Patent US5295204A successfully refreshed from Google Patents.
Patent US6066512A successfully refreshed from Google Patents.
US6066512A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device, method of fabricating the same, and electronic apparatus
Assignee: Seiko Epson Corp
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Filing: 1999-01-11
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Granted: 2000-05-23
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Expires: 2019-01-11
Abstract
Abstract A method of making semiconductor devices comprising the steps of: preparing non-defective individual film packages having good quality, wherein leads are formed and a semiconductor chip is mounted on each of the film packages; attaching each of the non-defective individual packages to each of mounting portions of a plate; and cutting the plate into separate pieces, each of the separated pieces corresponding to each of the mounting portions on which each of the non-defective individual film packages is mounted.
Inventors
- 👤 Nobuaki Hashimoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:09
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W72/00; H10W72/071; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/701; H10W72/851; H10W72/874; H10W90/00; H10W90/701; H10W90/731; H10W90/736; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24058; Y10T428/24074; Y10T428/24091; Y10T428/24099; Y10T428/24116; Y10T428/24124; Y10T428/2419; Y10T428/24198; Y10T428/24273; Y10T428/24298; Y10T428/24314; Y10T428/24322
Claims Analysis
Total Claims: 44
Claim 1
Independent Claim
137 words
A method of making semiconductor devices, comprising the steps of: preparing non-defective individual film packages having good quality, wherein each of said non-defective individual film packages has a flexible substrate having a front surface on which a wiring pattern in formed and a back surface opposite thereof, and a semiconductor chip having electrodes that are connected to said wiring pattern, said flexible substrate being larger than said semiconductor chip; attaching the back surface of each of said non-defective individual film packages to each of mounting regions of a reinforcing member, said reinforcing member maintaining a planar configuration for said flexible substrate and circumventing said semiconductor chip; and cutting said reinforcing member into separate pieces, each of said separated pieces corresponding to each of said mounting regions on which each of said non-defective individual film packages is mounted.
Claim 2
Independent Claim
137 words
A method of making semiconductor devices, comprising the steps of: preparing non-defective individual film packages having good quality, wherein each of said non-defective individual film packages has a flexible substrate having a front surface on which a wiring pattern in formed and a back surface opposite thereof, and a semiconductor chip having electrodes that are connected to said wiring pattern, said flexible substrate being larger than said semiconductor chip; attaching the back surface of each of said non-defective individual film packages to each of mounting regions of a reinforcing member, said reinforcing member maintaining a planar configuration for said flexible substrate and circumventing said semiconductor chip; and cutting said reinforcing member into separate pieces, each of said separated pieces corresponding to each of said mounting regions on which each of said non-defective individual film packages is mounted.
Claim 3
Dependent Claim
76 words
The method of making semiconductor devices as defined in claim 1, further comprising, before said non-defective individual film packages are prepared, the steps of: mounting said semiconductor chip on each of predetermined areas in a film carrier tape having said wiring pattern formed on each of said predetermined areas, punching out said film carrier tape into individual film packages, and selecting said non-defective individual film packages having good quality from said individual film packages through inspection.
Claim 4
Dependent Claim
46 words
The method of making semiconductor devices a defined in claim 1, wherein, after each of said non-defective individual film packages is attached to each of said mounting regions of said reinforcing member, the subsequent steps are carried out on a production line for P-BGA type packages.
Claim 5
Dependent Claim
46 words
The method of making semiconductor devices as defined in claim 2, wherein, after each of said non-defective individual film packages is attached to each of said mounting regions of said reinforcing member, the subsequent steps are carried out on a production line for P-BGA type packages.
Claim 6
Dependent Claim
54 words
The method of making semiconductor devices as defined in claim 1, after the step of attaching each of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprising the step of forming external electrodes on said wiring pattern.
Claim 7
Dependent Claim
54 words
The method of making semiconductor devices as defined in claim 2, after the step of attaching each of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprising the step of forming external electrodes on said wiring pattern.
Claim 8
Dependent Claim
54 words
The method of making semiconductor devices a defined in claim 3, after the step of attaching each of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprising the step of forming external electrodes on said wiring pattern.
Claim 9
Dependent Claim
60 words
The method of making semiconductor devices as defined in claim 1, wherein a slot is formed along a cutting line for said reinforcing member so as to enclose each of said mounting regions that is supported only by at least one supporting portion; and wherein the step of cutting said reinforcing member is carried out by cutting said supporting portion.
