Low cost CCD packaging

Abstract

Abstract A packaging solution for CCD devices and other opto-electronic applications that offers a lower cost, automated assembly process. A package made of a moldable plastic material with low moisture permeability, and high dimensional stability by employing materials such as liquid crystal polymer. While relatively high cost plastic materials may be used, the overall cost is expected to be substantially lower than a corresponding ceramic package. An interconnect circuit pattern is then be formed on the plastic using one of a variety of plating options known in the circuit board, and in the molded interconnect industry. The ability to mold a flexible circuits into the package results from the use of these materials. Conductors of standard materials in the circuit board industry; e.g., copper with selective nickel and gold plating are employed on a non reflective substrate surface. The CCD sensor is mounted to this plastic substrate and connected to the conductive pattern using standard wire bonding processes. In order to support a transparent cover glass which protects the CCD sensor, a supporting ring frame can be molded into the plastic. This support ring would surround the CCD sensor, and provide a means of supporting the cover glass. The plastic substrate would then be interconnected to the external world via the integral flexible circuit. Standard zero insertion flexible circuit connectors would be the preferred method of connecting the flexible circuit to the system electronics. The use of anisotropic adhesives or traditional butt joint soldering techniques might also be used depending upon the application.

Inventors

• 👤 Keith E. Wetzel

Bibliographic Details