielectric walls are integrally manufactured with the dielectric package substrate.

Claim 36

An integrated circuit package as claimed in claim 31 wherein the dielectric walls are formed separately from the dielectric package substrate and the dielectric walls are attached to the dielectric package substrate by means of an adhesive.

Claim 37

An integrated circuit package as claimed in claim 25 wherein the wavelength of the signal carried by the at least one conductive transmission line is λ and the distance between the inner dielectric wall and the outer dielectic wall is substantially λ/4.

Claim 38

An integrated circuit package as claimed in claim 25 wherein the wavelength of the signal is of microwave or mm-wave frquencies.