US6018465A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for mounting a chip package to a chassis of a computer
Assignee: Intel Corp
•
Filing: 1996-12-31
•
Granted: 2000-01-25
•
Expires: 2016-12-31
Abstract
Abstract An apparatus is provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided is an apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided is an apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided is an apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.
Inventors
- 👤 Shekhar Yeshwant Borkar
- 👤 Robert S. Dreyer
- 👤 Hans Mulder
- 👤 Naomi Obinata
- 👤 Calvin E. Wells
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 06:34
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0263; G; G06; G06F; G06F1/00; G06F1/16; G06F1/18; G06F1/183; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10272; H05K2201/10424; H05K2201/10431; H05K2201/10439; H05K2201/10492; H05K2201/10613; H05K2201/10621; H05K2201/10704; H05K2201/10734; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
74 words
An apparatus comprising: a computer chassis; a chip package, said chip package comprising at least one power pin and at least one signal pin; and, a bracket coupled to said chassis, said bracket further comprising a first socket receiving said power pin and a second socket receiving said signal pin, wherein said first socket electrically couples said power pin to said bracket and said second socket electrically isolates said signal pin from said bracket.
Claim 2
Independent Claim
74 words
An apparatus comprising: a computer chassis; a chip package, said chip package comprising at least one power pin and at least one signal pin; and, a bracket coupled to said chassis, said bracket further comprising a first socket receiving said power pin and a second socket receiving said signal pin, wherein said first socket electrically couples said power pin to said bracket and said second socket electrically isolates said signal pin from said bracket.
Claim 3
Dependent Claim
15 words
The apparatus of claim 1 further comprising a current source electrically coupled to said bracket.
Claim 4
Independent Claim
84 words
An apparatus comprising: a computer chassis; a chip package, said chip package comprising at least one solder power connection and at least one solder signal connection; and, a bracket coupled to said chassis, said bracket further comprising a first landing pad electrically coupled to said power connection and a second landing pad electrically coupled to said signal connection, wherein said first landing pad electrically couples said power connection to said bracket and said second landing pad electrically isolates said signal connection from said bracket.
Claim 5
Independent Claim
84 words
An apparatus comprising: a computer chassis; a chip package, said chip package comprising at least one solder power connection and at least one solder signal connection; and, a bracket coupled to said chassis, said bracket further comprising a first landing pad electrically coupled to said power connection and a second landing pad electrically coupled to said signal connection, wherein said first landing pad electrically couples said power connection to said bracket and said second landing pad electrically isolates said signal connection from said bracket.
Claim 6
Dependent Claim
15 words
The apparatus of claim 3 further comprising a current source electrically coupled to said bracket.
Claim 7
Dependent Claim
34 words
The apparatus of claim 3 wherein said bracket further comprises a signal pin mechanically and electrically coupled to said second landing pad for coupling said chip package solder signal connection to an interconnecting circuit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-01-24 | 2003-07-26 | 2004-01-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-01-24 | 2007-07-26 | 2008-01-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-01-24 | 2011-07-26 | 2012-01-25 | $7700.00 | Window Closed / Lapsed |