Claim 10
Dependent Claim
60 words
The method of making semiconductor devices as defined in claim 2, wherein a slot is formed along a cutting line for said reinforcing member so as to enclose each of said mounting regions that is supported only by at least one supporting portion; and wherein the step of cutting said reinforcing member is carried out by cutting said supporting portion.
Claim 11
Dependent Claim
60 words
The method of making semiconductor devices as defined in claim 3, wherein a slot is formed along a cutting line for said reinforcing member so as to enclose each of said mounting regions that is supported only by at least one supporting portion; and wherein the step of cutting said reinforcing member is carried out by cutting said supporting portion.
Claim 12
Dependent Claim
60 words
The method of making semiconductor devices as defined in claim 4, wherein a slot is formed along a cutting line for said reinforcing member so as to enclose each of said mounting regions that is supported only by at least one supporting portion; and wherein the step of cutting said reinforcing member is carried out by cutting said supporting portion.
Claim 13
Dependent Claim
59 words
The method of making semiconductor devices as defined in claim 1, after the step of attaching each of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprising the step of attaching a heat spreading member to a region including said semiconductor chip.
Claim 14
Dependent Claim
59 words
The method of making semiconductor devices as defined in claim 2, after the step of attaching each of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprising the step of attaching a heat spreading member to a region including said semiconductor chip.
Claim 15
Dependent Claim
59 words
The method of making semiconductor devices as defined in claim 3, after the step of attaching each of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprising the step of attaching a heat spreading member to a region including said semiconductor chip.
Claim 16
Dependent Claim
59 words
The method of making semiconductor devices as defined in claim 4, after the step of attaching each of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprsing the step of attaching a heat spreading member to a region including said semiconductor chip.
Claim 17
Dependent Claim
59 words
The method of making semiconductor devices as defined in claim 8, after the step of attaching each of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprising the step of attaching a heat spreading member to a region including said semiconductor chip.
Claim 18
Dependent Claim
59 words
The method of making semiconductor devices as defined in claim 9, after the step of attaching said of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprising the step of attaching a heat spreading member to a region including said semiconductor chip.
Claim 19
Dependent Claim
59 words
The method of making semiconductor devices as defined in claim 10, after the step of attaching each of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprising the step of attaching a heat spreading member to a region including said semiconductor chip.
Claim 20
Dependent Claim
59 words
The method of making semiconductor devices as defined in claim 11, after the step of attaching each of said non-defective individual film packages to each of said mounting regions of said reinforcing member, and before the step of cutting said reinforcing member, further comprising the step of attaching a heat spreading member to a region including said semiconductor chip.
Claim 21
Dependent Claim
96 words
The method of making semiconductor devices as defined in claim 12, wherein an edge portion of said heat spreading member is disposed inside said cutting line for said reinforcing member; and wherein in the step of cutting said reinforcing member, both sides of said reinforcing member are clamped by a pair of holding members at the position that is outside said heat spreading member and inside said cutting line for said reinforcing member, enabling the shear force to be applied to said reinforcing member to be cut at the position that is outside said holding members.
Claim 22
Dependent Claim
96 words
The method of making semiconductor devices as defined in claim 13, wherein an edge portion of said heat spreading member is disposed inside said cutting line for said reinforcing member; and wherein in the step of cutting said reinforcing member, both sides of said reinforcing member are clamped by a pair of holding members at the position that is outside said heat spreading member and inside said cutting line for said reinforcing member, enabling the shear force to be applied to said reinforcing member to be cut at the position that is outside said holding members.
Claim 23
Dependent Claim
96 words
The method of making semiconductor devices as defined in claim 14, wherein an edge portion of said heat spreading member is disposed inside said cutting line for said reinforcing member; and wherein in the step of cutting said reinforcing member, both sides of said reinforcing member are clamped by a pair of holding members at the position that is outside said heat spreading member and inside said cutting line for said reinforcing member, enabling the shear force to be applied to said reinforcing member to be cut at the position that is outside said holding members.
Claim 24
Dependent Claim
96 words
The method of making semiconductor devices as defined in claim 15, wherein an edge portion of said heat spreading member is disposed inside said cutting line for said reinforcing member; and wherein in the step of cutting said reinforcing member, both sides of said reinforcing member are clamped by a pair of holding members at the position that is outside said heat spreading member and inside said cutting line for said reinforcing member, enabling the shear force to be applied to said reinforcing member to be cut at the position that is outside said holding members.
