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EP0408228A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Ceramic package and component

Assignee: Oxley Developments Co Ltd
•
Filing: 1990-07-02
•
Granted: —
•
Expires: 2010-07-02
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Abstract

Abstract A ceramic package component has a base portion (10) and an upstanding enclosing wall (16) on the base portion (10), the upper surface (18) of the wall (16) being provided with an electrically conductive coating (17) in order to receive a lid sealingly thereon. The electrically conductive coating (17) on the upper surface of the wall (16) is electrically connected to a further conductive coating (21) on the undersurface of the base portion (10) by means of a high density array of conductive vias (22) extending through the wall (16). The inter via spacing between adjacent vias (22) is preferably less than one quarter of the wavelength of the frequency at which the component is to operate.

Inventors

  • 👤 Jeffrey Dr. Chambers
  • 👤 David John Smith

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-03 11:49
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W44/00; H10W44/20; H10W70/67; H10W70/68

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 94 words
A ceramic package component comprising a base portion (10) and an upstanding enclosing wall (16) on the base portion (10), the upper surface (18) of the wall being provided with an electrically conductive coating (17) in order to receive a lid sealingly thereon, characterised in that said electrically conductive coating (11) on the upper surface (18) of the wall is electrically connected to a further conductive coating (21) on the undersurface of the base portion (10) by means of a high density array of conductive vias (22) extending through the height of the wall.
Claim 2
Dependent Claim 94 words
A ceramic package component comprising a base portion (10) and an upstanding enclosing wall (16) on the base portion (10), the upper surface (18) of the wall being provided with an electrically conductive coating (17) in order to receive a lid sealingly thereon, characterised in that said electrically conductive coating (11) on the upper surface (18) of the wall is electrically connected to a further conductive coating (21) on the undersurface of the base portion (10) by means of a high density array of conductive vias (22) extending through the height of the wall.
Claim 3
Dependent Claim 41 words
A ceramic package component as claimed in claim 1, wherein the inter via spacing between adjacent vias (22) in the high density array is less than one quarter of the wavelength of the frequency at which said component is to operate.
Claim 4
Dependent Claim 15 words
A ceramic package comprising a ceramic package component as claimed in claim 1 or 2.

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