US5673176A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit dual cooling paths and method for constructing same
Assignee: Dell USA LP
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Filing: 1995-12-06
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Granted: 1997-09-30
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Expires: 2015-12-06
Abstract
Abstract A thermal transfer circuit is provided for dissipating thermal energy within a portable minicomputer. The thermal transfer circuit is formed during assembly of the personal computer. Specifically, the thermal transfer circuit embodies dual cooling paths for extracting thermal energy from opposing surfaces of an encapsulated integrated circuit. The dual path thermal transfer circuit is formed by drawing the integrated circuit between an upper path heatsink assembly and a lower path heatsink assembly. Thermal connection of heatsink assemblies to corresponding integrated circuit surfaces, either directly or indirectly, allows enhanced dissipation of power-consumptive integrated circuits, such as modern day CPUs. Clamping of the upper and lower heatsink assemblies occurs in equal and opposite force directions normal to opposed integrated circuit surfaces. The normal clamping forces eliminate application of shear force components upon integrated circuit surfaces and the deleterious effects of surface mount lead dislodgment.
Inventors
- 👤 Mark B. Penniman
- 👤 Peter N. Skillman
- 👤 Tony J. Lillios
- 👤 Dennis J. Boyle
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 05:54
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/14; H05K7/1422; G; G06; G06F; G06F1/00; G06F1/16; G06F1/20; G06F1/203
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
102 words
A system for cooling a heat source, comprising: a printed circuit board having a plurality of plated vias extending therethrough; a heat source having opposed first and second sides, said first side is adapted for connection to the printed circuit board in thermal contact with a first end of the plated vias; an upper heatsink assembly thermally connected to a second end of said plated vias, opposite the first end; a lower heatsink assembly thermally connected to the second side of said heat source; and a compliant, thermally conductive material placed between the second end of said vias and said upper heatsink.
Claim 2
Independent Claim
102 words
A system for cooling a heat source, comprising: a printed circuit board having a plurality of plated vias extending therethrough; a heat source having opposed first and second sides, said first side is adapted for connection to the printed circuit board in thermal contact with a first end of the plated vias; an upper heatsink assembly thermally connected to a second end of said plated vias, opposite the first end; a lower heatsink assembly thermally connected to the second side of said heat source; and a compliant, thermally conductive material placed between the second end of said vias and said upper heatsink.
Claim 3
Dependent Claim
15 words
The system as recited in claim 7, wherein said heat source comprises an integrated circuit.
Claim 4
Dependent Claim
17 words
The system as recited in claim 7, wherein said heat source comprises an encapsulated microprocessor integrated circuit.
Claim 5
Dependent Claim
16 words
The system as recited in claim 3 wherein said system is located within a computer system.
Claim 6
Independent Claim
103 words
A system for cooling a heat source, comprising: a printed circuit board having a plurality of plated vias extending therethrough; a heat source having opposed first and second sides, said first side is adapted for connection to the printed circuit board in thermal contact with a first end of the plated vias; an upper heatsink assembly thermally connected to a second end of said plated vias, opposite the first end; a lower heatsink assembly thermally connected to the second side of said heat source; and a compliant, thermally conductive material placed between the second side of said heat source and said lower heatsink.
Claim 7
Independent Claim
103 words
A system for cooling a heat source, comprising: a printed circuit board having a plurality of plated vias extending therethrough; a heat source having opposed first and second sides, said first side is adapted for connection to the printed circuit board in thermal contact with a first end of the plated vias; an upper heatsink assembly thermally connected to a second end of said plated vias, opposite the first end; a lower heatsink assembly thermally connected to the second side of said heat source; and a compliant, thermally conductive material placed between the second side of said heat source and said lower heatsink.
Claim 8
Dependent Claim
15 words
The system as recited in claim 5, wherein said heat source comprises an integrated circuit.
Claim 9
Dependent Claim
17 words
The system as recited in claim 5, wherein said heat source comprises an encapsulated microprocessor integrated circuit.
Claim 10
Dependent Claim
16 words
The system as recited in claim 7 wherein said system is located within a computer system.
