Patent US5891348A successfully refreshed from Google Patents.
← Back to Patent Explorer
US5891348A Expired / Lapsed US ⏱️ 0.0 years remaining

Process gas focusing apparatus and method

Assignee: Applied Materials Inc
•
Filing: 1996-01-26
•
Granted: 1999-04-06
•
Expires: 2016-01-26
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract An apparatus (20) for uniformly processing substrates (25) having a surface with a center (80) and a peripheral edge (85). The apparatus (20) comprises (i) a process chamber (30) having a gas distributor (55) for distributing process gas in the process chamber (30); (ii) a support (75) for supporting a substrate (25) in the process chamber (30); (iii) a plasma generator for forming a plasma from the process gas in the process chamber (30); and (iv) a focus ring (90) in the process chamber (30). The focus ring (90) comprises (a) a wall (95) surrounding the substrate (25) to substantially contain the plasma on the substrate surface, and (b) a channel (100) in the wall (95). The channel (100) has an inlet (105) adjacent to, and extending substantially continuously around the peripheral edge (85) of the substrate surface. The inlet (105) of the channel (100) has a width w sized to allow a sufficient amount of process gas to flow into the channel (100) to maintain substantially equal processing rates at the center (80) and peripheral edge (85) of the substrate surface.

Inventors

  • 👤 Yan Ye
  • 👤 Gerald Zheyao Yin
  • 👤 Diana Xiaobing Ma
  • 👤 Steve S. Y. Mak

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 04:43
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0418; H10P72/0421; H01; H01J; H01J37/00; H01J37/32; H01J37/32431; H01J37/3244; H01J37/32623; H01J37/32642; H10P72/70; H10P72/76; H10P72/7604; H10P72/7606; H01J37/32009; H01J37/32715; Y; Y10; Y10S; Y10S156/00; Y10S156/915

