Patent US5986335A successfully refreshed from Google Patents.
US5986335A
Expired / Lapsed
US
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Semiconductor device having a tapeless mounting
Assignee: Texas Instruments Inc
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Filing: 1996-11-27
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Granted: 1999-11-16
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Expires: 2016-11-27
Abstract
Abstract A semiconductor device having a photosensitive thermosetting resin layer 64 provided on top of a protective film 13 for a semiconductor chip 10. A lead frame 11 is affixed to the surface of this photosensitive thermosetting resin layer 64 only at support pin sections 60, 61, and this lead frame 11 is electrically connected to the surface of semiconductor chip 10. Breakage of the wiring and chip cracking are prevented after the pressure-bonding mounting of the lead frame. Because package cracking and package warping are better controlled in thermal processes such as such as IR reflow and resin sealing, a lower cost semiconductor device and manufacturing method are enabled.
Inventors
- 👤 Masazumi Amagai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 17:50
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/417; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07338; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/981; H10W72/983; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
54 words
A semiconductor device comprising: a semiconductor chip having electrical circuits; a tapeless mounting for a lead frame comprising: a photosensitive insulating thermosetting resin layer affixed to the semiconductor chip and patterned to expose bond pad areas on the chip; and a lead frame affixed to the semiconductor chip by the photosensitive thermosetting, resin layer.
Claim 2
Dependent Claim
54 words
A semiconductor device comprising: a semiconductor chip having electrical circuits; a tapeless mounting for a lead frame comprising: a photosensitive insulating thermosetting resin layer affixed to the semiconductor chip and patterned to expose bond pad areas on the chip; and a lead frame affixed to the semiconductor chip by the photosensitive thermosetting, resin layer.
Claim 3
Dependent Claim
74 words
A semiconductor device comprising: a semiconductor chip having electrical circuits: a tapeless mounting for a lead frame comprising: a photosensitive thermosetting resin layer affixed to the semiconductor chip: and a lead frame affixed to the semiconductor chip by the photosensitive thermosetting resin layer, wherein the lead frame comprises an inner lead section, an outer lead section, and a support pin section, with only the support pin section affixed to the photosensitive thermosetting resin layer.
Claim 4
Dependent Claim
74 words
A semiconductor device comprising: a semiconductor chip having electrical circuits: a tapeless mounting for a lead frame comprising: a photosensitive thermosetting resin layer affixed to the semiconductor chip: and a lead frame affixed to the semiconductor chip by the photosensitive thermosetting resin layer, wherein the lead frame comprises an inner lead section, an outer lead section, and a support pin section, with only the support pin section affixed to the photosensitive thermosetting resin layer.
Claim 5
Dependent Claim
23 words
The device of claim 2 further comprising: a protective film on the semiconductor chip, on which the photosensitive thermosetting resin layer is disposed.
Claim 6
Dependent Claim
33 words
The device of claim 2 wherein the inner lead section is separated by placing it at a spacing of about 0.010 to 0.20 mm from the surface of the photosensitive thermosetting resin layer.
Claim 7
Dependent Claim
20 words
The device of claim 2 wherein the photosensitive thermosetting resin layer comprises a polyimide resin 20 to 40 μm thick.
Claim 8
Dependent Claim
20 words
The device of claim 5 wherein the glass transition point of the photosensitive thermosetting polyimide resin layer is 245-350° C.
Claim 9
Dependent Claim
22 words
The device of claim 5 wherein the surface roughness (Ra) of the photosensitive thermosetting polyimide resin layer is less than 3.0 nm.
Claim 10
Dependent Claim
53 words
The device of claim 2 wherein the semiconductor chip has bonding pads coupled to the electrical circuit, and the lead frame and the bonding pads are wire bonded in a region wherein the photosensitive thermosetting resin layer has been selectively removed and the semiconductor chip's entire body is sealed with a molding resin.
Claim 11
Dependent Claim
30 words
The device of claim 2 wherein the lead frame comprises a first lead frame section used for signal lines and a second lead frame section used for power supply lines.
Claim 12
Dependent Claim
58 words
A semiconductor device comprising: a semiconductor chip having electrical circuits; a tapeless mounting for a lead frame comprising: a photosensitive thermosetting resin layer affixed to the semiconductor chip; and a lead frame affixed to the semiconductor chip by the photosensitive thermosetting polyimide resin layer 20 to 40 μm thick, and having a glass transition point of 245-350° C.
Claim 13
Dependent Claim
58 words
A semiconductor device comprising: a semiconductor chip having electrical circuits; a tapeless mounting for a lead frame comprising: a photosensitive thermosetting resin layer affixed to the semiconductor chip; and a lead frame affixed to the semiconductor chip by the photosensitive thermosetting polyimide resin layer 20 to 40 μm thick, and having a glass transition point of 245-350° C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-15 | 2003-05-17 | 2003-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-15 | 2007-05-17 | 2007-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-15 | 2011-05-17 | 2011-11-16 | $7700.00 | Window Closed / Lapsed |