Patent US6087718A successfully refreshed from Google Patents.
US6087718A
Expired / Lapsed
US
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Stacking type semiconductor chip package
Assignee: SK Hynix Inc
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Filing: 1997-12-15
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Granted: 2000-07-11
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Expires: 2017-12-15
Abstract
Abstract A stacked-type semiconductor chip package of a lead on chip structure which is modified for stacking chips in the package, including a plurality of leads each having an inner lead portion and an outer lead portion extending from the inner lead portion, a lower semiconductor chip having a plurality of center pads and disposed under the inner lead portion, an upper semiconductor chip having a plurality of side pads and disposed above the inner lead portions, a plurality of side adhesive insulating members inserted between the inner lead portions and each of the upper and lower semiconductor chips, a plurality of wires which provide electrical connection between the pads and the inner lead portions, and a molding body which seals the structure other than the outer lead portions.
Inventors
- 👤 Jae Weon Cho
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:37
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/811; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/30; H10W72/321; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W74/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
150 words
A stacked-type semiconductor chip package comprising: a first chip; a second chip; a plurality of leads positioned between the first and second chips and having first, second and third portions; a plurality of first media connecting the leads to an interface of the first chip; a plurality of second media connecting the third portions of the leads to an interface of the second chip; and a molding body encapsulating the first and second chips, the leads, and the first and second media, wherein the first portions are positioned closer to the interface of the first chip than the second portions, and the third portions are positioned closer to the interface of the second chip than the second portions, wherein the first, second and third portions of the leads extend along different planes, and wherein the first, second and third portions of the leads respectively extend along different but parallel planes.
Claim 2
Dependent Claim
150 words
A stacked-type semiconductor chip package comprising: a first chip; a second chip; a plurality of leads positioned between the first and second chips and having first, second and third portions; a plurality of first media connecting the leads to an interface of the first chip; a plurality of second media connecting the third portions of the leads to an interface of the second chip; and a molding body encapsulating the first and second chips, the leads, and the first and second media, wherein the first portions are positioned closer to the interface of the first chip than the second portions, and the third portions are positioned closer to the interface of the second chip than the second portions, wherein the first, second and third portions of the leads extend along different planes, and wherein the first, second and third portions of the leads respectively extend along different but parallel planes.
Claim 3
Dependent Claim
23 words
The stacked-type semiconductor chip package of claim 1, wherein the first and second chips are attached to the second portions of the leads.
Claim 4
Dependent Claim
22 words
The stacked-type semiconductor chip package of claim 2, further comprising adhesive members for attaching the leads to the first and second chips.
Claim 5
Dependent Claim
26 words
The stacked-type semiconductor chip package of claim 1, wherein the first media connect the first portions of the leads to the interface of the first chip.
Claim 6
Dependent Claim
28 words
The stacked-type semiconductor chip package of claim 1, wherein the interface of the first chip includes first bonding pads positioned at a center portion of the first chip.
Claim 7
Dependent Claim
28 words
The stacked-type semiconductor chip package of claim 1, wherein the interface of the second chip includes second bonding pads positioned at both side portions of the second chip.
Claim 8
Dependent Claim
62 words
The stacked-type semiconductor chip package of claim 1, wherein the first and second chips each have first and second parallel surfaces such that the first surface of the first chip is closest to the second surface of the second chip, and where the first surface of the first chip and the second surface of the second chip are attached to the leads.
Claim 9
Dependent Claim
24 words
The stacked-type semiconductor chip package of claim 1, wherein the first media connect the first chip to a nearest surface of the first portions.
Claim 10
Dependent Claim
24 words
The stacked-type semiconductor chip package of claim 1, wherein the second media connect the second chip to a nearest surface of the third portions.
Claim 11
Dependent Claim
25 words
The package of claim 1, wherein the planes are parallel to a plane defined by at least one surface of the first and second chips.
Claim 12
Dependent Claim
21 words
The package of claim 1, wherein the first and second portions of the leads respectively extend along different but parallel planes.
Claim 13
Dependent Claim
25 words
The package of claim 11, wherein the planes are parallel to a plane defined by at least one surface of the first and second chips.
Claim 14
Dependent Claim
180 words
A stacked-type semiconductor chip package comprising: first and second chips; a plurality of leads positioned between first and second chips and having first and second portions for interfacing with the first and second chips; a plurality of first media connecting the first portions of the leads to an interface of the first chip; and a plurality of second media connecting the second portions of the leads to an interface of the second chip; wherein the first portions are positioned closer to the interface of the first chip than the second portions, and the second portions are positioned closer to the interface of the second chip than the first portions, wherein the first and second portions of the leads extend along different planes, wherein the leads further comprise third portions, the first portions being positioned closer to the interface of the first chip than the third portions, and the second portions being positioned closer to the interface of the second chip than the third portions, and wherein the first and second chips are attached to the third portions of the leads.
