US5235208A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package for microwave integrated circuit
Assignee: Mitsubishi Electric Corp
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Filing: 1992-01-13
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Granted: 1993-08-10
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Expires: 2012-01-13
Abstract
Abstract A package for a microwave integrated circuit includes a first dielectric layer having a surface for mounting a microwave integrated circuit on which a transmission line is disposed, a second dielectric layer laminated on the first dielectric layer for surrounding a microwave integrated circuit, a first grounding metal layer on the rear surface of the first dielectric layer, a second grounding metal layer on the second dielectric layer, a first intermediate layer grounding metal on the same plane as the transmission line and forming a co-planar type line with the transmission line, and via holes electrically connecting the intermediate layer grounding metal with the first and second grounding metal layers. Therefore, the transmission line is shielded parallel to the direction of the transmission line. As a result, the spacing of the shielding metal in a cross section perpendicular from the transmission line is reduced, suppressing the inductive component of the package.
Inventors
- 👤 Takayuki Katoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:45
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
180 words
A package for a microwave integrated circuit comprising: a first dielectric layer having opposed front and rear surfaces; a transmission line disposed on said front surface for electrically connecting a microwave integrated circuit disposed on said front surface; a second dielectric layer having opposed front and rear surfaces, said rear surface of said second dielectric layer being disposed on said front surface of said first dielectric layer sandwiching said transmission line, said second dielectric layer including a central aperture for surrounding a microwave integrated circuit disposed on the front surface of said first dielectric layer; a first grounding metal film disposed on said rear surface of said first dielectric layer; a second grounding metal film disposed on said front surface of said second dielectric layer; a first intermediate layer grounding metal film disposed between said front surface of said first dielectric layer and said rear surface of said second dielectric layer, forming a co-planar type line with said transmission line; and via holes electrically connecting said first intermediate layer grounding metal film with said first and second grounding metal films.
Claim 2
Dependent Claim
180 words
A package for a microwave integrated circuit comprising: a first dielectric layer having opposed front and rear surfaces; a transmission line disposed on said front surface for electrically connecting a microwave integrated circuit disposed on said front surface; a second dielectric layer having opposed front and rear surfaces, said rear surface of said second dielectric layer being disposed on said front surface of said first dielectric layer sandwiching said transmission line, said second dielectric layer including a central aperture for surrounding a microwave integrated circuit disposed on the front surface of said first dielectric layer; a first grounding metal film disposed on said rear surface of said first dielectric layer; a second grounding metal film disposed on said front surface of said second dielectric layer; a first intermediate layer grounding metal film disposed between said front surface of said first dielectric layer and said rear surface of said second dielectric layer, forming a co-planar type line with said transmission line; and via holes electrically connecting said first intermediate layer grounding metal film with said first and second grounding metal films.
Claim 3
Dependent Claim
29 words
A package for a microwave integrated circuit in accordance with claim 1 wherein said first and second metal films comprise one of electrolytically plated gold, tungsten, and gold-plated tungsten.
Claim 4
Dependent Claim
29 words
A package for a microwave integrated circuit in accordance with claim 1 wherein said dielectric layer comprises one of ceramic, low temperature firing glass, aluminum nitride, and porous Teflon.
Claim 5
Dependent Claim
40 words
A package for a microwave integrated circuit in accordance with claim 1 including an IC chip bonding part on said first dielectric layer to which a microwave integrated circuit is bonded comprising one of gold-plated titanium and gold-plated aluminum nitride.
Claim 6
Dependent Claim
31 words
A package for a microwave integrated circuit in accordance with claim 1 wherein said second dielectric layer includes metal-plated side walls at the central aperture contacting said second grounding metal film.
Claim 7
Dependent Claim
25 words
A package for a microwave integrated circuit in accordance with claim 1 wherein said via holes electrically connect said first and second grounding metal films.
Claim 8
Dependent Claim
22 words
A package for a microwave integrated circuit in accordance with claim 1 which can be practically used at 18 to 30 GHz.
Claim 9
Dependent Claim
30 words
A package for a microwave integrated circuit in accordance with claim 1 including a plurality of via holes disposed on opposite sides of said transmission line, forming a pseudo-coaxial line.
Claim 10
Dependent Claim
57 words
A package for a microwave integrated circuit in accordance with claim 1 wherein said first intermediate layer grounding metal film and said transmission line have respective widths on the front surface of said first dielectric layer and the width of said intermediate layer grounding metal film is three to five times the width of said transmission line.
Claim 11
Dependent Claim
55 words
A package for a microwave integrated circuit in accordance with claim 1 comprising: a second intermediate layer grounding metal film disposed between said first grounding metal film and said first intermediate layer grounding metal film; and via holes electrically connecting said second intermediate layer grounding metal film to said first and second grounding metal films.
Claim 12
Dependent Claim
32 words
A package for a microwave integrated circuit in accordance with claim 10 wherein said first and second intermediate layer grounding metal films comprises one of electrolytically plated gold, tungsten, and gold-plated tungsten.
Claim 13
Dependent Claim
29 words
A package for a microwave integrated circuit in accordance with claim 10 wherein said dielectric layer comprises one of ceramic, low temperature firing glass, aluminum nitride, and porous Teflon.
Claim 14
Dependent Claim
44 words
A package for a microwave integrated circuit in accordance with claim 10 including an IC chip bonding part on said first dielectric layer to which a microwave integrated circuit is bonded comprising one of titanium mixed with gold and aluminum nitride mixed with gold.
Claim 15
Dependent Claim
31 words
A package for a microwave integrated circuit in accordance with claim 10 wherein said second dielectric layer includes metal-plated side walls at the central aperture contacting said second grounding metal film.
Claim 16
Dependent Claim
25 words
A package for a microwave integrated circuit in accordance with claim 10 wherein said via holes electrically connect said first and second grounding metal films.
Claim 17
Dependent Claim
30 words
A package for a microwave integrated circuit in accordance with claim 10 including a plurality of via holes disposed on opposite sides of said transmission line, forming a pseudo-coaxial line.
Claim 18
Dependent Claim
57 words
A package for a microwave integrated circuit in accordance with claim 10 wherein said first intermediate layer grounding metal film and said transmission line have respective widths on the front surface of said first dielectric layer and the width of said intermediate layer grounding metal film is three to five times the width of said transmission line.
Claim 19
Dependent Claim
55 words
A package for a microwave integrated circuit in accordance with claim 1 comprising: a second intermediate layer grounding metal film disposed between said second grounding metal film and said first intermediate layer grounding metal film; and via holes electrically connecting said second intermediate layer grounding metal film to said first and second grounding metal films.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-09 | 1997-02-08 | 1997-08-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-09 | 2001-02-08 | 2001-08-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-09 | 2005-02-08 | 2005-08-10 | $7700.00 | Window Closed / Lapsed |