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US5656830A Expired / Lapsed US ⏱️ 0.0 years remaining

Integrated circuit chip composite having a parylene coating

Assignee: International Business Machines Corp
•
Filing: 1992-12-10
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Granted: 1997-08-12
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Expires: 2012-12-10
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Abstract

Abstract A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.

Inventors

  • 👤 John Harold Zechman

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 15:38
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20; H10W42/261; H10W42/276; H10W44/00; H10W44/601; H10W70/00; H10W70/40; H10W70/464; H10W70/465; H10W70/466; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W74/40; H10W74/47; H10W44/20; H10W44/203; H10W44/209; H10W44/212; H10W72/00; H10W72/01; H10W72/015; H10W72/01515; H10W72/071; H10W72/075; H10W72/07531; H10W72/07536; H10W72/07551; H10W72/07552; H10W72/50; H10W72/521; H10W72/522; H10W72/523; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/555; H10W72/59; H10W72/90; H10W72/951; H10W72/952; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171

Claims Analysis

Total Claims: 20
Claim 1
Independent Claim 63 words
A composite comprising an integrated circuit chip having an electrically conductive site thereon; electrically conductive lead; electrically conductive wire interconnecting said conductive site and said electrically conductive lead, wherein said wire is at least 3 mm long and is conformably coated with a dielectric material, and wherein said dielectric material is parylene and further comprising an electrically conducting coating on said dielectric material.
Claim 2
Dependent Claim 63 words
A composite comprising an integrated circuit chip having an electrically conductive site thereon; electrically conductive lead; electrically conductive wire interconnecting said conductive site and said electrically conductive lead, wherein said wire is at least 3 mm long and is conformably coated with a dielectric material, and wherein said dielectric material is parylene and further comprising an electrically conducting coating on said dielectric material.
Claim 3
Dependent Claim 12 words
The composite of claim 1 wherein said electrically conductive site is aluminum.
Claim 4
Dependent Claim 12 words
The composite of claim 1 wherein said electrically conductive lead is copper.
Claim 5
Dependent Claim 13 words
The composite of claim 1 wherein said electrically conductive lead is gold-plated copper.
Claim 6
Dependent Claim 12 words
The composite of claim 1 wherein said dielectric material is parylene N.
Claim 7
Dependent Claim 15 words
The composite of claim 1 wherein said dielectric material is 0.0001 to 0.001 inches thick.
Claim 8
Dependent Claim 14 words
The composite of claim 1 wherein said dielectric is 0.0001 to 0.0003 inches thick.
Claim 9
Dependent Claim 14 words
The composite of claim 1 wherein said wire is 0.0005 to 0.003 inches thick.
Claim 10
Dependent Claim 14 words
The composite of claim 1 wherein said wire is at least 5 mm long.
Claim 11
Dependent Claim 11 words
The composite of claim 1 wherein said wire is gold wire.
Claim 12
Dependent Claim 24 words
The composite of claim 1 wherein said chip, said wire and a portion of said conductive lead are conformably coated with said dielectric material.
Claim 13
Dependent Claim 25 words
The composite of claim 1 which further includes an encapsulating composition that encapsulates said chip, said wire and a portion of said electrically conductive lead.
Claim 14
Dependent Claim 13 words
The composite of claim 12 wherein said encapsulating composition is an epoxy composition.
Claim 15
Dependent Claim 12 words
The composite of claim 1 wherein said electrically conductive coating is aluminum.
Claim 16
Dependent Claim 24 words
The composite of claim 14 which further includes an encapsulating composition that encapsulates said chip, said wire and a portion of said copper leads.
Claim 17
Dependent Claim 56 words
A composite comprising an integrated circuit chip having an electrically conductive site thereon; electrically conductive lead; electrically conductive wire interconnecting said conductive site and said electrically conductive lead, wherein said wire is conformably coated with a dielectric material, and wherein said dielectric material is parylene, and further comprising an electrically conductive coating on said dielectric material.
Claim 18
Dependent Claim 56 words
A composite comprising an integrated circuit chip having an electrically conductive site thereon; electrically conductive lead; electrically conductive wire interconnecting said conductive site and said electrically conductive lead, wherein said wire is conformably coated with a dielectric material, and wherein said dielectric material is parylene, and further comprising an electrically conductive coating on said dielectric material.
Claim 19
Dependent Claim 12 words
The composition of claim 16 wherein said electrically conductive coating is aluminum.
Claim 20
Dependent Claim 12 words
The composition of claim 17 wherein said electrically conductive coating is aluminum.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2000-08-11 2001-02-10 2001-08-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2004-08-11 2005-02-10 2005-08-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2008-08-11 2009-02-10 2009-08-12 $7700.00 Window Closed / Lapsed

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