Abstract An embodiment of the instant invention is a method of fabricating a semiconductor device which includes a dielectric layer situated between a conductive structure and a semiconductor substrate, the method comprising the steps of: forming the dielectric layer (layer 14) on the semiconductor substrate (substrate 12); forming the conductive structure (structure 18) on the dielectric layer; doping the conductive structure with boron; and doping the conductive structure with a dopant which inhibits the diffusion of boron. The semiconductor device may be a PMOS transistor or a capacitor. Preferably, the conductive structure is a gate structure. The dielectric layer is, preferably, comprised of a material selected from the group consisting of: an oxide, an oxide/oxide stack, an oxide/nitride stack, and an oxynitride. Preferably, the dopant which inhibits the diffusion of boron comprises at least one group III or group IV element. More specifically, it is preferably comprised of: carbon, germanium, and any combination thereof. Preferably, the steps of doping the conductive structure with boron and doping the conductive structure with a dopant which inhibits the diffusion of boron are accomplished substantially simultaneously, or the step of doping the conductive structure with boron is preformed prior to the step of doping the conductive structure with a dopant which inhibits the diffusion of boron are accomplished substantially simultaneously.
A method of fabricating a semiconductor device which includes a dielectric layer situated between a conductive structure and a semiconductor substrate, said method comprising the steps of: forming said dielectric layer over said semiconductor substrate; forming a polysilicon layer doped with a dopant which inhibits the diffusion of boron on said dielectric layer; forming an undoped polysilicon layer on said polysilicon layer doped with a dopant which inhibits the diffusion of boron; doping said undoped polysilicon layer with boron so as to form said conductive structure.
Claim 2
Independent Claim
86 words
A method of fabricating a semiconductor device which includes a dielectric layer situated between a conductive structure and a semiconductor substrate, said method comprising the steps of: forming said dielectric layer over said semiconductor substrate; forming a polysilicon layer doped with a dopant which inhibits the diffusion of boron on said dielectric layer; forming an undoped polysilicon layer on said polysilicon layer doped with a dopant which inhibits the diffusion of boron; doping said undoped polysilicon layer with boron so as to form said conductive structure.
Claim 3
Dependent Claim
16 words
The method of claim 1, wherein said semiconductor device is a PMOS transistor or a capacitor.
Claim 4
Dependent Claim
31 words
The method of claim 1, wherein said dielectric layer is comprised of a material selected from the group consisting of: an oxide, an oxide/oxide stack, an oxide/nitride stack, and an oxynitride.
Claim 5
Dependent Claim
24 words
The method of claim 1, wherein said dopant which inhibits the diffusion of boron comprises at least one group III or group IV element.
Claim 6
Dependent Claim
31 words
The method of claim 1, wherein said dopant which inhibits the diffusion of boron is comprised of an element selected from the group consisting of: carbon, germanium, and any combination thereof.