US5477419A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for electrically connecting an electronic part to a circuit board
Assignee: Sony Corp
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Filing: 1994-04-11
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Granted: 1995-12-19
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Expires: 2014-04-11
Abstract
Abstract A method of mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed. It includes a process of forming a conductive layer on the surface of the terminal portion; a process of forming, on the surface of the connection portion, a conductive layer having a melting point different from that of the conductive layer formed on the surface of the terminal portion; and a process of melting the conductive layer having a low melting point in such a state that the conductive layer of the terminal portion is contacted with the conductive layer of the connection portion, thereby fusing the conductive layer having a low melting point onto the conductive layer having a high melting point. Moreover, the method includes a process of forming a projecting portion made of a heat-resisting material on the surface of the electronic part around the terminal portion, and forming a conductive layer at least one surface of the connection portion or the terminal portion; and a process of electrically connecting the connection portion with the terminal portion and allowing the projecting portion to be contacted with the surface of the board.
Inventors
- 👤 Thomas W. Goodman
- 👤 Hiroyuki Fujita
- 👤 Yoshikazu Murakami
- 👤 Arthur T. Murphy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 12:14
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; H05K3/303; H05K3/341; H05K3/3431; H05K3/3436; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09909; H05K2201/10; H05K2201/10431; H05K2201/10568; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2201/10954; H05K2201/10992; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0126; H05K2203/0195; H05K2203/03; H05K2203/0338; H05K2203/04; H05K2203/043; H05K2203/044; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
95 words
An electronic part mounting board comprising: an electronic part having a terminal portion; and a board on which a circuit including a connection portion is formed, said terminal portion being connected to said connection portion, a first conductive layer applied on a surface of the terminal portion; a second conductive layer having a melting point lower than that of the first conductive layer formed on the surface of said terminal portion, formed on a surface of said connection portion; and the second conductive layer fused onto the first conductive layer having a higher melting point.
Claim 2
Dependent Claim
95 words
An electronic part mounting board comprising: an electronic part having a terminal portion; and a board on which a circuit including a connection portion is formed, said terminal portion being connected to said connection portion, a first conductive layer applied on a surface of the terminal portion; a second conductive layer having a melting point lower than that of the first conductive layer formed on the surface of said terminal portion, formed on a surface of said connection portion; and the second conductive layer fused onto the first conductive layer having a higher melting point.
Claim 3
Dependent Claim
22 words
An electronic part mounting board according to claim 1, wherein said first and second conductive layers are comprised of a solder paste.
Claim 4
Dependent Claim
20 words
An electronic part mounting board according to claim 2, wherein the first conductive layer is formed in a bump shape.
Claim 5
Dependent Claim
27 words
An electronic part mounting board according to claim 2, wherein said electronic part comprises a land grid array package, and said board comprises a printed wiring board.
Claim 6
Dependent Claim
20 words
An electronic part mounting board according to claim 1, wherein the first conductive layer is formed in a bump shape.
Claim 7
Dependent Claim
109 words
An electronic part mounting board comprising: an electronic part having a terminal portion; and a board on which a circuit including a connection portion is formed, said terminal portion being electrically connected to said connection portion, wherein said electronic part comprises a land grid array package; said board comprises a printed wiring board; a bump-shaped conductive layer formed on a surface of the terminal portion; a second conductive layer having a melting point lower than that of the bump-shaped conductive layer formed on the surface of said terminal portion, formed on the surface of said connection portion; and wherein the second conductive layer fused onto the first conductive layer.
Claim 8
Dependent Claim
109 words
An electronic part mounting board comprising: an electronic part having a terminal portion; and a board on which a circuit including a connection portion is formed, said terminal portion being electrically connected to said connection portion, wherein said electronic part comprises a land grid array package; said board comprises a printed wiring board; a bump-shaped conductive layer formed on a surface of the terminal portion; a second conductive layer having a melting point lower than that of the bump-shaped conductive layer formed on the surface of said terminal portion, formed on the surface of said connection portion; and wherein the second conductive layer fused onto the first conductive layer.
Claim 9
Dependent Claim
86 words
An electronic part mounting method for mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed, the method comprising the steps of: applying a first solder paste on a surface of the terminal portion; applying a second solder paste on a surface of the connection portion, the second solder paste having a melting point lower than a melting point of the first solder paste; and melting the second solder paste onto the first solder paste.
Claim 10
Dependent Claim
86 words
An electronic part mounting method for mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed, the method comprising the steps of: applying a first solder paste on a surface of the terminal portion; applying a second solder paste on a surface of the connection portion, the second solder paste having a melting point lower than a melting point of the first solder paste; and melting the second solder paste onto the first solder paste.
Claim 11
Dependent Claim
20 words
An electronic part mounting method according to claim 7, wherein the first conductive paste is formed in a bump shape.
Claim 12
Dependent Claim
27 words
An electronic part mounting method according to claim 7, wherein said electronic part comprises a land grid array package, and said board comprises a printed wiring board.
Claim 13
Dependent Claim
38 words
An electronic part mounting method according to claim 9, wherein said conductive layer comprises a solder paste; and said step of applying a first solder paste comprises printing a solder paste on the surface of the terminal portion.
Claim 14
Dependent Claim
41 words
An electronic part mounting method according to claim 9, wherein said conductive layer comprises a solder paste; and said process of applying a first conductive paste comprises imparting a solder paste on the surface of the terminal portion with a pin.
