US5976964A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of improving interconnect of semiconductor device by utilizing a flattened ball bond
Assignee: Round Rock Research LLC
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Filing: 1997-04-22
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Granted: 1999-11-02
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Expires: 2017-04-22
Abstract
Abstract A method of forming a semiconductor device assembly comprising forming a wire bump on at least one bond pad on the active surface of a semiconductor device and connecting one end of a wire to the wire bump using a wire bond. The wire bump may be flattened before connecting one end of a wire thereto.
Inventors
- 👤 Michael B. Ball
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:28
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/0711; H10W72/50; H10W72/01; H10W72/015; H10W72/01551; H10W72/07141; H10W72/07511; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/07555; H10W72/521; H10W72/522; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5434; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/5528; H10W72/555; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
85 words
A method of forming a semiconductor device assembly, said method comprising: providing a semiconductor device having an active surface having at least one bond pad thereon; forming a wire bump on at least one bond pad on the active surface of the semiconductor device; connecting one end of a wire to the wire bump using a ball-type wire bond; providing a lead frame having at least one lead finger thereon; and connecting another end of the wire to the lead finger using a wire bond.
Claim 2
Independent Claim
85 words
A method of forming a semiconductor device assembly, said method comprising: providing a semiconductor device having an active surface having at least one bond pad thereon; forming a wire bump on at least one bond pad on the active surface of the semiconductor device; connecting one end of a wire to the wire bump using a ball-type wire bond; providing a lead frame having at least one lead finger thereon; and connecting another end of the wire to the lead finger using a wire bond.
Claim 3
Dependent Claim
23 words
The method of claim 1, further comprising the step of: flattening the wire bump before bonding the one end of the wire thereto.
Claim 4
Dependent Claim
22 words
The method of claim 1, wherein the bond pad is a multi-layer bond pad including at least two layers of different metal.
Claim 5
Dependent Claim
41 words
The method of claim 1, wherein the wire bond connecting the one end of the wire to the bond pad of the semiconductor device includes a ball-type wire bond having one of a larger diameter and size than the wire bump.
Claim 6
Dependent Claim
29 words
The method of claim 2, wherein the wire bond connecting the one end of the wire to the bond pad of the semiconductor device includes a wedge-type wire bond.
Claim 7
Dependent Claim
14 words
The method of claim 1, wherein the wire bump includes a gold wire bump.
Claim 8
Dependent Claim
12 words
The method of claim 1, wherein the wire includes a gold wire.
Claim 9
Dependent Claim
14 words
The method of claim 1, wherein the wire bump includes a flattened wire bump.
Claim 10
Dependent Claim
15 words
The method of claim 1, wherein the wire bump includes a hemispherically shaped wire bump.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-01 | 2003-05-03 | 2003-11-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-01 | 2007-05-03 | 2007-11-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-01 | 2011-05-03 | 2011-11-02 | $7700.00 | Window Closed / Lapsed |