US3566208A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Pin socket
Assignee: Fairchild Semiconductor Corp
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Filing: 1968-02-02
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Granted: 1971-02-23
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Expires: 1988-02-02
Abstract
Abstract A semiconductor device assembly including an insulating substrate and a plurality of L-shaped pins disposed around the periphery of the substrate. The pins fit in slots on the top surface of the substrate and the semiconductor device is centrally located with respect to the pins adjacent the substrate. Electrical connections are made between portions of the device and the pins. The entire device, pins, and substrate are covered with an insulating coating.
Inventors
- 👤 Chan H Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 09:56
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W76/00; H10W76/40
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
29 words
The semiconductoR device assembly of claim 1 further characterized by said insulating coating having two layers, a first layer of one insulating material and a second layer of another.
Claim 2
Dependent Claim
21 words
The semiconductor device assembly of claim 2 further characterized by said two layers each being a different type of epoxy compound.
Claim 3
Dependent Claim
26 words
The semiconductor device assembly of claim 1 further characterized by said pins being secured in the holes in said substrate by means of a sealing glass.
Claim 4
Dependent Claim
32 words
The semiconductor device assembly of claim 1 further characterized by said substrate having a centrally located raised area on the side thereof opposite the side upon which said semiconductor device is mounted.
Claim 5
Dependent Claim
25 words
The semiconductor device assembly of claim 1 further characterized by said semiconductor device being mounted upon said substrate by means of a metallic bonding layer.
Claim 6
Dependent Claim
34 words
The semiconductor device assembly of claim 1 further characterized by said semiconductor device being mounted on said substrate in approximately the same plane as the said plane of the upper surface of said slots.
Claim 7
Dependent Claim
29 words
The semiconductor device assembly of claim 1 further characterized by said substrate having a peripheral edge portion raised above the said plane of the upper surface of said slots.
Claim 8
Dependent Claim
31 words
The semiconductor device assembly of claim 1 further characterized by said second portions of said pins having a substantially flat upper surface to enable easy attachment of wires to said surface.
Claim 9
Dependent Claim
23 words
The semiconductor device assembly of claim 1 further characterized by said substrate being substantially circular, but having one flat edge along its circumference.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-02-22 | 1974-08-24 | 1975-02-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-02-22 | 1978-08-24 | 1979-02-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-02-22 | 1982-08-24 | 1983-02-23 | $7700.00 | Window Closed / Lapsed |