Claim 15
Dependent Claim
40 words
An electronic part mounting method according to claim 9, wherein said conductive layer comprises a solder; and said step of applying the first solder paste comprises imparting a solder ball on the surface of the terminal portion with a dispenser.
Claim 16
Dependent Claim
51 words
An electronic part mounting method according to claim 9, wherein said conductive layer comprises a solder; and said process of forming said conductive layer on the surface of said terminal portion or said connection portion includes a process of covering said terminal portion or said connection portion with a molten solder.
Claim 17
Dependent Claim
40 words
An electronic part mounting method according to claim 9, wherein said conductive layer comprises a solder; and said process of forming said conductive layer on the surface of said terminal portion or said connection portion includes a solder plating process.
Claim 18
Dependent Claim
84 words
An electronic part mounting board comprising: an electronic part having a terminal portion; and a board on which a circuit including a connection portion is formed, said terminal portion being connected to said connection porion, wherein a conductive portion is formed on said connecting section between said terminal portion and said connection portion; and a projecting portion made of a heat-resisting material which is contacted with the surface of said board, is formed on the surface of said electronic part around said connection portion.
Claim 19
Dependent Claim
84 words
An electronic part mounting board comprising: an electronic part having a terminal portion; and a board on which a circuit including a connection portion is formed, said terminal portion being connected to said connection porion, wherein a conductive portion is formed on said connecting section between said terminal portion and said connection portion; and a projecting portion made of a heat-resisting material which is contacted with the surface of said board, is formed on the surface of said electronic part around said connection portion.
Claim 20
Dependent Claim
23 words
An electronic part mounting method according to claim 15, wherein said conductive layer comprises a solder, a solder paste or a conductive paste.
Claim 21
Dependent Claim
27 words
An electronic part mounting method according to claim 15, wherein said electronic part comprises a land grid array package, and said board comprises a printed wiring board.
Claim 22
Dependent Claim
110 words
An electronic part mounting board comprising: an electronic part having a terminal portion; and a board on which a circuit including a connection portion is formed, said terminal porion being electrically connected to said connection portion, wherein said electronic part comprises a land grid array package; said board comprises a printed wiring board; a conductive layer made of a solder, solder paste or conductive paste is formed on a connecting section between said terminal portion and said connection portion; and a projecting portion made of a heat-resisting material which is contacted with the surface of said board, is formed on the surface of said electronic part around said connection portion.
Claim 23
Dependent Claim
110 words
An electronic part mounting board comprising: an electronic part having a terminal portion; and a board on which a circuit including a connection portion is formed, said terminal porion being electrically connected to said connection portion, wherein said electronic part comprises a land grid array package; said board comprises a printed wiring board; a conductive layer made of a solder, solder paste or conductive paste is formed on a connecting section between said terminal portion and said connection portion; and a projecting portion made of a heat-resisting material which is contacted with the surface of said board, is formed on the surface of said electronic part around said connection portion.
Claim 24
Dependent Claim
95 words
An electronic part mounting method of mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed, comprising: a process of forming a projecting portion made of a heat-resisting material on the surface of said electronic part around said terminal portion, and forming a conductive layer at least one surface of said connection portion or said terminal portion; and a process of electrically connecting said connection portion to said terminal portion, and allowing said projecting portion to be contacted with the surface of said board.
Claim 25
Dependent Claim
95 words
An electronic part mounting method of mounting an electronic part having a terminal portion on a board on which a circuit including a connection portion is formed, comprising: a process of forming a projecting portion made of a heat-resisting material on the surface of said electronic part around said terminal portion, and forming a conductive layer at least one surface of said connection portion or said terminal portion; and a process of electrically connecting said connection portion to said terminal portion, and allowing said projecting portion to be contacted with the surface of said board.
Claim 26
Dependent Claim
27 words
An electronic part mounting method according to claim 19, wherein said electronic part comprises a land grid array package, and said board comprises a printed wiring board.
Claim 27
Dependent Claim
65 words
An electronic part mounting method according to claim 20, wherein said conductive layer comprises a solder paste or conductive paste; and said process of forming said conductive layer on the surface of said terminal portion or said connection portion includes a process of printing a solder paste or conductive paste on the surface of said terminal portion or said connection portion by a printing method.
Claim 28
Dependent Claim
67 words
An electronic part mounting method according to claim 20, wherein said conductive layer comprises a solder paste or conductive paste; and said process of forming said conductive layer on the surface of said terminal portion or said connection portion includes a process of imparting a solder paste or conductive paste on the surface of said terminal portion of said connection portion by a dispenser or a pin.
Claim 29
Dependent Claim
57 words
An electronic part mounting method according to claim 20, wherein said conductive layer comprises a solder; and said process of forming said conductive layer on the surface of said terminal portion or said connection portion includes a process of imparting a solder ball on the surface of said terminal portion or said connection portion by a dispenser.
Claim 30
Dependent Claim
51 words
An electronic part mounting method according to claim 20, wherein said conductive layer comprises a solder; and said process of forming said conductive layer on the surface of said terminal portion or said connection portion includes a process of covering said terminal portion or said connection portion with a molten solder.
Claim 31
Dependent Claim
40 words
An electronic part mounting method according to claim 20, wherein said conductive layer comprises a solder; and said process of forming said conductive layer on the surface of said terminal portion or said connection portion includes a solder plating process.
References Cited (Backward Citations)
US4914814A
Cited
US5186383A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-12-18 | 1999-06-19 | 1999-12-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-12-18 | 2003-06-19 | 2003-12-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-12-18 | 2007-06-19 | 2007-12-19 | $7700.00 | Window Closed / Lapsed |