Claim 25
Dependent Claim
96 words
The method of making semiconductor devices as defined in claim 16, wherein an edge portion of said heat spreading member is disposed inside said cutting line for said reinforcing member; and wherein in the step of cutting said reinforcing member, both sides of said reinforcing member are clamped by a pair of holding members at the position that is outside said heat spreading member and inside said cutting line for said reinforcing member, enabling the shear force to be applied to said reinforcing member to be cut at the position that is outside said holding members.
Claim 26
Dependent Claim
96 words
The method of making semiconductor devices as defined in claim 17, wherein an edge portion of said heat spreading member is disposed inside said cutting line for said reinforcing member; and wherein in the step of cutting said reinforcing member, both sides of said reinforcing member are clamped by a pair of holding members at the position that is outside said heat spreading member and inside said cutting line for said reinforcing member, enabling the shear force to be applied to said reinforcing member to be cut at the position that is outside said holding members.
Claim 27
Dependent Claim
121 words
The method of making semiconductor devices as defined in claim 16, wherein an outline of said heat spreading member is approximately aligned with an edge of said slot on the side of each of said mounting regions, said heat spreading member being disposed inside a connecting portion in each of said mounting regions connecting with said supporting portion; and wherein in the step of cutting said reinforcing member, both sides of said reinforcing member are clamped by a pair of holding members at the position that is outside said heat spreading member and inside a cutting line for said supporting portion, enabling the shear force to be applied to said supporting portion at the position that is outside said holding members.
Claim 28
Dependent Claim
121 words
The method of making semiconductor devices as defined in claim 17, wherein an outline of said heat spreading member is approximately aligned with an edge of said slot on the side of each of said mounting regions, said heat spreading member being disposed inside a connecting portion in each of said mounting regions connecting with said supporting portion; and wherein in the step of cutting said reinforcing member, both sides of said reinforcing member are clamped by a pair of holding members at the position that is outside said heat spreading member and inside a cutting line for said supporting portion, enabling the shear force to be applied to said supporting portion at the position that is outside said holding members.
Claim 29
Dependent Claim
57 words
The method of making semiconductor devices, as defined in claim 16, wherein said heat spreading member is superposed on said reinforcing member and has a planar configuration to cover said slot, each of said mounting regions, and said supporting portion of said reinforcing member; and wherein said heat spreading member is cut together with said reinforcing member.
Claim 30
Dependent Claim
57 words
The method of making semiconductor devices, as defined in claim 17, wherein said heat spreading member is superposed on said reinforcing member and has a planar configuration to cover said slot, each of said mounting regions, and said supporting portion of said reinforcing member; and wherein said heat spreading member is cut together with said reinforcing member.
Claim 31
Dependent Claim
31 words
The method of making semiconductor devices as defined in claim 28, wherein said heat spreading member and said reinforcing member are provided with convex and concave portions to be engaged mutually.
Claim 32
Dependent Claim
31 words
The method of making semiconductor devices as defined in claim 29, wherein said heat spreading member and said reinforcing member are provided with convex and concave portions to be engaged mutually.
Claim 33
Dependent Claim
13 words
A semiconductor device fabricated by using the method as defined in claim 1.
Claim 34
Dependent Claim
13 words
A semiconductor device fabricated by using the method as defined in claim 2.
Claim 35
Dependent Claim
13 words
A semiconductor device fabricated by using the method as defined in claim 3.
Claim 36
Dependent Claim
13 words
A semiconductor device fabricated by using the method as defined in claim 4.
Claim 37
Dependent Claim
15 words
A circuit board on which is mounted the semiconductor device as defined in claim 32.
Claim 38
Dependent Claim
15 words
A circuit board on which is mounted the semiconductor device as defined in claim 33.
Claim 39
Dependent Claim
15 words
A circuit board on which is mounted the semiconductor device as defined in claim 34.
Claim 40
Dependent Claim
15 words
A circuit board on which is mounted the semiconductor device as defined in claim 35.
Claim 41
Dependent Claim
12 words
An electronic apparatus including the circuit board as defined in claim 36.
Claim 42
Dependent Claim
12 words
An electronic apparatus including the circuit board as defined in claim 37.
Claim 43
Dependent Claim
12 words
An electronic apparatus including the circuit board as defined in claim 38.
Claim 44
Dependent Claim
12 words
An electronic apparatus including the circuit board as defined in claim 39.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-23 | 2003-11-22 | 2004-05-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-23 | 2007-11-22 | 2008-05-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-23 | 2011-11-22 | 2012-05-23 | $7700.00 | Window Closed / Lapsed |