US5706171A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flat plate cooling using a thermal paste retainer
Assignee: International Business Machines Corp
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Filing: 1995-11-20
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Granted: 1998-01-06
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Expires: 2015-11-20
Abstract
Abstract Thermal material such as a paste or gel is confined within a paste gap between a surface of a flat cooling plate and an opposing surface of a chip mounted on a surface of a chip carrier or substrate by forming a partition, preferably in the form of a grid, at the periphery of one or more chips. The partition is located laterally in sufficient proximity to the chip and in communication with the paste gap to form a capillary and thus confine motion of a viscous thermal material to repetitive bidirectional flow out of and into the paste gap with relative motion of the chip and the surface of the flat cooling plate. The grid is preferably fitted closely within grooves formed in the surface of the flat cooling plate and preferably supported by leaf springs so that thermal material is confined within cells of the grid while providing support and/or damping of relative motion between the flat cooling plate and the substrate or carrier.
Inventors
- 👤 David Linn Edwards
- 👤 Sushumna Iruvanti
- 👤 Gaetano Paolo Messina
- 👤 Raed A. Sherif
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 18:20
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2039; H05K7/20436; H05K7/20445; H05K7/20454; H10; H10W; H10W40/00; H10W40/70; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
95 words
An electronic package including: at least one chip mounted on a surface of a carrier, a cooling means having a surface opposing a surface of said at least one chip and said carrier, a space between said at least one chip and said surface of said cooling means defining a paste gap containing a viscous thermal material, and a partition surrounding at least a major portion of said at least one chip and spaced therefrom and forming a capillary at a periphery of said at least one chip, said capillary containing said viscous thermal material.
Claim 2
Dependent Claim
95 words
An electronic package including: at least one chip mounted on a surface of a carrier, a cooling means having a surface opposing a surface of said at least one chip and said carrier, a space between said at least one chip and said surface of said cooling means defining a paste gap containing a viscous thermal material, and a partition surrounding at least a major portion of said at least one chip and spaced therefrom and forming a capillary at a periphery of said at least one chip, said capillary containing said viscous thermal material.
Claim 3
Dependent Claim
26 words
An electronic package as recited in claim 1, wherein at least a portion of said partition receives an electronic component other than an integrated circuit chip.
Claim 4
Dependent Claim
31 words
An electronic package as in claim 1, wherein said partition is connected to said cooling means and said carrier, said partition defining a cell retaining said thermal material and said chip.
Claim 5
Dependent Claim
19 words
An electronic package as in claim 1, wherein said partition is connected to said cooling means via elastic means.
Claim 6
Dependent Claim
15 words
An electronic package as in claim 1, wherein said electronic package is a chip/substrate/cover structure.
Claim 7
Dependent Claim
109 words
An electronic package including: at least one chip mounted on a surface of a carrier, a cooling means having a surface opposing a surface of said at least one chip and said carrier, a space between said at least one chip and said surface of said cooling means defining a paste gap containing a viscous thermal material, and a partition surrounding at least a major portion of said at least one chip and spaced therefrom and forming a capillary at a periphery of said at least one chip said, capillary containing said thermal material, wherein said partition is fired within a groove in said surface of said cooling means.
Claim 8
Dependent Claim
109 words
An electronic package including: at least one chip mounted on a surface of a carrier, a cooling means having a surface opposing a surface of said at least one chip and said carrier, a space between said at least one chip and said surface of said cooling means defining a paste gap containing a viscous thermal material, and a partition surrounding at least a major portion of said at least one chip and spaced therefrom and forming a capillary at a periphery of said at least one chip said, capillary containing said thermal material, wherein said partition is fired within a groove in said surface of said cooling means.
Claim 9
Dependent Claim
22 words
An electronic package as recited in claim 6, wherein said partition is in the form of a grid received within said groove.
Claim 10
Dependent Claim
23 words
An electronic package as recited in claim 7, further including a leaf spring interposed between a bottom of said groove and said grid.
