Patent US6081037A successfully refreshed from Google Patents.
US6081037A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor component having a semiconductor chip mounted to a chip mount
Assignee: North Star Innovations Inc
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Filing: 1998-06-22
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Granted: 2000-06-27
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Expires: 2018-06-22
Abstract
Abstract A semiconductor device (30) includes a semiconductor chip (11) flip chip mounted on a substrate (21) and a thermally conductive chip mount (31) mounded on the semiconductor chip (11). The thermally conductive chip mount (31) has a cavity (34) formed therein. The semiconductor chip (11) fits in the cavity (34) and is thermally coupled to the thermally conductive chip mount (31). The thermally conductive chip mount (31) provides a thermal conduction path to dissipate heat generated in the semiconductor chip (11) through its sidewalls (15, 16, 17, 18).
Inventors
- 👤 Tien-Yu Tom Lee
- 👤 James Vernon Hause
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:52
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W74/00; H10W74/10; H10W74/131; H10W74/142; H10W74/15
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
120 words
A semiconductor device, comprising: a semiconductor chin having a first surface, a second surface, and a sidewall; a chip mount having a first surface, a second surface, and a cavity therein, the cavity having an edge coupled to the sidewall of said semiconductor chip, and wherein the cavity in said chip mount extends from the first surface of said chip mount to the second surface of said chip mount; wherein the second surface of said chip mount is substantially coplanar with the second surface of said semiconductor chip; and a substrate having a major surface, wherein the first surface of said semiconductor chip is attached to a first portion of the major surface of said substrate via a solder bump.
Claim 2
Dependent Claim
120 words
A semiconductor device, comprising: a semiconductor chin having a first surface, a second surface, and a sidewall; a chip mount having a first surface, a second surface, and a cavity therein, the cavity having an edge coupled to the sidewall of said semiconductor chip, and wherein the cavity in said chip mount extends from the first surface of said chip mount to the second surface of said chip mount; wherein the second surface of said chip mount is substantially coplanar with the second surface of said semiconductor chip; and a substrate having a major surface, wherein the first surface of said semiconductor chip is attached to a first portion of the major surface of said substrate via a solder bump.
Claim 3
Dependent Claim
23 words
The semiconductor device of claim 1, wherein the edge of the cavity in said chip mount compresses the sidewall of said semiconductor chip.
Claim 4
Dependent Claim
28 words
The semiconductor device of claim 1, wherein the edge of the cavity in said chip mount is coupled to the sidewall of said semiconductor chip via an epoxy.
Claim 5
Dependent Claim
27 words
The semiconductor device of claim 1, wherein the first surface of said chip mount is coupled to a second portion of the major surface of said substrate.
Claim 6
Dependent Claim
26 words
The semiconductor device of claim 1, further comprising a heat spreader overlying the second surface of said semiconductor chip and the second surface of said flag.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-27 | 2003-12-27 | 2004-06-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-27 | 2007-12-27 | 2008-06-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-27 | 2011-12-27 | 2012-06-27 | $7700.00 | Window Closed / Lapsed |