← Back to Patent Explorer
US3647533A Expired / Lapsed US ⏱️ 0.0 years remaining

Substrate bonding bumps for large scale arrays

Assignee: United States Department of the Navy
•
Filing: 1969-08-08
•
Granted: 1972-03-07
•
Expires: 1989-08-08
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A method for producing reliable bonding bumps on large-scale array substrates and hybrid add-on components, the present invention is compatible with a wide variety of microcircuit components. Generally, the method envisions fabrication of bonding bumps by thin-film vacuum deposition through a mechanical mask. In particular, a first metal is deposited on a substrate to a desired thickness whereupon said first metal is then codeposited with a second metal. The bump is completed with the sole deposition of the second metal. A bump thus produced may be further processed to produce a ''''solder-dipped bump'''' or may be used in the thin-film state for component mounting.

Inventors

  • 👤 Robert E Hicks

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 19:32
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10; H10W; H10W90/00; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0317; H05K2201/0332; H05K2201/0364; H05K2201/0367; H05K3/10; H05K3/14; H05K3/143; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/251; H10W72/252; Y; Y10; Y10S; Y10S428/00; Y10S428/901

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 20 words
The method of claim 1 wherein said first conductive substance comprises chromium metal and the second conductive substance comprises tin.
Claim 2
Dependent Claim 20 words
The method of claim 1 wherein said first conductive substance comprises chromium metal and the second conductive substance comprises copper.
Claim 3
Dependent Claim 20 words
The method of claim 1 wherein said first conductive substance comprises chromium metal and the second conductive substance comprises gold.

References Cited (Backward Citations)

US2106143A Cited
US1730733A Cited
US3141794A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1975-03-07 1975-09-06 1976-03-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1979-03-07 1979-09-06 1980-03-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1983-03-07 1983-09-06 1984-03-07 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag