US4812420A
Expired / Lapsed
US
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Method of producing a semiconductor device having a light transparent window
Assignee: Mitsubishi Electric Corp
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Filing: 1987-09-30
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Granted: 1989-03-14
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Expires: 2007-09-30
Abstract
Abstract A method of producing a semiconductor device having a light transparent window, includes: a process of die bonding a chip onto a lead frame; a process of attaching a wall surrounding a picture element to either of the external contour surface of the surface of the chip or the light transparent window surrounding the picture element; a process of inserting the chip and the light transparent window into a metal mold in such a manner that an empty closed space is produced between the chip and the light transparent window via the wall; and a process of plastic molding the device except for the light transparent window by filling resin into the metal mold and making the resin hardened.
Inventors
- 👤 Sadamu Matsuda
- 👤 Kunito Sakai
- 👤 Takashi Takahama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 06:14
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; H10W; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/49146; Y10T29/49155; Y10T29/49158
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
94 words
A method of producing a semiconductor device having a light transparent window, comprising the steps of: die bonding a semiconductor chip onto a lead frame; attaching a wall surrounding a picture element of said chip to an external contour surface of said chip; inserting said chip and said light transparent window into a metal mold and forming an empty closed space between said chip and said light transparent window via said wall; and plastic molding the device except for said light transparent window by filling resin into said metal mold and hardening said resin.
Claim 2
Independent Claim
94 words
A method of producing a semiconductor device having a light transparent window, comprising the steps of: die bonding a semiconductor chip onto a lead frame; attaching a wall surrounding a picture element of said chip to an external contour surface of said chip; inserting said chip and said light transparent window into a metal mold and forming an empty closed space between said chip and said light transparent window via said wall; and plastic molding the device except for said light transparent window by filling resin into said metal mold and hardening said resin.
Claim 3
Dependent Claim
26 words
A method of producing a semiconductor device having a light transparent window as defined in claim 1, wherein said wall comprises silicon rubber or polyimide resin.
Claim 4
Dependent Claim
30 words
A method of producing a semiconductor device having a light transparent window as defined in claim 1, wherein said window is comprised of thermo-hardening transparent resin or thermo-plasticity transparent resin.
Claim 5
Dependent Claim
23 words
A method of producing a semiconductor device having a light transparent window as defined in claim 1, wherein said window comprises glass material.
Claim 6
Dependent Claim
63 words
A method of producing a semiconductor device having a light transparent window as defined in claim 1, wherein said chip is position determined into a first metal mold, said window is position determined into a second metal mold, said first and second metal molds are position determined over each other, so as to overlap and resin is filled into said overlapped metal molds.
Claim 7
Dependent Claim
35 words
A method of producing a semiconductor device having a light transparent window as defined in claim 5, wherein the position determination of said window into said second metal mold is conducted utilizing a knockout pin.
Claim 8
Dependent Claim
52 words
A method of producing a semiconductor device having a light transparent window as defined in claim 5, wherein the position determination of said window into said second metal mold is conducted utilizing an absorption breakthrough hole provided at a portion of said second metal mold which is in contact with said window.
Claim 9
Dependent Claim
43 words
A method of producing a semiconductor device having a light transparent window as defined in claim 5, wherein the surface of said second metal mold in contact with said window is a mirror surface having a surface roughness of lower than 2 μm.
Claim 10
Dependent Claim
25 words
A method of producing a semiconductor device having a light transparent window as defined in claim 1, wherein said wall is produced by screen printing.
Claim 11
Dependent Claim
34 words
A method of producing a semiconductor device having a light transparent window as defined in claim 1, wherein said metal mold is provided with means for reducing stress stored inside of said molding resin.