Claims Analysis

Total Claims: 64
Claim 1
Independent Claim 113 words
A method of processing a substrate in a process chamber, the method comprising the steps of: (a) placing a substrate in the process chamber, the substrate having a surface with a center and a peripheral edge; (b) introducing process gas in the process chamber, and maintaining the process gas at process conditions suitable for processing the substrate; and (c) maintaining around the substrate, a wall having (i) a conical surface tapering toward a peripheral edge of the substrate, and (ii) a substantially continuous channel adjacent to, and around the peripheral edge of the substrate surface, the channel having an inlet sized and configured to regulate the flow of process gas into the channel.
Claim 2
Independent Claim 113 words
A method of processing a substrate in a process chamber, the method comprising the steps of: (a) placing a substrate in the process chamber, the substrate having a surface with a center and a peripheral edge; (b) introducing process gas in the process chamber, and maintaining the process gas at process conditions suitable for processing the substrate; and (c) maintaining around the substrate, a wall having (i) a conical surface tapering toward a peripheral edge of the substrate, and (ii) a substantially continuous channel adjacent to, and around the peripheral edge of the substrate surface, the channel having an inlet sized and configured to regulate the flow of process gas into the channel.
Claim 3
Dependent Claim 74 words
The method of claim 1, wherein in step (c), fixed and movable portions of a focus ring are moved relative to one another to define the channel therebetween, the channel comprising an inlet having a width w sized so that during processing of a substrate, the processing rate at the peripheral edge of the substrate surface is from about 90% to about 110% of the processing rate at the center of the substrate surface.
Claim 4
Dependent Claim 70 words
The method of claim 1, wherein in step (b) the process gas in the process chamber is maintained at a pressure of from about 10 mTorr to about 100 mTorr, and wherein in step (c) fixed and movable portions of a focus ring are moved relative to one another to define the channel therebetween, the channel comprising an inlet having a width w of about 1 to about 1000 mils.
Claim 5
Dependent Claim 46 words
The method of claim 1, wherein the process gas in the process chamber is maintained at a pressure of from about 10 mTorr to about 100 mTorr, and wherein in step (c) the length l of the channel is from about 10 to about 100 mm.
Claim 6
Dependent Claim 38 words
The method of claim 1, wherein the substrate comprises a diameter of from about 150 to 300 mm, and wherein in step (c) the wall has a height h of from about 10 mm to about 50 mm.
Claim 7
Dependent Claim 28 words
The method of claim 1, wherein in step (c), the wall of the focus ring comprises a conical surface that tapers toward the peripheral edge of the substrate.
Claim 8
Independent Claim 124 words
A method of processing a substrate in a process chamber, the method comprising the steps of: (a) placing a substrate in the chamber, the substrate having a surface with a center and a peripheral edge; (b) maintaining process gas in the chamber at process conditions suitable for processing the substrate; and (c) maintaining a wall having a substantially continuous channel adjacent to, and around the peripheral edge of the substrate surface, the channel comprising an inlet sized to provide a width w of about 1 to about 1000 μm for a process gas pressure of about 1 to 100 mTorr, whereby the flow of process gas into the channel provides substantially equivalent processing rates at the center and peripheral edge of the substrate surface.
Claim 9
Independent Claim 124 words
A method of processing a substrate in a process chamber, the method comprising the steps of: (a) placing a substrate in the chamber, the substrate having a surface with a center and a peripheral edge; (b) maintaining process gas in the chamber at process conditions suitable for processing the substrate; and (c) maintaining a wall having a substantially continuous channel adjacent to, and around the peripheral edge of the substrate surface, the channel comprising an inlet sized to provide a width w of about 1 to about 1000 μm for a process gas pressure of about 1 to 100 mTorr, whereby the flow of process gas into the channel provides substantially equivalent processing rates at the center and peripheral edge of the substrate surface.
Claim 10
Independent Claim 125 words
A method of processing a substrate in a process chamber, the method comprising the steps of: (a) placing a substrate in the chamber, the substrate having a surface with a center and a peripheral edge; (b) maintaining process gas in the chamber at process conditions suitable for processing the substrate; and (c) maintaining a wall having a substantially continuous channel adjacent to, and around the peripheral edge of the substrate surface, the channel having an inlet sized to provide a length l of from about 10 to about 100 mm for a process gas pressure of about 1 to 100 mTorr, whereby the flow of process gas into the channel provides substantially equivalent processing rates at the center and peripheral edge of the substrate surface.
Claim 11
Independent Claim 125 words
A method of processing a substrate in a process chamber, the method comprising the steps of: (a) placing a substrate in the chamber, the substrate having a surface with a center and a peripheral edge; (b) maintaining process gas in the chamber at process conditions suitable for processing the substrate; and (c) maintaining a wall having a substantially continuous channel adjacent to, and around the peripheral edge of the substrate surface, the channel having an inlet sized to provide a length l of from about 10 to about 100 mm for a process gas pressure of about 1 to 100 mTorr, whereby the flow of process gas into the channel provides substantially equivalent processing rates at the center and peripheral edge of the substrate surface.
Claim 12
Independent Claim 101 words
A method of processing a substrate in a process chamber, the method comprising the steps of: (a) moving movable and fixed portions of a focus ring in the chamber, toward one another, to define (i) a wall surrounding the substrate, and (ii) a substantially continuous channel in the wall; and (b) maintaining process gas in the chamber at process conditions suitable for processing the substrate, whereby the wall contains the process gas around the substrate and the channel allows spent process gas to flow therein to provide substantially equivalent processing rates at the center and peripheral edge of the substrate surface.
Claim 13
Independent Claim 101 words
A method of processing a substrate in a process chamber, the method comprising the steps of: (a) moving movable and fixed portions of a focus ring in the chamber, toward one another, to define (i) a wall surrounding the substrate, and (ii) a substantially continuous channel in the wall; and (b) maintaining process gas in the chamber at process conditions suitable for processing the substrate, whereby the wall contains the process gas around the substrate and the channel allows spent process gas to flow therein to provide substantially equivalent processing rates at the center and peripheral edge of the substrate surface.
Claim 14
Dependent Claim 23 words
The method of claim 9 wherein in step (a), the wall comprises a conical surface tapering toward a peripheral edge of the substrate.
Claim 15
Dependent Claim 41 words
The method of claim 9 wherein in step (a), the channel in the wall is defined between the fixed and movable portions of the focus ring, and extends substantially continuously adjacent to, and around the peripheral edge of the substrate surface.
Claim 16
Dependent Claim 65 words
The method of claim 11 wherein the fixed and movable portions of the focus ring are moved sufficiently close to one another to define a channel having an inlet with a width w sized to process the peripheral edge of the substrate surface at a processing rate that is about 90% to about 110% of a processing rate at the center of the substrate surface.
Claim 17
Dependent Claim 69 words
The method of claim 10 wherein in step (a) the process gas in the process chamber is maintained at a pressure of from about 10 mTorr to about 100 mTorr, and wherein in step (b) the fixed and movable portions of the focus ring are moved toward another to define a channel therebetween, the channel comprising an inlet having a width w of about 1 to about 1000 mils.
Claim 18
Independent Claim 126 words
An apparatus for processing a substrate having a surface with a center and a peripheral edge, the apparatus comprising: (a) a process chamber having a gas distributor for distributing process gas in the process chamber; (b) a support for supporting a substrate in the process chamber; (c) a plasma generator for forming a plasma from the process gas in the process chamber; (d) a focus ring in the process chamber, the focus ring comprising a fixed portion and a movable portion that cooperate to define (i) a wall surrounding the substrate to substantially contain the plasma on the substrate surface, and (ii) a channel in the wall, the channel having an inlet adjacent to, and extending substantially continuously around the peripheral edge of the substrate surface.
Claim 19
Independent Claim 126 words
An apparatus for processing a substrate having a surface with a center and a peripheral edge, the apparatus comprising: (a) a process chamber having a gas distributor for distributing process gas in the process chamber; (b) a support for supporting a substrate in the process chamber; (c) a plasma generator for forming a plasma from the process gas in the process chamber; (d) a focus ring in the process chamber, the focus ring comprising a fixed portion and a movable portion that cooperate to define (i) a wall surrounding the substrate to substantially contain the plasma on the substrate surface, and (ii) a channel in the wall, the channel having an inlet adjacent to, and extending substantially continuously around the peripheral edge of the substrate surface.
Claim 20
Dependent Claim 64 words
The apparatus of claim 14, wherein the inlet comprises a width w sized to allow a sufficient amount of process gas to flow into the channel during processing of the substrate that the peripheral edge of the substrate surface is processed at a processing rate that is from about 90% to about 110% of a processing rate at the center of the substrate surface.
Claim 21
Dependent Claim 42 words
The apparatus of claim 15, wherein the width w of the inlet is sized so that the etch rate at the peripheral edge of the substrate surface is within about 10% of the etch rate at the center of the substrate surface.
Claim 22
Dependent Claim 37 words
The apparatus of claim 15, wherein the width w of the inlet is about 1 to about 1000 mils for a pressure of process gas in the process chamber of about 10 mTorr to about 100 mTorr.
Claim 23
Dependent Claim 49 words
The apparatus of claim 14, wherein the channel comprises a length l sized to allow a sufficient amount of process gas to flow into the channel, during processing of the substrate, that substantially no process gas stagnates to form contaminant particulates at the peripheral edge of the substrate surface.
Claim 24
Dependent Claim 40 words
The apparatus of claim 18, wherein the length l of the channel is from about 10 mm to about 100 mm, for a pressure of process gas in the process chamber of from about 10 mTorr to about 100 mTorr.
Claim 25
Dependent Claim 43 words
The apparatus of claim 14, wherein at least a portion of a sidewall of the inlet of the channel is substantially parallel to the substrate surface to maintain a substantially laminar flow of process gas across the peripheral edge of the substrate surface.
Claim 26
Dependent Claim 33 words
The apparatus of claim 14, wherein the focus ring comprises (i) a fixed portion, and (ii) a movable portion, the channel being formed between the fixed and movable portion of the focus ring.
Claim 27
Dependent Claim 50 words
The apparatus of claim 14, wherein the wall of the focus ring comprises a height h sized sufficiently long to direct the flow of process gas from the gas distributor to the substrate while reducing the flow to the substrate of stagnant process gas species circulating in the process chamber.
Claim 28
Dependent Claim 39 words
The apparatus of claim 14, wherein the substrate comprises a diameter of from about 150 to 300 mm, and wherein the wall of the focus ring comprises a height h of from about 10 mm to about 50 mm.
Claim 29
Dependent Claim 25 words
The apparatus of claim 14, wherein the wall of the focus ring comprises a conical surface that tapers toward the peripheral edge of the substrate.
Claim 30
Dependent Claim 33 words
The apparatus of claim 24, wherein the conical surface of the wall forms an angle of from about 10° to about 75° with an axis substantially vertical to the surface of the substrate.
Claim 31
Dependent Claim 35 words
The apparatus of claim 14, wherein the gas distributor of the process chamber is located above the center of the substrate surface and is capable of distributing process gas substantially uniformly across the substrate surface.
