US5804872A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof
Assignee: Renesas Electronics Corp
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Filing: 1997-02-05
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Granted: 1998-09-08
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Expires: 2017-02-05
Abstract
Abstract A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip-semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.
Inventors
- 👤 Ichiro Miyano
- 👤 Koji Serizawa
- 👤 Hiroyuki Tanaka
- 👤 Tadao Shinoda
- 👤 Suguru Sakaguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:03
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W46/00; H10W46/301; H10W70/00; H10W70/40; H10W70/453; H10W90/00; H10W72/00; H10W72/60; H10W72/834; H10W90/20; H10W90/22; H10W90/288; Y; Y10; Y10T; Y10T29/00; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53183
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
71 words
A semiconductor device including: a film carrier tape having a metallic layer, the metallic layer being an etched layer forming leads and a heat sink; and a semiconductor chip having a first surface on which both the leads and the heat sink of the film carrier tape are disposed, the semiconductor chips being electrically connected to the leads of the film carrier tape on the first surface of the semiconductor chip.
Claim 2
Dependent Claim
71 words
A semiconductor device including: a film carrier tape having a metallic layer, the metallic layer being an etched layer forming leads and a heat sink; and a semiconductor chip having a first surface on which both the leads and the heat sink of the film carrier tape are disposed, the semiconductor chips being electrically connected to the leads of the film carrier tape on the first surface of the semiconductor chip.
Claim 3
Dependent Claim
29 words
A semiconductor device according to claim 1, wherein the leads extend in a first direction and the heat sink extends in a second direction transverse to the first direction.
Claim 4
Dependent Claim
87 words
A multi-chip semiconductor module comprising a plurality of semiconductor devices mounted in a multi-layer stacked configuration on a substrate, each semiconductor device including: a film carrier tape having a metallic layer, the metallic layer being an etched layer forming leads and a heat sink; and a semiconductor chip having a first surface on which both the leads and the heat sink of the film carrier tape are disposed, the semiconductor chip being electrically connected to the leads of the film carrier tape on the first surface thereof.
Claim 5
Dependent Claim
87 words
A multi-chip semiconductor module comprising a plurality of semiconductor devices mounted in a multi-layer stacked configuration on a substrate, each semiconductor device including: a film carrier tape having a metallic layer, the metallic layer being an etched layer forming leads and a heat sink; and a semiconductor chip having a first surface on which both the leads and the heat sink of the film carrier tape are disposed, the semiconductor chip being electrically connected to the leads of the film carrier tape on the first surface thereof.
Claim 6
Dependent Claim
30 words
A multi-chip semiconductor module according to claim 3, wherein the leads extend in a first direction and the heat sink extends in a second direction transverse to the first direction.
Claim 7
Dependent Claim
107 words
A multi-chip semiconductor module comprising a plurality of semiconductor devices mounted in a multi-layer stacked configuration on a substrate, each semiconductor device including: a film carrier tape having leads; a semiconductor chip electrically connected to the leads of the film carrier tape on one surface of the semiconductor chip; and a heat sink mounted to the one surface of the semiconductor chip; wherein the heat sink is an etched portion of the film carrier tape, the film carrier tape including a carrier member and a metallic layer superposed thereon, the metallic layer being an etched layer forming the leads and the heat sink for the semiconductor chip.
Claim 8
Dependent Claim
107 words
A multi-chip semiconductor module comprising a plurality of semiconductor devices mounted in a multi-layer stacked configuration on a substrate, each semiconductor device including: a film carrier tape having leads; a semiconductor chip electrically connected to the leads of the film carrier tape on one surface of the semiconductor chip; and a heat sink mounted to the one surface of the semiconductor chip; wherein the heat sink is an etched portion of the film carrier tape, the film carrier tape including a carrier member and a metallic layer superposed thereon, the metallic layer being an etched layer forming the leads and the heat sink for the semiconductor chip.
Claim 9
Dependent Claim
30 words
A multi-chip semiconductor module according to claim 5, wherein the leads extend in a first direction and the heat sink extends in a second direction transverse to the first direction.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-09-07 | 2002-03-09 | 2002-09-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-09-07 | 2006-03-09 | 2006-09-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-09-07 | 2010-03-09 | 2010-09-08 | $7700.00 | Window Closed / Lapsed |