Claim 12
Independent Claim
102 words
A method of producing a semiconductor device having a light transparent window, comprising the steps of: producing a wall surrounding a picture element of a semiconductor chip at the external contour surface of said chip surrounding said picture element; die bonding said chip onto a lead frame after producing said wall; inserting said chip and said light transparent window into a metal mold and forming an empty closed space between said chip and said light transparent window via said wall; and plastic sealing the device except for said light transparent window by filling resin into said metal mold and hardening said resin.
Claim 13
Independent Claim
102 words
A method of producing a semiconductor device having a light transparent window, comprising the steps of: producing a wall surrounding a picture element of a semiconductor chip at the external contour surface of said chip surrounding said picture element; die bonding said chip onto a lead frame after producing said wall; inserting said chip and said light transparent window into a metal mold and forming an empty closed space between said chip and said light transparent window via said wall; and plastic sealing the device except for said light transparent window by filling resin into said metal mold and hardening said resin.
Claim 14
Dependent Claim
26 words
A method of producing a semiconductor device having a light transparent window as defined in claim 11, wherein said wall comprises silicon rubber or polyimide resin.
Claim 15
Dependent Claim
33 words
A method of producing a semiconductor device having a light transparent window as defined in claim 11, wherein said window is comprised of material chosen from thermo-hardening transparent resin or thermo-plasticity transparent resin.
Claim 16
Dependent Claim
23 words
A method of producing a semiconductor device having a light transparent window as defined in claim 11, wherein said material comprises glass material.
Claim 17
Dependent Claim
63 words
A method of producing a semiconductor device having a light transparent window as defined in claim 11, wherein said chip is position determined into a first metal mold, said window is position determined into a second metal mold, said first and second metal molds are position determined over each other so as to overlap, and resin is filled into said overlapped metal molds.
Claim 18
Dependent Claim
35 words
A method of producing a semiconductor device having a light transparent window as defined in claim 15, wherein the position determination of said window into said second metal mold is conducted utilizing a knockout pin.
Claim 19
Dependent Claim
52 words
A method of producing a semiconductor device having a light transparent window as defined in claim 15, wherein the position determination of said window into said second metal mold is conducted utilizing an absorption breakthrough hole provided at a portion of said second metal mold which is in contact with said window.
Claim 20
Dependent Claim
43 words
A method of producing a semiconductor device having a light transparent window as defined in claim 15, wherein the surface of said second metal mold in contact with said window is a mirror surface having a surface roughness of lower than 2 μm.
Claim 21
Dependent Claim
25 words
A method of producing a semiconductor device having a light transparent window as defined in claim 11, wherein said wall is produced by screen printing.
Claim 22
Dependent Claim
34 words
A method of producing a semiconductor device having a light transparent window as defined in claim 11, wherein said metal mold is provided with means for reducing stress stored inside of said molding resin.
Claim 23
Independent Claim
92 words
A method of producing a semiconductor device having a light transparent window, comprising the steps of: die bonding a semiconductor chip to a lead frame; attaching a wall which is to surround a picture element of said chip to said light transparent window; inserting said chip and said light transparent window into a metal mold snd forming an empty closed space between said chip and said window via said wall; and plastic molding said device except for said light transparent window by filling resin into said metal mold and hardening said resin.
Claim 24
Independent Claim
92 words
A method of producing a semiconductor device having a light transparent window, comprising the steps of: die bonding a semiconductor chip to a lead frame; attaching a wall which is to surround a picture element of said chip to said light transparent window; inserting said chip and said light transparent window into a metal mold snd forming an empty closed space between said chip and said window via said wall; and plastic molding said device except for said light transparent window by filling resin into said metal mold and hardening said resin.
References Cited (Backward Citations)
US3622419A
Cited
JPS5548943A
Cited
JPS5931043A
Cited
JPS60193345A
Cited
JPS61163644A
Cited
JPS61233241A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1992-03-13 | 1992-09-12 | 1993-03-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-13 | 1996-09-12 | 1997-03-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-13 | 2000-09-12 | 2001-03-14 | $7700.00 | Window Closed / Lapsed |