US5261156A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of electrically connecting an integrated circuit to an electric device
Assignee: Semiconductor Energy Laboratory Co Ltd
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Filing: 1992-02-26
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Granted: 1993-11-16
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Expires: 2012-02-26
Abstract
Abstract An integrated circuit is mounted on and electrically connected to an electric device with an adhesive therebetween. The adhesive comprises a photo-curable resin and a heat-curable resin. After mounted on the electric device, the integrated circuit is temporarily adhered to the device by exposing the adhesive to a ultraviolet light in order to cure only the photo-curable component of the adhesive. The operation of the electric device connected to the integrated circuit is then tested. If the integrated circuit is faulty, it is replaced. If faultless, the integrated circuit is permanently fixed to the electric device by heating to completely cure the adhesive.
Inventors
- 👤 Akira Mase
- 👤 Hideki Nemoto
- 👤 Shunpei Yamazaki
- 👤 Yasuhiko Takemura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 01:06
CPC Classifications
C; C03; C03C; C03C27/00; H; H05; H05K; H05K13/00; H05K13/04; H05K13/046; H05K13/0469; H05K13/0486; H10; H10P; H10P74/00; H10P74/23; H10W; H10W20/00; H10W20/40; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/073; H10W72/07331; H10W72/20; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
135 words
A method of electrically connecting an integrated circuit to an electric device comprising the steps of: mounting said integrated circuit on said electric device with an adhesive disposed therebetween in order that terminals of said integrated circuit and said electric device to be electrically coupled are aligned with each other, said adhesive comprising a mixture of different substances which are cured in different conditions; curing one of said different substances of the same adhesive in a first curing condition in order to temporarily adhere said integrated circuit to said electric device; testing either or both of said integrated circuit and the electrical connection thereof with said electric device; and fixing said integrated circuit to said electric device by curing another of said different substances in a second curing condition different than said first curing condition.
Claim 2
Independent Claim
135 words
A method of electrically connecting an integrated circuit to an electric device comprising the steps of: mounting said integrated circuit on said electric device with an adhesive disposed therebetween in order that terminals of said integrated circuit and said electric device to be electrically coupled are aligned with each other, said adhesive comprising a mixture of different substances which are cured in different conditions; curing one of said different substances of the same adhesive in a first curing condition in order to temporarily adhere said integrated circuit to said electric device; testing either or both of said integrated circuit and the electrical connection thereof with said electric device; and fixing said integrated circuit to said electric device by curing another of said different substances in a second curing condition different than said first curing condition.
Claim 3
Dependent Claim
51 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 1 further comprising a step of pressing said integrated circuit to said electric device after said mounting step in order to insure electrical connection between the terminals of said integrated circuit and said electric device.
Claim 4
Dependent Claim
38 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 1 wherein the proportion of the said different substance curable in said first condition is no more than 20% of said mixture.
Claim 5
Dependent Claim
30 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 1 wherein said different substance curable in said first condition is a photo-curable resin.
Claim 6
Dependent Claim
30 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 4 wherein said different substance curable in said second condition is a heat-curable resin.
Claim 7
Dependent Claim
25 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 1 wherein said integrated circuit is an IC chip.
Claim 8
Dependent Claim
29 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 1 wherein said integrated circuit comprises thin film transistors formed on a substrate.
Claim 9
Dependent Claim
24 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 1 wherein said substrate is a glass substrate.
Claim 10
Dependent Claim
24 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 1 wherein said substrate is a quartz substrate.
Claim 11
Dependent Claim
27 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 1 wherein said electric device is a liquid crystal display panel.
Claim 12
Dependent Claim
25 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 1 wherein said electric device is a thermal head.
Claim 13
Dependent Claim
25 words
The method of electrically connecting an integrated circuit to an electric device as claimed in claim 1 wherein said electric device is a LED array.
Claim 14
Independent Claim
154 words
A method of electrically connecting an integrated circuit to an electric device comprising the steps of: mounting said integrated circuit on said electric device with an adhesive disposed therebetween in order that terminals of said integrated circuit and said electric device to be electrically coupled are aligned with each other, said adhesive comprising a mixture of different substances which are cured in different conditions; curing one of said different substances of the same adhesive in a first curing condition in order to temporarily adhere said integrated circuit to said electric device; testing either or both of said integrated circuit and the electrical connection thereof with said electric device; and fixing said integrated circuit to said electric device by curing another of said different substances in a second curing condition different than said first curing condition, wherein the proportion of said different substance curable in said first condition is 2% to 20% of said mixture.
Claim 15
Independent Claim
154 words
A method of electrically connecting an integrated circuit to an electric device comprising the steps of: mounting said integrated circuit on said electric device with an adhesive disposed therebetween in order that terminals of said integrated circuit and said electric device to be electrically coupled are aligned with each other, said adhesive comprising a mixture of different substances which are cured in different conditions; curing one of said different substances of the same adhesive in a first curing condition in order to temporarily adhere said integrated circuit to said electric device; testing either or both of said integrated circuit and the electrical connection thereof with said electric device; and fixing said integrated circuit to said electric device by curing another of said different substances in a second curing condition different than said first curing condition, wherein the proportion of said different substance curable in said first condition is 2% to 20% of said mixture.
Claim 16
Independent Claim
97 words
A method of mounting an IC chip on a substrate comprising the steps of: placing an IC chip on a substrate having wirings with a curable adhesive mixture therebetween so that terminals of said IC chip are coupled with corresponding terminals of said wirings, said adhesive mixture comprising two different adhesives which are curable by different conditions; curing one of said adhesives in order to temporarily attach said chip to said substrate; testing an operation of said IC chip; and curing the other one of said adhesives in order to tightly attach said chip to said substrate.
Claim 17
Independent Claim
97 words
A method of mounting an IC chip on a substrate comprising the steps of: placing an IC chip on a substrate having wirings with a curable adhesive mixture therebetween so that terminals of said IC chip are coupled with corresponding terminals of said wirings, said adhesive mixture comprising two different adhesives which are curable by different conditions; curing one of said adhesives in order to temporarily attach said chip to said substrate; testing an operation of said IC chip; and curing the other one of said adhesives in order to tightly attach said chip to said substrate.
Claim 18
Dependent Claim
14 words
The method of claim 14 wherein said substrate is for a liquid crystal panel.
Claim 19
Dependent Claim
10 words
The method of claim 14 wherein said substrate is glass.
Claim 20
Dependent Claim
11 words
The method of claim 15 wherein said wirings are conductive strips.
Claim 21
Dependent Claim
21 words
The method of claim 15 wherein said one of the adhesives is photocurable adhesive and the other one is heatcurable adhesive.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-15 | 1997-05-17 | 1997-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-15 | 2001-05-17 | 2001-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-15 | 2005-05-17 | 2005-11-16 | $7700.00 | Window Closed / Lapsed |