Method of assembling semiconductor integrated circuit

Claim 1

A method of assembling a semiconductor integrated circuit comprising: (a) forming a bump on an external connecting electrode on a semiconductor integrated circuit chip; (b) first, bonding a copper foil to a base film made of heatproof high molecular weight resin; (c) etching said copper foil to form a conductive pattern on a flexible film circuit substrate; (d) forming an opening in said base film; (e) forming a portion of said conductive pattern projecting into said opening; (f) forming a solder layer as a cap metal of said bump on said semiconductor integrated circuit chip; (g) treating the surface of said conductive pattern on said flexible film circuit substrate with gold; (h) mounting said semiconductor integrated circuit chip in said opening, the chip being mounted facedown on said conductive pattern projecting into said opening; and (i) second, bonding said flexible film circuit substrate and the bump of said semiconductor integrated circuit chip, wherein the first bonding step includes forming the copper foil and the base film into a integral, unitary structure, the first bonding step further includes laminating the base film and the copper foil by coating the heatproof high molecular resin with the copper foil, and the first bonding step further includes pressing the base film and the copper foil between heated rollers thereby curing the copper foil and base film into a solidified, unitary structure.

Claim 2

A method of assembling a semiconductor integrated circuit comprising: (a) forming a bump on an external connecting electrode on a semiconductor integrated circuit chip; (b) first, bonding a copper foil to a base film made of heatproof high molecular weight resin; (c) etching said copper foil to form a conductive pattern on a flexible film circuit substrate; (d) forming an opening in said base film; (e) forming a portion of said conductive pattern projecting into said opening; (f) forming a solder layer as a cap metal of said bump on said semiconductor integrated circuit chip; (g) treating the surface of said conductive pattern on said flexible film circuit substrate with gold; (h) mounting said semiconductor integrated circuit chip in said opening, the chip being mounted facedown on said conductive pattern projecting into said opening; and (i) second, bonding said flexible film circuit substrate and the bump of said semiconductor integrated circuit chip, wherein the first bonding step includes forming the copper foil and the base film into a integral, unitary structure, the first bonding step further includes laminating the base film and the copper foil by coating the heatproof high molecular resin with the copper foil, and the first bonding step further includes pressing the base film and the copper foil between heated rollers thereby curing the copper foil and base film into a solidified, unitary structure.

Claim 3

A method of assembling a semiconductor integrated circuit comprising: (a) forming a bump on an external connecting electrode on a semiconductor integrated circuit chip; (b) first, bonding a copper foil to a base film made of heatproof high molecular weight resin; (c) etching said copper foil to form a conductive pattern on a flexible film circuit substrate; (d) forming an opening in said base film; (e) forming a portion of said conductive pattern projecting into said opening; (f) forming a solder layer as a cap metal of said bump on said semiconductor integrated circuit chip; (g) treating the surface of said conductive pattern on said flexible film circuit substrate with gold; (h) mounting said semiconductor integrated circuit chip in said opening, the chip being mounted facedown on said conductive pattern projecting into said opening; and (i) second, bonding said flexible film circuit substrate and the bump of said semiconductor integrated circuit chip, wherein the second bonding step includes heating the flexible film circuit substrate and said semiconductor integrated circuit chip thereby melting the cap metal and bonding the bump to the conductive pattern on the flexible film circuit substrate and the step of heating is performed for 20 seconds at 280° to 300° C.

Claim 4

A method of assembling a semiconductor integrated circuit comprising: (a) forming a bump on an external connecting electrode on a semiconductor integrated circuit chip; (b) first, bonding a copper foil to a base film made of heatproof high molecular weight resin; (c) etching said copper foil to form a conductive pattern on a flexible film circuit substrate; (d) forming an opening in said base film; (e) forming a portion of said conductive pattern projecting into said opening; (f) forming a solder layer as a cap metal of said bump on said semiconductor integrated circuit chip; (g) treating the surface of said conductive pattern on said flexible film circuit substrate with gold; (h) mounting said semiconductor integrated circuit chip in said opening, the chip being mounted facedown on said conductive pattern projecting into said opening; and (i) second, bonding said flexible film circuit substrate and the bump of said semiconductor integrated circuit chip, wherein the second bonding step includes heating the flexible film circuit substrate and said semiconductor integrated circuit chip thereby melting the cap metal and bonding the bump to the conductive pattern on the flexible film circuit substrate and the step of heating is performed for 20 seconds at 280° to 300° C.

Claim 6

A method of assembling a semiconductor integrated circuit as claimed in claims 2 or 1 wherein said base film is continuously fed and positioned by means of index perforations formed on said base film.