Abstract A method of fabricating a multi power source semiconductor device handling multi-level voltages, comprises the steps of: forming first gate oxide layers by thermally oxidizing surfaces of the plurality of the active regions of said semiconductor substrate; forming a first mask having a window on a first active region among said plurality of the active regions of said semiconductor substrate; implanting impurity ions for controlling a threshold voltage, into a surface of said first active region through the first mask; removing the first gate oxide layer on the first active region exposed in the window of said first mask; removing said first mask; forming a thin second gate oxide layer on the first active region and a thick third gate oxide layer on a second active region different from the first active region among said plurality of the active regions by further thermally oxidizing the surfaces of the plurality of the active regions; forming on the semiconductor substrate a second mask having a window on the second active region; and implanting impurity ions for controlling a threshold voltage, into a surface of the second active region through said second mask. A method of fabricating a multi power source semiconductor device capable of realizing gate oxide layers of different thickness and different channel doping with a small number of masks is provided.
A method of fabricating a multi power source semiconductor device comprising the steps of: a) preparing a semiconductor substrate defining a plurality of active regions, including first and second active regions; b) forming first gate oxide layers by thermally oxidizing surfaces of the plurality of the active regions of said semiconductor substrate; c) forming a first mask having a window on the first active region on said semiconductor substrate; d) implanting impurity ions for controlling a threshold voltage, into a surface of said first active region through said first mask; e) removing said first gate oxide layer on said first active region exposed in the window of said first mask; f) removing said first mask; g) forming a thin second gate oxide layer on said first active region and thickening the remaining first gate oxide layer on a second active region different from said first active region by further thermally oxidizing the surfaces of said plurality of the active regions; h) forming on said semiconductor substrate a second mask having a window on said second active region; and i) implanting impurity ions for controlling a threshold voltage, into a surface of said second active region through said second mask.
Claim 2
Independent Claim
199 words
A method of fabricating a multi power source semiconductor device comprising the steps of: a) preparing a semiconductor substrate defining a plurality of active regions, including first and second active regions; b) forming first gate oxide layers by thermally oxidizing surfaces of the plurality of the active regions of said semiconductor substrate; c) forming a first mask having a window on the first active region on said semiconductor substrate; d) implanting impurity ions for controlling a threshold voltage, into a surface of said first active region through said first mask; e) removing said first gate oxide layer on said first active region exposed in the window of said first mask; f) removing said first mask; g) forming a thin second gate oxide layer on said first active region and thickening the remaining first gate oxide layer on a second active region different from said first active region by further thermally oxidizing the surfaces of said plurality of the active regions; h) forming on said semiconductor substrate a second mask having a window on said second active region; and i) implanting impurity ions for controlling a threshold voltage, into a surface of said second active region through said second mask.
Claim 3
Dependent Claim
168 words
A method according to claim 1, wherein: said first active region includes first conductivity type region and a second conductivity type region, the second conductivity type being opposite to the first conductivity type, said first mask has a window on said first and second conductivity type regions of said first active region, said second active region includes a first conductivity type region and a second conductivity type region, and said second mask has a window on the first or the second conductivity type region of the second active region, said method further comprising, after said step g, the steps of: a) implanting impurity ions for controlling a threshold voltage, into said plurality of the active regions; b) forming on said semiconductor substrate a third mask having a window on the first or second conductivity type region of said first active region; and c) implanting impurity ions for controlling a threshold voltage, into the first or second conductivity type region of said first active region through said third mask.
Claim 4
Dependent Claim
89 words
A method according to claim 2, wherein the region exposed in the window of said second mask is the first conductivity type region of said second active region, the method further comprising the steps of: a) forming on said semiconductor substrate a fourth mask having a window on the second or the first conductivity type region of said second active region; and c) implanting impurity ions for controlling a threshold voltage, into the second or the first conductivity type region of said second active region through said fourth mask.