Claim 11
Independent Claim
136 words
A system for cooling a heat source, comprising: a printed circuit board having a plurality of plated vias extending therethrough; a heat source having opposed first and second sides, said first side is adapted for connection to the printed circuit board in thermal contact with a first end of the plated vias; an upper heatsink assembly thermally connected to a second end of said plated vias, opposite the first end; a lower heatsink assembly thermally connected to the second side of said heat source; and wherein said upper heatsink assembly includes an upper spreader plate configured to extend across the second end of said plated vias; and an upper retainer configured to extend across a portion of the upper plate, said upper retainer having a plurality of apertures spaced about the periphery of the upper retainer.
Claim 12
Independent Claim
136 words
A system for cooling a heat source, comprising: a printed circuit board having a plurality of plated vias extending therethrough; a heat source having opposed first and second sides, said first side is adapted for connection to the printed circuit board in thermal contact with a first end of the plated vias; an upper heatsink assembly thermally connected to a second end of said plated vias, opposite the first end; a lower heatsink assembly thermally connected to the second side of said heat source; and wherein said upper heatsink assembly includes an upper spreader plate configured to extend across the second end of said plated vias; and an upper retainer configured to extend across a portion of the upper plate, said upper retainer having a plurality of apertures spaced about the periphery of the upper retainer.
Claim 13
Dependent Claim
46 words
The system as recited in claim 9, further comprising a screw rotatably inserted into each of said apertures to reciprocally draw said upper retainer against said upper plate and, in response thereto, to draw said upper plate thermally against the second end of said plated vias.
Claim 14
Dependent Claim
23 words
The system as recited in claim 9, further comprising a compliant, thermally insulative material placed between said upper plate and said upper retainer.
Claim 15
Dependent Claim
15 words
The system as recited in claim 9, wherein said heat source comprises an integrated circuit.
Claim 16
Dependent Claim
17 words
The system as recited in claim 9, wherein said heat source comprises an encapsulated microprocessor integrated circuit.
Claim 17
Dependent Claim
16 words
The system as recited in claim 13 wherein said system is located within a computer system.
Claim 18
Independent Claim
136 words
A system for cooling a heat source, comprising: a printed circuit board having a plurality of plated vias extending therethrough; a heat source having opposed first and second sides, said first side is adapted for connection to the printed circuit board in thermal contact with a first end of the plated vias; an upper heatsink assembly thermally connected to a second end of said plated vias, opposite the first end; and A lower heatsink assembly thermally connected to the second side of said heat source; wherein said lower heatsink assembly includes a lower spreader plate configured to extend across the second side of said heat source; and a lower retainer configured to extend across a portion of the lower plate, said lower retainer having a plurality of apertures spaced about the periphery of the lower retainer.
Claim 19
Independent Claim
136 words
A system for cooling a heat source, comprising: a printed circuit board having a plurality of plated vias extending therethrough; a heat source having opposed first and second sides, said first side is adapted for connection to the printed circuit board in thermal contact with a first end of the plated vias; an upper heatsink assembly thermally connected to a second end of said plated vias, opposite the first end; and A lower heatsink assembly thermally connected to the second side of said heat source; wherein said lower heatsink assembly includes a lower spreader plate configured to extend across the second side of said heat source; and a lower retainer configured to extend across a portion of the lower plate, said lower retainer having a plurality of apertures spaced about the periphery of the lower retainer.
Claim 20
Dependent Claim
46 words
The system as recited in claim 15, further comprising a screw rotatably inserted into each of said apertures to reciprocally draw said lower retainer against said lower plate and, in response thereto, to draw said lower plate thermally against the second side of said heat source.
Claim 21
Dependent Claim
23 words
The system as recited in claim 15, further comprising a compliant, thermally insulative material placed between said lower plate and said lower retainer.
Claim 22
Dependent Claim
15 words
The system as recited in claim 15, wherein said heat source comprises an integrated circuit.
Claim 23
Dependent Claim
17 words
The system as recited in claim 15, wherein said heat source comprises an encapsulated microprocessor integrated circuit.
Claim 24
Dependent Claim
16 words
The system as recited in claim 19 wherein said system is located within a computer system.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-29 | 2001-03-31 | 2001-09-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-29 | 2005-03-31 | 2005-09-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-29 | 2009-03-31 | 2009-09-30 | $7700.00 | Window Closed / Lapsed |