US6011313A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flip chip interconnections on electronic modules
Assignee: Visteon Global Technologies Inc
•
Filing: 1999-02-01
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Granted: 2000-01-04
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Expires: 2019-02-01
Abstract
Abstract A device which utilizes flip chip technology to provide interconnection between printed circuit boards and integrated circuits is disclosed. The method involves metallization of the bond pad and multiple, novel bump compositions and coating compositions to provide an interconnection which is reliable and which withstands differences in the coefficient of thermal expansion between the silicon device and the bump material.
Inventors
- 👤 Dongkai Shangguan
- 👤 Mohan Paruchuri
- 👤 Achyuta Achari
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 08:48
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/346; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/251; H10W72/252; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/9415; H10W72/951; H10W72/952; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
64 words
A metallized via bond pad on an integrated circuit for flip chip interconnections, comprising: an aluminum primary metallization layer deposited on the integrated circuit; a titanium-tungsten diffusion barrier layer deposited on said primary metallization layer; a copper oxidation protection layer deposited on said diffusion barrier layer; and a main metallization layer comprising a metal selected from the group consisting of copper, nickel, and silver.
Claim 2
Dependent Claim
64 words
A metallized via bond pad on an integrated circuit for flip chip interconnections, comprising: an aluminum primary metallization layer deposited on the integrated circuit; a titanium-tungsten diffusion barrier layer deposited on said primary metallization layer; a copper oxidation protection layer deposited on said diffusion barrier layer; and a main metallization layer comprising a metal selected from the group consisting of copper, nickel, and silver.
References Cited (Backward Citations)
US3839727A
Cited
US5134460A
Cited
US4887760A
Cited
US4837609A
Cited
US5227812A
Cited
US5251806A
Cited
US5120678A
Cited
US5258648A
Cited
US5349500A
Cited
US5342999A
Cited
US5401689A
Cited
US5477419A
Cited
US5452842A
Cited
US5454160A
Cited
US5470787A
Cited
US5431328A
Cited
US5508229A
Cited
US5698465A
Cited
US5611481A
Cited
US5542174A
Cited
US5816478A
Cited
US5634268A
Cited
US5796591A
Cited
US5808360A
Cited
US5729896A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-01-03 | 2003-07-05 | 2004-01-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-01-03 | 2007-07-05 | 2008-01-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-01-03 | 2011-07-05 | 2012-01-04 | $7700.00 | Window Closed / Lapsed |