US5521406A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit with improved thermal impedance
Assignee: Texas Instruments Inc
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Filing: 1994-08-31
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Granted: 1996-05-28
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Expires: 2014-08-31
Abstract
Abstract A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active devices have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.
Inventors
- 👤 Hua Q. Tserng
- 👤 Paul Saunier
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 17:51
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/482; H10W20/483; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W44/00; H10W44/20; H10W44/226; H10W44/234; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W90/00; H10W44/203; H10W44/216; H10W44/251; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/531; H10W72/536; H10W72/851; H10W72/874; H10W72/879; H10W72/884; H10W90/20; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
71 words
An integrated circuit, comprising: (a) at least one transistor formed at a frontside surface of a substrate, said at least one transistor comprising an airbridge over said at least one transistor; (b) at least one passive component at said frontside surface; (c) dielectric over said at least one passive component such that a surface of said dielectric is substantially planar with said airbridge; (d) a heatsink in contact with said airbridge.
Claim 2
Dependent Claim
71 words
An integrated circuit, comprising: (a) at least one transistor formed at a frontside surface of a substrate, said at least one transistor comprising an airbridge over said at least one transistor; (b) at least one passive component at said frontside surface; (c) dielectric over said at least one passive component such that a surface of said dielectric is substantially planar with said airbridge; (d) a heatsink in contact with said airbridge.
Claim 3
Dependent Claim
29 words
The circuit of claim 1 further comprising a second integrated circuit having a backside bonded to a backside of said substrate, said backside of said substrate opposite said frontside.
Claim 4
Dependent Claim
18 words
The circuit of claim 2 wherein said backside of said second integrated circuit is covered with a groundplane.
Claim 5
Dependent Claim
19 words
The circuit of claim 2 wherein said second integrated circuit comprises at least one transistor on a frontside surface.
Claim 6
Dependent Claim
28 words
The circuit of claim 2 wherein said backside of said substrate comprises at least one passive component covered with dielectric, said second integrated circuit bonded over said dielectric.
Claim 7
Dependent Claim
21 words
The circuit of claim 1 wherein said frontside surface comprises a recess and at least one passive component in said recess.
Claim 8
Dependent Claim
13 words
The circuit of claim 6 wherein said recess is filled with a dielectric.
Claim 9
Dependent Claim
10 words
The circuit of claim 1 wherein said dielectric is polyimide.
Claim 10
Dependent Claim
17 words
The circuit of claim 1 wherein said at least one passive component is an inverted microstrip line.
Claim 11
Dependent Claim
96 words
An integrated circuit, comprising: (a) at least one transistor formed at a frontside surface of a substrate, said at least one transistor comprising an airbridge over said at least one transistor; (b) at least one transmission line at said frontside surface; (c) polyimide over said at least one transmission line such that a surface of said polyimide is substantially planar with said airbridge; (d) a heatsink in contact with said airbridge; and (e) a conducting via through said substrate coupling said at least one transistor to a bond pad on a backside surface of said substrate.
Claim 12
Dependent Claim
96 words
An integrated circuit, comprising: (a) at least one transistor formed at a frontside surface of a substrate, said at least one transistor comprising an airbridge over said at least one transistor; (b) at least one transmission line at said frontside surface; (c) polyimide over said at least one transmission line such that a surface of said polyimide is substantially planar with said airbridge; (d) a heatsink in contact with said airbridge; and (e) a conducting via through said substrate coupling said at least one transistor to a bond pad on a backside surface of said substrate.
Claim 13
Dependent Claim
16 words
The circuit of claim 10 wherein said at least one transistor is a field effect transistor.
Claim 14
Dependent Claim
16 words
The circuit of claim 10 wherein said at least one transistor is a heterojunction bipolar transistor.
Claim 15
Dependent Claim
17 words
The circuit of claim 10 wherein said at least one transmission line is an inverted microstrip line.
Claim 16
Dependent Claim
29 words
The circuit of claim 10 further comprising a second integrated circuit having a backside bonded to a backside of said substrate, said backside of said substrate opposite said frontside.
Claim 17
Dependent Claim
10 words
The circuit of claim 10 wherein said substrate is GaAs.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-28 | 1999-11-27 | 2000-05-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-28 | 2003-11-27 | 2004-05-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-28 | 2007-11-27 | 2008-05-28 | $7700.00 | Window Closed / Lapsed |