Patent US5908312A successfully refreshed from Google Patents.
← Back to Patent Explorer
US5908312A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device fabrication

Assignee: Nokia of America Corp
•
Filing: 1997-05-28
•
Granted: 1999-06-01
•
Expires: 2017-05-28
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A method of preventing diffusion penetration of the dopant used to dope polysilicon gate material in a MOSFET is disclosed. Atomic nitrogen is introduced into the substrate prior to gate oxide growth. The nitrogen later diffuses upward into the gate oxide and blocks subsequent ion implanted gate dopants from penetrating to the substrate. Low dosages of atomic nitrogen implantation, while not significantly affecting gate oxide growth rate, produce significant improvements in the damage immunity of thin gate oxides.

Inventors

  • 👤 Kin Ping Cheung
  • 👤 Steven James Hillenius
  • 👤 Chun-Ting Liu
  • 👤 Yi Ma
  • 👤 Pradip Kumar Roy

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 02:00
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/013; H10D64/01302; H10D64/01332; H10D64/01336; H10D64/0134; H10D64/01344; H10D64/01348; H10D64/60; H10D64/66; H10D64/68; H10D64/693; H10P; H10P30/00; H10P30/20; H10P30/202; H10P30/204; H10P30/208; H10P30/225

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 62 words
A method of semiconductor integrated circuit fabrication comprising: embedding atomic nitrogen into a substrate such that said atomic nitrogen extends to a top surface of said substrate; forming a dielectric layer upon said substrate after said embedding step; forming a material layer upon said dielectric layer; exposing said material layer to a dopant species; patterning said material layer to form a gate.
Claim 2
Independent Claim 62 words
A method of semiconductor integrated circuit fabrication comprising: embedding atomic nitrogen into a substrate such that said atomic nitrogen extends to a top surface of said substrate; forming a dielectric layer upon said substrate after said embedding step; forming a material layer upon said dielectric layer; exposing said material layer to a dopant species; patterning said material layer to form a gate.
Claim 3
Dependent Claim 13 words
The method of claim 1 in which said embedding step includes ion implantation.
Claim 4
Dependent Claim 40 words
The method of claim 2 in which said embedding step includes ion implantation which is performed at an energy between 5 KeV and 50 KeV and at a dose between 10 13 /cm 2 and 5×10 14 /cm 2 .
Claim 5
Dependent Claim 12 words
The method of claim 1 in which said material layer is polysilicon.
Claim 6
Dependent Claim 12 words
The method of claim 1 in which said dopant species is boron.
Claim 7
Dependent Claim 14 words
The method of claim 1 in which said dielectric is thermally grown silicon dioxide.
Claim 8
Dependent Claim 26 words
The method of claim 6 in which said dielectric is formed by exposing said substrate to oxygen at a temperature between 700° C. and 1000° C.
Claim 9
Dependent Claim 19 words
The method of claim 1 in which the thickness of said dielectric is between 10 Å and 200 Å.
Claim 10
Dependent Claim 18 words
The method of claim 1 in which the thickness of said material layer is between 500Å and 3000Å.
Claim 11
Dependent Claim 22 words
The method of claim 1 in which said dielectric is formed by exposing said substrate to an atmosphere of N 2 O.
Claim 12
Dependent Claim 18 words
The method of claim 10 in which said exposure occurs at a temperature between 800 and 900° C.
Claim 13
Dependent Claim 22 words
The method of claim 3 in which the dose is about 1×10 14 /cm 2 to about 5×10 14 /cm 2 .

References Cited (Backward Citations)

US5330920A Cited
US5385630A Cited
US5316965A Cited
US5596218A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-05-31 2002-11-30 2003-06-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-05-31 2006-11-30 2007-06-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-05-31 2010-11-30 2011-06-01 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag