US5915170A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multiple part compliant interface for packaging of a semiconductor chip and method therefor
Assignee: Adeia Semiconductor Solutions LLC
•
Filing: 1997-09-16
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Granted: 1999-06-22
•
Expires: 2017-09-16
Abstract
Abstract A method of making a multiple part compliant interface for a microelectronic package including the steps of providing a first microelectronic element having electrically conductive parts, providing an array of curable elastomer support pads in contact with the first microelectronic element, curing the curable elastomer support pads while the support pads remain in contact with the first microelectronic element and providing an array of adhesive pads in contact with the support pads, whereby each adhesive pad is disposed over and in substantial alignment with one of the support pads. A second microelectronic element having electrically conductive parts is then assembled in contact with the array of adhesive pads by abutting the second microelectronic element against the array of adhesive pads and compressing the adhesive pads and support pads between the first and second microelectronic elements. The array of adhesive pads are then cured and the electrically conductive parts of the first and second microelectronic elements are interconnected. The array of support pads define channels running between any two adjacent support pads. A flowable curable elastomer encapsulant may be disposed within the channels after the electrically connecting step. Preferably, the support pads, adhesive pads and the encapsulant comprise substantially similar materials, such as silicone, in order to avoid problems associated with thermal cycling, such as air entrapment and/or voiding.
Inventors
- 👤 Kurt Raab
- 👤 Thomas Pickett
- 👤 Thomas H. Di Stefano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:25
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4084; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/688; H10W72/00; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H05K1/00; H05K1/02; H05K1/11; H05K1/118; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0133; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/0397; H05K2201/09; H05K2201/09009; H05K2201/09081; H05K2201/091; H05K2203/00; H05K2203/06; H05K2203/063; H05K3/36; H05K3/361; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/073; H10W72/07321; H10W72/07327; H10W72/20; H10W72/851; H10W72/853; H10W72/856
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
88 words
A method of making a multiple part compliant interface for a microelectronic package comprising the steps of: providing a microelectronic element having electrically conductive parts; providing an array of curable elastomer support pads in contact with said microelectronic element; curing said curable elastomer support pads while said support pads remain in contact with said first microelectronic element; providing an array of adhesive pads in contact with said cured elastomer support pads, each said adhesive pad being disposed over and in substantial alignment with one of said support pads.
Claim 2
Independent Claim
88 words
A method of making a multiple part compliant interface for a microelectronic package comprising the steps of: providing a microelectronic element having electrically conductive parts; providing an array of curable elastomer support pads in contact with said microelectronic element; curing said curable elastomer support pads while said support pads remain in contact with said first microelectronic element; providing an array of adhesive pads in contact with said cured elastomer support pads, each said adhesive pad being disposed over and in substantial alignment with one of said support pads.
Claim 3
Dependent Claim
33 words
A method as claimed in claim 1, further comprising the step of providing a second microelectronic element having electrically conductive parts and assembling said second microelectronic element in contact with said adhesive pads.
Claim 4
Dependent Claim
16 words
A method as claimed in claim 2, further comprising the step of curing said adhesive pads.
Claim 5
Dependent Claim
40 words
A method as claimed in claim 3, wherein the assembling step includes the steps of: (a) abutting said second microelectronic element against said array of adhesive pads; (b) compressing said adhesive pads and said support pads between said microelectronic elements.
Claim 6
Dependent Claim
19 words
A method as claimed in claim 4, wherein said second microelectronic element is heated prior to the assembling step.
Claim 7
Dependent Claim
20 words
A method as claimed in claim 3, wherein the assembling step and the curing said adhesive element step occur simultaneously.
Claim 8
Dependent Claim
20 words
A method as claimed in claim 2, further including the step of electrically connecting said first and second microelectronic elements.
Claim 9
Dependent Claim
37 words
A method as claimed in claim 7, wherein the electrically connecting step further comprises the step of bonding the electrically conductive parts of said first and second microelectronic elements to one another to form electrical interconnections therebetween.
Claim 10
Dependent Claim
16 words
A method as claimed in claim 7, wherein said array of support pads define channels therebetween.
Claim 11
Dependent Claim
39 words
A method as claimed in claim 9, further comprising the steps of: disposing a curable elastomer encapsulant within said channels and between said microelectronic elements after the electrically connecting step; curing said curable elastomer encapsulant after the disposing step.
