Component of printed circuit boards

Claim 1

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board a laminate constructed of a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element and a sheet of aluminum which constitutes a discardable element; one surface of each of the copper sheet and the aluminum sheet being essentially uncontaminated and engagable with each other at an interface; a band of flexible adhesive joining the uncontaminated surfaces of the sheets together at their borders and defining a substantially uncontaminated central zone inwardly of the edges of the sheets and unjoined at the interface; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 2

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board a laminate constructed of a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element and a sheet of aluminum which constitutes a discardable element; one surface of each of the copper sheet and the aluminum sheet being essentially uncontaminated and engagable with each other at an interface; a band of flexible adhesive joining the uncontaminated surfaces of the sheets together at their borders and defining a substantially uncontaminated central zone inwardly of the edges of the sheets and unjoined at the interface; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 3

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board a laminate constructed of two sheets of copper foil which, in a finished printed circuit board, constitute functional elements and a sheet of aluminum which constitutes a discardable element; one surface of each of the copper sheet and both surfaces of the aluminum sheets being essentially uncontaminated and engagable with each other at interfaces; a band of flexible adhesive joining each of the uncontaminated surfaces of the copper sheets to opposite uncontaminated surfaces of the aluminum sheet at their borders and defining two substantially uncontaminated central zones inwardly of the edges of the sheets on opposite sides of the aluminum sheet; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 4

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board a laminate constructed of two sheets of copper foil which, in a finished printed circuit board, constitute functional elements and a sheet of aluminum which constitutes a discardable element; one surface of each of the copper sheet and both surfaces of the aluminum sheets being essentially uncontaminated and engagable with each other at interfaces; a band of flexible adhesive joining each of the uncontaminated surfaces of the copper sheets to opposite uncontaminated surfaces of the aluminum sheet at their borders and defining two substantially uncontaminated central zones inwardly of the edges of the sheets on opposite sides of the aluminum sheet; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 5

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board, a laminate constructed of a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element and a sheet of aluminum which constitutes a discardable element; one surface of each of the copper sheet and the aluminum sheet being essentially uncontaminated and engagable with each other at an interface; at least one island of flexible, water soluble, adhesive joining the uncontaminated surfaces of the sheets at a predetermined location spaced inwardly from an edge of the joined sheets; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 6

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board, a laminate constructed of a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element and a sheet of aluminum which constitutes a discardable element; one surface of each of the copper sheet and the aluminum sheet being essentially uncontaminated and engagable with each other at an interface; at least one island of flexible, water soluble, adhesive joining the uncontaminated surfaces of the sheets at a predetermined location spaced inwardly from an edge of the joined sheets; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 7

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board, a laminate constructed of two sheets of copper foil which, in a finished printed circuit board, constitute functional elements and a sheet of aluminum which constitutes a discardable element; one surface of each of the copper sheets and both surfaces of the aluminum sheet being essentially uncontaminated and engagable with each other at an interface; at least one island of flexible, water soluble, adhesive on each side of the aluminum sheet joining the uncontaminated surfaces of the sheets at a predetermined location spaced inwardly from an edge of the joined sheets; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 8

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board, a laminate constructed of two sheets of copper foil which, in a finished printed circuit board, constitute functional elements and a sheet of aluminum which constitutes a discardable element; one surface of each of the copper sheets and both surfaces of the aluminum sheet being essentially uncontaminated and engagable with each other at an interface; at least one island of flexible, water soluble, adhesive on each side of the aluminum sheet joining the uncontaminated surfaces of the sheets at a predetermined location spaced inwardly from an edge of the joined sheets; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 9

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board, a laminate constructed of a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element and a sheet of aluminum which constitutes a discardable element; a band of flexible adhesive joining the uncontaminated surfaces of the sheets together at their borders and defining a substantially uncontaminated central zone inwardly of the edges of the sheets and unjoined at the interface; at least one island of flexible, water soluble adhesive joining the uncontaminated surfaces of the sheets at a predetermined location spaced inwardly from the band; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 10

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board, a laminate constructed of a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element and a sheet of aluminum which constitutes a discardable element; a band of flexible adhesive joining the uncontaminated surfaces of the sheets together at their borders and defining a substantially uncontaminated central zone inwardly of the edges of the sheets and unjoined at the interface; at least one island of flexible, water soluble adhesive joining the uncontaminated surfaces of the sheets at a predetermined location spaced inwardly from the band; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 11

