Patent US6060891A successfully refreshed from Google Patents.
US6060891A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Probe card for semiconductor wafers and method and system for testing wafers
Assignee: Micron Technology Inc
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Filing: 1997-02-11
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Granted: 2000-05-09
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Expires: 2017-02-11
Abstract
Abstract A probe card for testing semiconductor wafers, and a method and system for testing wafers using the probe card are provided. The probe card is configured for use with a conventional testing apparatus, such as a wafer probe handler, in electrical communication with test circuitry. The probe card includes an interconnect substrate having contact members for establishing electrical communication with contact locations on the wafer. The probe card also includes a membrane for physically and electrically connecting the interconnect substrate to the testing apparatus, and a compressible member for cushioning the pressure exerted on the interconnect substrate by the testing apparatus. The interconnect substrate can be formed of silicon with raised contact members having penetrating projections. Alternately the contact members can be formed as indentations for testing bumped wafers. The membrane can be similar to multi layered TAB tape including metal foil conductors attached to a flexible, electrically-insulating, elastomeric tape. The probe card can be configured to contact all of the dice on the wafer at the same time, so that test signals can be electronically applied to selected dice as required.
Inventors
- 👤 David R. Hembree
- 👤 Warren M. Farnworth
- 👤 Salman Akram
- 👤 Alan G. Wood
- 👤 C. Patrick Doherty
- 👤 Andrew J. Krivy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 06:15
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/073; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
136 words
A system for testing a semiconductor wafer, comprising: a testing apparatus in electrical communication with a test circuitry; a substrate comprising a raised contact member for electrically contacting a contact location on the wafer, the contact member comprising a projection configured to penetrate the contact location, and a surface configured to limit a penetration depth of the projection into the contact location; and a flexible membrane for physically mounting the substrate to the testing apparatus and for electrically connecting the contact member to the test circuitry, the membrane comprising a polymer with a conductor thereon in electrical communication with the contact member and with the test circuitry, the membrane suspending the substrate on the testing apparatus and configured such that the substrate and the contact member can move for making electrical contact with the contact location.
Claim 2
Independent Claim
136 words
A system for testing a semiconductor wafer, comprising: a testing apparatus in electrical communication with a test circuitry; a substrate comprising a raised contact member for electrically contacting a contact location on the wafer, the contact member comprising a projection configured to penetrate the contact location, and a surface configured to limit a penetration depth of the projection into the contact location; and a flexible membrane for physically mounting the substrate to the testing apparatus and for electrically connecting the contact member to the test circuitry, the membrane comprising a polymer with a conductor thereon in electrical communication with the contact member and with the test circuitry, the membrane suspending the substrate on the testing apparatus and configured such that the substrate and the contact member can move for making electrical contact with the contact location.
Claim 3
Dependent Claim
33 words
The system of claim 1 further comprising a mounting plate attached to the substrate, and a compressible member between the mounting plate and the substrate for cushioning a pressure applied to the substrate.
Claim 4
Dependent Claim
17 words
The system of claim 1 wherein the membrane allows the substrate to freely move in a z-direction.
Claim 5
Dependent Claim
18 words
The system of claim 1 further comprising a mounting plate attached to the substrate and to the membrane.
Claim 6
Independent Claim
111 words
A system for testing a semiconductor wafer comprising: a testing apparatus in electrical communication with a test circuitry; a substrate comprising a contact member for electrically contacting a contact location on the wafer, the contact member comprising a surface and a projection on the surface for penetrating the contact location as the surface limits further penetration; and a membrane for physically suspending and electrically connecting the substrate on the testing apparatus, the membrane comprising a polymer with a conductor formed thereon in electrical communication with the test circuitry, the membrane configured to allow movement of the substrate and the contact member in a z-direction during electrical contacting of the contact location.
Claim 7
Independent Claim
111 words
A system for testing a semiconductor wafer comprising: a testing apparatus in electrical communication with a test circuitry; a substrate comprising a contact member for electrically contacting a contact location on the wafer, the contact member comprising a surface and a projection on the surface for penetrating the contact location as the surface limits further penetration; and a membrane for physically suspending and electrically connecting the substrate on the testing apparatus, the membrane comprising a polymer with a conductor formed thereon in electrical communication with the test circuitry, the membrane configured to allow movement of the substrate and the contact member in a z-direction during electrical contacting of the contact location.
Claim 8
Dependent Claim
30 words
The system of claim 5 further comprising a mounting plate attached to the substrate, to the membrane, and to the testing apparatus for mounting the substrate to the testing apparatus.
Claim 9
Dependent Claim
22 words
The system of claim 5 wherein the polymer comprises polyimide tape and the conductor comprises a patterned copper layer on the tape.
Claim 10
Dependent Claim
18 words
The system of claim 5 further comprising a compressible member attached to the substrate for cushioning contact forces.