Claim 12
Dependent Claim
21 words
A method as claimed in claim 10, wherein said support pads and adhesive pads have substantially similar coefficients of thermal expansion.
Claim 13
Dependent Claim
21 words
A method as claimed in claim 10, wherein said support pads and said encapsulant have substantially similarly coefficients of thermal expansion.
Claim 14
Dependent Claim
21 words
A method as claimed in claim 10, wherein said support pads, said adhesive pads and said encapsulant comprise a silicone elastomer.
Claim 15
Dependent Claim
51 words
A method as claimed in claim 1, wherein the step of providing said array of curable elastomer support pads comprises the step of: providing a stencil having a plurality of holes therethrough atop said first microelectronic element; filling the holes in said stencil with a curable elastomer material; removing said stencil.
Claim 16
Dependent Claim
45 words
A method as claimed in claim 14, wherein the step of providing said array of curable elastomer support pads comprises the additional step of: allowing said array of curable elastomer support pads to flow after the removing said stencil step and before the curing step.
Claim 17
Dependent Claim
20 words
A method as claimed in claim 14, wherein the diameter of said holes in said stencil is between 400-500 microns.
Claim 18
Dependent Claim
17 words
A method as claimed in claim 14, wherein the thickness of said stencil is between 75-125 microns.
Claim 19
Dependent Claim
71 words
A method as claimed in claim 14, wherein the step of providing said array of adhesive pads comprises the steps of: providing a second stencil having a plurality of holes; aligning said second stencil over said support pads so that each said hole in said second stencil is in substantial alignment with one of said support pads; filling the holes in said second stencil with an adhesive; removing the second stencil.
Claim 20
Dependent Claim
22 words
A method as claimed in claim 18, wherein the diameter of each said hole in said second stencil is between 350-450 microns.
Claim 21
Dependent Claim
23 words
A method as claimed in claim 18, wherein said holes in said second stencil are smaller than said holes in said first stencil.
Claim 22
Dependent Claim
18 words
A method as claimed in claim 18, wherein the thickness of said second stencil is between 100-150 microns.
Claim 23
Dependent Claim
24 words
A method as claimed in claim 18, wherein after the removing the second stencil step the diameter of said adhesive pads remains substantially unchanged.
Claim 24
Dependent Claim
18 words
A method as claimed in claim 1, wherein said adhesive pads have greater viscosity than said support pads.
Claim 25
Dependent Claim
15 words
A method as claimed in claim 23, wherein said adhesive pads include a filler material.
Claim 26
Dependent Claim
14 words
A method as claimed in claim 24, wherein said filler material includes fumed silica.
Claim 27
Dependent Claim
18 words
A method as claimed in claim 2, wherein each said support pad includes a substantially dome-shaped top surface.
Claim 28
Dependent Claim
32 words
A method as claimed in claim 26, wherein before the assembling step each said adhesive pad includes a base which generally conforms to said substantially dome-shaped top surface of said support pad.
Claim 29
Dependent Claim
30 words
A method as claimed in claim 27, wherein after the assembling step the combination of each said support pad and said adhesive pad disposed thereover has a substantially column-like shape.
Claim 30
Dependent Claim
30 words
A method as claimed in claim 27, wherein after the assembling step the combined height of each said support pad and said adhesive pad disposed thereover is between 100-150 microns.
Claim 31
Dependent Claim
29 words
A method as claimed in claim 27, wherein after the assembling step the combined diameter of each said support pad and said adhesive pad disposed thereover between 500-600 microns.
Claim 32
Dependent Claim
17 words
A method as claimed in claim 1, wherein said first microelectronic element includes a flexible dielectric film.
Claim 33
Dependent Claim
16 words
A method as claimed in claim 1, wherein said second microelectronic element includes a semiconductor chip.
Claim 34
Dependent Claim
15 words
A method as claimed in claim 1, wherein said adhesive pads include pressure sensitive adhesive.
Claim 35
Dependent Claim
17 words
A method as claimed in claim 10, wherein the width of said channels is between 75-100 microns.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-06-21 | 2002-12-21 | 2003-06-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-06-21 | 2006-12-21 | 2007-06-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-06-21 | 2010-12-21 | 2011-06-22 | $7700.00 | Window Closed / Lapsed |