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board, a laminate constructed of two sheets of copper foil which, in a finished printed circuit board, constitute functional elements and a sheet of aluminum which constitutes a discardable element; one surface of each of the copper sheets and both surfaces of the aluminum sheet being essentially uncontaminated and engagable with each other at interfaces; a band of flexible adhesive joining each of the uncontaminated surfaces of the copper sheets to opposite uncontaminated surfaces of the aluminum sheet at their borders and defining two substantially uncontaminated central zones inwardly of the edges of the sheets on opposite sides of the aluminum sheet; a plurality of islands of flexible, water soluble, adhesive on each side of the aluminum sheet joining the uncontaminated surfaces of the sheets at a predetermined location spaced inwardly from the bands; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 12

A method of making laminated printed circuit boards of the type having outer conductive metallic layers and at least one inner dielectric layer containing heat curable resin comprising the steps of: assembling a multi-layer book of circuit boards, one on top of another in a press lay-up; placing in engagement with each outer dielectric layer of a board, a laminate constructed of two sheets of copper foil which, in a finished printed circuit board, constitute functional elements and a sheet of aluminum which constitutes a discardable element; one surface of each of the copper sheets and both surfaces of the aluminum sheet being essentially uncontaminated and engagable with each other at interfaces; a band of flexible adhesive joining each of the uncontaminated surfaces of the copper sheets to opposite uncontaminated surfaces of the aluminum sheet at their borders and defining two substantially uncontaminated central zones inwardly of the edges of the sheets on opposite sides of the aluminum sheet; a plurality of islands of flexible, water soluble, adhesive on each side of the aluminum sheet joining the uncontaminated surfaces of the sheets at a predetermined location spaced inwardly from the bands; subjecting the laid-up book to heat and pressure to cure the heat curable resin; and separating the aluminum from each cured board.

Claim 13

A method of making a component for use in manufacturing printed circuit boards comprising: providing a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element and a sheet of aluminum which constitutes a discardable element; assembling the sheets together at an interface; applying flexible adhesive between the sheets to areas of the interface outwardly of a central zone to which adhesive is not applied.

Claim 14

A method of making a component for use in manufacturing printed circuit boards comprising: providing a sheet of copper foil which, in a finished printed circuit board, constitutes a functional element and a sheet of aluminum which constitutes a discardable element; assembling the sheets together at an interface; applying flexible adhesive between the sheets to areas of the interface outwardly of a central zone to which adhesive is not applied.

Claim 15

A method of making a component for use in manufacturing printed circuit boards comprising: providing two sheets of copper foil which, in a finished printed circuit board, constitute functional elements and a sheet of aluminum which constitutes a discardable element; assembling the copper sheets to opposite sides of the aluminum sheet at interfaces; applying flexible adhesive between the sheets to areas of the interfaces outwardly of central zones to which adhesive is not applied.

Claim 16

A method of making a component for use in manufacturing printed circuit boards comprising: providing two sheets of copper foil which, in a finished printed circuit board, constitute functional elements and a sheet of aluminum which constitutes a discardable element; assembling the copper sheets to opposite sides of the aluminum sheet at interfaces; applying flexible adhesive between the sheets to areas of the interfaces outwardly of central zones to which adhesive is not applied.

Claim 17

A method of making a component for use in manufacturing articles such as printed circuit boards comprising: providing a sheet of thin foil which, in a finished printed circuit board, constitutes a functional element and a substrate sheet which is thicker than the foil and which constitutes a discardable element; assembling the foil and the substrate together at an interface; applying flexible adhesive between the foil and the substrate to areas of the interface outwardly of a central zone such that the substrate facilitates the handling of the thin foil.

Claim 18

A method of making a component for use in manufacturing articles such as printed circuit boards comprising: providing a sheet of thin foil which, in a finished printed circuit board, constitutes a functional element and a substrate sheet which is thicker than the foil and which constitutes a discardable element; assembling the foil and the substrate together at an interface; applying flexible adhesive between the foil and the substrate to areas of the interface outwardly of a central zone such that the substrate facilitates the handling of the thin foil.