Claim 11
Dependent Claim
103 words
An electronic package including: at least one chip mounted on a surface of a carrier, a cooling means having a surface opposing a surface of said at least one chip and said carrier, a space between said at least one chip and said surface of said cooling means defining a paste gap containing a viscous thermal material, and a partition surrounding at least a major portion of said at least one chip and spaced therefrom and forming a capillary at a periphery of said at least one chip, said capillary containing said thermal material, wherein said partition contacts a surface of said carrier.
Claim 12
Dependent Claim
103 words
An electronic package including: at least one chip mounted on a surface of a carrier, a cooling means having a surface opposing a surface of said at least one chip and said carrier, a space between said at least one chip and said surface of said cooling means defining a paste gap containing a viscous thermal material, and a partition surrounding at least a major portion of said at least one chip and spaced therefrom and forming a capillary at a periphery of said at least one chip, said capillary containing said thermal material, wherein said partition contacts a surface of said carrier.
Claim 13
Dependent Claim
17 words
An electronic package as recited in claim 8, wherein said grid contacts a surface of said carrier.
Claim 14
Dependent Claim
76 words
A structure for mounting art electronic component comprising: a carrier connected to said component; a thermal material contacting said component; cooling means contacting said thermal material; and a grid connected to said carrier and said cooling means, said grid including cells having a dimension larger than that of said component, one of said cells receiving said component, such that said grid causes said thermal material to be retained substantially between said component and said cooling means.
Claim 15
Dependent Claim
76 words
A structure for mounting art electronic component comprising: a carrier connected to said component; a thermal material contacting said component; cooling means contacting said thermal material; and a grid connected to said carrier and said cooling means, said grid including cells having a dimension larger than that of said component, one of said cells receiving said component, such that said grid causes said thermal material to be retained substantially between said component and said cooling means.
Claim 16
Dependent Claim
29 words
A structure as in claim 11, wherein said grid contacts said cooling means via elastic means, so as to permit relative movement between said carrier and said cooling means.
Claim 17
Dependent Claim
21 words
A structure as in claim 12, wherein said grid contacts said cooling means by a connection comprising an elastic leaf spring.
Claim 18
Dependent Claim
15 words
A structure as in claim 11, wherein said cooling means includes grooves receiving said grid.
Claim 19
Dependent Claim
14 words
A structure as in claim 11, wherein said grid is integral with said carrier.
Claim 20
Dependent Claim
107 words
A structure for mounting an electronic component comprising: a carrier connected to said component: a thermal material contacting said component: cooling means contacting said thermal material: and a grid connected to said carrier and said cooling means, said grid including cells having a dimension larger than that of said component, one of said cells receiving said component, such that said grid causes said thermal material to be retained substantially between said component and said cooling means, wherein said grid includes partitions which substantially surround said component, said partitions being spaced from said component such that said partitions cause capillary action of said thermal material around said component.
Claim 21
Dependent Claim
107 words
A structure for mounting an electronic component comprising: a carrier connected to said component: a thermal material contacting said component: cooling means contacting said thermal material: and a grid connected to said carrier and said cooling means, said grid including cells having a dimension larger than that of said component, one of said cells receiving said component, such that said grid causes said thermal material to be retained substantially between said component and said cooling means, wherein said grid includes partitions which substantially surround said component, said partitions being spaced from said component such that said partitions cause capillary action of said thermal material around said component.
Claim 22
Dependent Claim
13 words
An electronic package as in claim 4, wherein said elastic means comprises springs.
Claim 23
Dependent Claim
18 words
A structure as in claim 11, wherein said structure for mounting an electronic component is a chip/substrate/cover structure.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-01-05 | 2001-07-07 | 2002-01-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-01-05 | 2005-07-07 | 2006-01-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-01-05 | 2009-07-07 | 2010-01-06 | $7700.00 | Window Closed / Lapsed |