Claim 11
Dependent Claim
37 words
The system of claim 5 further comprising a mounting plate attached to the membrane, to the substrate, and to the testing apparatus and a compliant member between the mounting plate and the substrate for cushioning contact forces.
Claim 12
Dependent Claim
32 words
The system of claim 5 further comprising a mounting plate attached to the testing apparatus and to the membrane and a plurality of wire bonds between the mounting plate and the substrate.
Claim 13
Dependent Claim
24 words
The system of claim 5 wherein the contact member comprises a layer of material on the projections that is non-reactive with the contact location.
Claim 14
Independent Claim
124 words
A system for testing a semiconductor wafer comprising: test circuitry configured to apply test signals to the wafer; a testing apparatus in electrical communication with the test circuitry; a membrane attached to the testing apparatus comprising a polymer tape and a conductor on the tape in electrical communication with the test circuitry; a mounting plate suspended from the testing apparatus by the membrane comprising a wire bond in electrical communication with the conductor; and a substrate mounted to the mounting plate comprising a contact member in electrical communication with the wire bond configured to electrically contact a contact location on the wafer, the substrate movable in a z-direction with the suspended mounting plate during electrical contact of the contact member with the contact location.
Claim 15
Independent Claim
124 words
A system for testing a semiconductor wafer comprising: test circuitry configured to apply test signals to the wafer; a testing apparatus in electrical communication with the test circuitry; a membrane attached to the testing apparatus comprising a polymer tape and a conductor on the tape in electrical communication with the test circuitry; a mounting plate suspended from the testing apparatus by the membrane comprising a wire bond in electrical communication with the conductor; and a substrate mounted to the mounting plate comprising a contact member in electrical communication with the wire bond configured to electrically contact a contact location on the wafer, the substrate movable in a z-direction with the suspended mounting plate during electrical contact of the contact member with the contact location.
Claim 16
Dependent Claim
30 words
The system of claim 12 wherein the contact member comprises a surface and a projection on the surface configured to penetrate the contact location as the surface limits further penetration.
Claim 17
Dependent Claim
14 words
The system of claim 12 wherein the substrate and the contact member comprise silicon.
Claim 18
Dependent Claim
16 words
The system of claim 12 wherein the polymer tape comprises polyimide and the conductor comprises copper.
Claim 19
Dependent Claim
34 words
The system of claim 12 wherein the contact member comprises a generally conically shaped pillar comprising a penetrating projection on a surface thereof configured to penetrate the contact location to a limited penetration depth.
Claim 20
Independent Claim
127 words
A system for testing a semiconductor wafer comprising: a test circuitry configured to apply test signals to the wafer; a test apparatus comprising a probe card fixture and a force applying mechanism; a mounting plate mounted to the force applying mechanism; a substrate mounted to the mounting plate comprising a plurality of contact members in electrical communication with the test circuitry configured to physically and electrically contact the wafer; and a membrane physically suspending the mounting plate from the probe card fixture, the membrane comprising a polymer tape with a plurality of conductors thereon in electrical communication with the test circuitry and with the contact members, the membrane having a slack that permits the force applying mechanism to move the substrate during electrical contacting of the wafer.
Claim 21
Independent Claim
127 words
A system for testing a semiconductor wafer comprising: a test circuitry configured to apply test signals to the wafer; a test apparatus comprising a probe card fixture and a force applying mechanism; a mounting plate mounted to the force applying mechanism; a substrate mounted to the mounting plate comprising a plurality of contact members in electrical communication with the test circuitry configured to physically and electrically contact the wafer; and a membrane physically suspending the mounting plate from the probe card fixture, the membrane comprising a polymer tape with a plurality of conductors thereon in electrical communication with the test circuitry and with the contact members, the membrane having a slack that permits the force applying mechanism to move the substrate during electrical contacting of the wafer.
Claim 22
Dependent Claim
28 words
The system of claim 17 wherein the substrate comprises silicon and the contact members comprise projections for penetrating contact locations on the wafer to a limited penetration death.
Claim 23
Dependent Claim
25 words
The system of claim 17 further comprising a compressible member between the substrate and the mounting plate for cushioning a force applied to the substrate.
Claim 24
Dependent Claim
15 words
The system of claim 17 wherein the substrate is wire bonded to the mounting plate.
Claim 25
Dependent Claim
40 words
The system of claim 17 wherein the contact members comprise pillars having a height of from about 10 μm to 100 μm, and at least one penetrating projection formed thereon with a height of from 0.1 μm to 1 μm.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-09 | 2003-11-08 | 2004-05-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-09 | 2007-11-08 | 2008-05-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-09 | 2011-11-08 | 2012-05-09 | $7700.00 | Window Closed / Lapsed |