Claim 15
Dependent Claim
180 words
A stacked-type semiconductor chip package comprising: first and second chips; a plurality of leads positioned between first and second chips and having first and second portions for interfacing with the first and second chips; a plurality of first media connecting the first portions of the leads to an interface of the first chip; and a plurality of second media connecting the second portions of the leads to an interface of the second chip; wherein the first portions are positioned closer to the interface of the first chip than the second portions, and the second portions are positioned closer to the interface of the second chip than the first portions, wherein the first and second portions of the leads extend along different planes, wherein the leads further comprise third portions, the first portions being positioned closer to the interface of the first chip than the third portions, and the second portions being positioned closer to the interface of the second chip than the third portions, and wherein the first and second chips are attached to the third portions of the leads.
Claim 16
Dependent Claim
28 words
The stacked-type semiconductor chip package recited by claim 13, further comprising: a molding body encapsulating the first and second chips, the leads, and the first and second media.
Claim 17
Dependent Claim
29 words
The stacked-type semiconductor chip package recited by claim 13, further comprising an adhesive insulating layer for attaching the first and second chips to the third portions of the leads.
Claim 18
Dependent Claim
26 words
The stacked-type semiconductor chip package of claim 13, wherein the first media connect the first portions of the leads to the interface of the first chip.
Claim 19
Dependent Claim
28 words
The stacked-type semiconductor chip package of claim 13, wherein the interface of the first chip includes first bonding pads positioned at a center portion of the first chip.
Claim 20
Dependent Claim
28 words
The stacked-type semiconductor chip package of claim 13, wherein the interface of the second chip includes second bonding pads positioned at both side portions of the second chip.
Claim 21
Dependent Claim
62 words
The stacked-type semiconductor chip package of claim 13, wherein the first and second chips each have first and second parallel surfaces such that the first surface of the first chip is closest to the second surface of the second chip, and where the first surface of the first chip and the second surface of the second chip are attached to the leads.
Claim 22
Dependent Claim
24 words
The stacked-type semiconductor chip package of claim 13, wherein the first media connect the first chip to a nearest surface of the first portions.
Claim 23
Dependent Claim
24 words
The stacked-type semiconductor chip package of claim 13, wherein the second media connect the second chip to a nearest surface of the second portions.
Claim 24
Dependent Claim
149 words
A stacked-type semiconductor chip package comprising: a first chip; a second chip; a plurality of leads positioned between the first and second chips and having first, second and third portions; a plurality of first media connecting the leads to an interface of the first chip; a plurality of second media connecting the third portions of the leads to an interface of the second chip; and a molding body encapsulating the first and second chips, the leads, and the first and second media, wherein the first portions are positioned closer to the interface of the first chip than the second portions, and the third portions are positioned closer to the interface of the second chip than the second portions, wherein the first, second and third portions of the leads extend along different planes, and wherein the first and second portions of the leads respectively extend along different but parallel planes.
Claim 25
Dependent Claim
149 words
A stacked-type semiconductor chip package comprising: a first chip; a second chip; a plurality of leads positioned between the first and second chips and having first, second and third portions; a plurality of first media connecting the leads to an interface of the first chip; a plurality of second media connecting the third portions of the leads to an interface of the second chip; and a molding body encapsulating the first and second chips, the leads, and the first and second media, wherein the first portions are positioned closer to the interface of the first chip than the second portions, and the third portions are positioned closer to the interface of the second chip than the second portions, wherein the first, second and third portions of the leads extend along different planes, and wherein the first and second portions of the leads respectively extend along different but parallel planes.
Claim 26
Dependent Claim
153 words
A stacked-type semiconductor chip package comprising: a first chip; a second chip; a plurality of leads positioned between the first and second chips and having first, second and third portions; a plurality of first media connecting the leads to an interface of the first chip; a plurality of second media connecting the third portions of the leads to an interface of the second chip; and a molding body encapsulating the first and second chips, the leads and the first and second media, wherein the first portions are positioned closer to the interface of the first chip than the second portions, and the third portions are positioned closer to the interface of the second chip than the second portions, wherein the first, second and third portions of the leads extend along different planes, and wherein the planes are parallel to a plane defined by at least one surface of the first and second chips.
Claim 27
Dependent Claim
153 words
A stacked-type semiconductor chip package comprising: a first chip; a second chip; a plurality of leads positioned between the first and second chips and having first, second and third portions; a plurality of first media connecting the leads to an interface of the first chip; a plurality of second media connecting the third portions of the leads to an interface of the second chip; and a molding body encapsulating the first and second chips, the leads and the first and second media, wherein the first portions are positioned closer to the interface of the first chip than the second portions, and the third portions are positioned closer to the interface of the second chip than the second portions, wherein the first, second and third portions of the leads extend along different planes, and wherein the planes are parallel to a plane defined by at least one surface of the first and second chips.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-11 | 2004-01-10 | 2004-07-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-11 | 2008-01-10 | 2008-07-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-11 | 2012-01-10 | 2012-07-11 | $7700.00 | Window Closed / Lapsed |