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US6060361A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for preventing dopant diffusion in dual gate device

Assignee: United Microelectronics Corp
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Filing: 1998-12-04
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Granted: 2000-05-09
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Expires: 2018-12-04
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Abstract

Abstract A method for preventing the diffusion of dopants in a dual gate device includes the steps of providing a semiconductor substrate having wells and isolating structures thereon, and then forming a gate oxide layer over the well regions. Thereafter a polysilicon layer is formed over the gate oxide layer, and then a first conductive layer is formed over the polysilicon layer. Subsequently, a plasma treatment using gaseous nitrogen or gaseous ammonia is conducted to form a barrier layer. Finally, a second conductive layer is formed over the barrier layer.

Inventors

  • 👤 Tong-Hsin Lee

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 04:07
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/013; H10D64/01302; H10D64/01304; H10D64/01306; H10D64/01308; H10D64/01312; H10D64/60; H10D64/66; H10D64/661; H10D64/662; H10D64/664; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/0165; H10D84/0172; H10D84/0177; H10D84/02; H10D84/03; H10D84/038

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 102 words
A method for preventing dopant diffusion in a dual gate device, comprising the steps of: providing a substrate having an isolating structure and a well thereon; forming a gate oxide layer on the substrate; forming a polysilicon layer on the gate oxide layer; forming a silicon-rich tungsten suicide layer serving as a first conductive layer on the polysilicon layer; performing a plasma treatment on the silicon-rich tungsten silicide layer to transfer at least a top portion of the tungsten silicide layer into a tungsten silicon nitride layer serving as a barrier layer; and forming a second conductive layer on the barrier layer.
Claim 2
Independent Claim 102 words
A method for preventing dopant diffusion in a dual gate device, comprising the steps of: providing a substrate having an isolating structure and a well thereon; forming a gate oxide layer on the substrate; forming a polysilicon layer on the gate oxide layer; forming a silicon-rich tungsten suicide layer serving as a first conductive layer on the polysilicon layer; performing a plasma treatment on the silicon-rich tungsten silicide layer to transfer at least a top portion of the tungsten silicide layer into a tungsten silicon nitride layer serving as a barrier layer; and forming a second conductive layer on the barrier layer.
Claim 3
Dependent Claim 19 words
The method of claim 1, wherein the step of forming the first conductive layer includes using chemical vapor deposition.
Claim 4
Dependent Claim 20 words
The method of claim 1, wherein the step of conducting the plasma treatment includes using gaseous nitrogen as plasma gas.
Claim 5
Dependent Claim 20 words
The method of claim 1, wherein the step of conducting the plasma treatment includes using gaseous ammonia as plasma gas.
Claim 6
Dependent Claim 30 words
The method of claim 1, wherein the plasma treatment is carried out at an operating pressure of about 2 mTorr and a power rating of between about 300W and 500W.
Claim 7
Dependent Claim 14 words
The method of claim 1, wherein the barrier layer has an amorphous internal structure.
Claim 8
Dependent Claim 19 words
The method of claim 1, wherein the step of forming the second conductive layer includes using chemical vapor deposition.
Claim 9
Dependent Claim 21 words
The method of claim 1, wherein the step of forming the second conductive layer includes growing a tungsten-rich, tungsten silicide layer.
Claim 10
Dependent Claim 32 words
The method of claim 1, wherein after the step of forming the second conductive layer over the barrier layer, further includes forming a P-type gate, an N-type gate and a source/drain region.

References Cited (Backward Citations)

US5093710A Cited
US5232871A Cited
US5780908A Cited
US5817175A Cited
US5733816A Cited
US5780356A Cited
US5856237A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-05-09 2003-11-08 2004-05-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-05-09 2007-11-08 2008-05-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-05-09 2011-11-08 2012-05-09 $7700.00 Window Closed / Lapsed

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