Claim 32
Dependent Claim 127 words
A process chamber for uniformly processing a substrate in a process gas, the process chamber comprising: (a) a gas distributor for introducing process gas in the process chamber; (b) a gas containment wall for directing the flow of process gas introduced through the gas distributor to the substrate, the wall comprising a conical surface that tapers toward the peripheral edge of the substrate; and (c) a movable substrate holder having (i) a first position suitable for loading the substrate thereon, and (ii) a second position for processing of the substrate, wherein in the second position the movable substrate holder and the process gas containment wall define a channel therebetween, the channel having an inlet adjacent to and extending substantially continuously around a peripheral edge of the substrate.
Claim 33
Dependent Claim 127 words
A process chamber for uniformly processing a substrate in a process gas, the process chamber comprising: (a) a gas distributor for introducing process gas in the process chamber; (b) a gas containment wall for directing the flow of process gas introduced through the gas distributor to the substrate, the wall comprising a conical surface that tapers toward the peripheral edge of the substrate; and (c) a movable substrate holder having (i) a first position suitable for loading the substrate thereon, and (ii) a second position for processing of the substrate, wherein in the second position the movable substrate holder and the process gas containment wall define a channel therebetween, the channel having an inlet adjacent to and extending substantially continuously around a peripheral edge of the substrate.
Claim 34
Dependent Claim 36 words
The process chamber of claim 27, wherein the inlet of the channel comprises a width w sized to allow a sufficient volume of process gas to enter into the channel to substantially uniformly process the substrate.
Claim 35
Dependent Claim 40 words
The process chamber of claim 27, wherein the channel comprises a length l sized to allow a sufficient volume of process gas to enter into the channel to reduce formation of particulate contaminants at the peripheral edge of the substrate.
Claim 36
Dependent Claim 29 words
The process chamber of claim 27, wherein at least a portion of a sidewall of the inlet of the channel is substantially parallel to a surface of the substrate.
Claim 37
Dependent Claim 54 words
The process chamber of claim 27, wherein the wall of the focus ring comprises a height h sized sufficiently long for the wall to direct the flow of process gas from the gas distributor to the substrate while reducing the flow to the substrate of stagnant process gas species circulating in the process chamber.
Claim 38
Dependent Claim 45 words
The process chamber of claim 27, wherein the gas contaminant wall comprises a conical surface that tapers toward the peripheral edge of the substrate at an angle of from about 10° to about 75° with an axis substantially vertical to a surface of the substrate.
Claim 39
Dependent Claim 116 words
A process chamber for processing a substrate having a surface with a peripheral edge, the process chamber comprising: (a) a gas distributor for distributing process gas in the process chamber; (b) a plasma generator for forming a plasma from the process gas; (c) a support for supporting a substrate; and (d) a focus ring comprising (i) a wall surrounding the substrate to substantially contain the plasma on the substrate surface, and (ii) a channel having an inlet adjacent to, and extending substantially continuously around the peripheral edge of the substrate surface, the inlet having a width w of about 1 to about 1000 mils for a pressure of process gas of about 10 to 100 mTorr.
Claim 40
Dependent Claim 116 words
A process chamber for processing a substrate having a surface with a peripheral edge, the process chamber comprising: (a) a gas distributor for distributing process gas in the process chamber; (b) a plasma generator for forming a plasma from the process gas; (c) a support for supporting a substrate; and (d) a focus ring comprising (i) a wall surrounding the substrate to substantially contain the plasma on the substrate surface, and (ii) a channel having an inlet adjacent to, and extending substantially continuously around the peripheral edge of the substrate surface, the inlet having a width w of about 1 to about 1000 mils for a pressure of process gas of about 10 to 100 mTorr.
Claim 41
Dependent Claim 39 words
The process chamber of claim 33 wherein the channel comprises a length l of about 10 mm to about 100 mm, for a pressure of process gas in the chamber of from about 10 mTorr to about 100 mTorr.
Claim 42
Dependent Claim 32 words
The process chamber of claim 33 wherein the focus ring comprises a fixed portion and a movable portion, the channel being formed between the fixed and movable portions of the focus ring.
Claim 43
Dependent Claim 26 words
The process chamber of claim 33 wherein the wall of the focus ring comprises a conical surface that tapers toward the peripheral edge of the substrate.
Claim 44
Dependent Claim 34 words
The process chamber of claim 36 wherein the conical surface of the wall forms an angle of from about 10° to about 75° with an axis substantially vertical to the surface of the substrate.
Claim 45
Dependent Claim 125 words
A process chamber for processing a substrate having a surface with a peripheral edge, the process chamber comprising: (a ) a gas distributor for distributing process gas in the process chamber; (b) a plasma generator for forming a plasma from the process gas; (c) a support for supporting a substrate; and (d) a focus ring comprising (i) a wall surrounding the substrate to substantially contain the plasma on the substrate surface, and (ii) a channel in the wall, the channel having an inlet adjacent to, and extending substantially continuously around the peripheral edge of the substrate surface, the channel having a length l of about 10 mm to about 100 mm for a pressure of process gas of about 10 mTorr to about 100 mTorr.
Claim 46
Dependent Claim 125 words
A process chamber for processing a substrate having a surface with a peripheral edge, the process chamber comprising: (a ) a gas distributor for distributing process gas in the process chamber; (b) a plasma generator for forming a plasma from the process gas; (c) a support for supporting a substrate; and (d) a focus ring comprising (i) a wall surrounding the substrate to substantially contain the plasma on the substrate surface, and (ii) a channel in the wall, the channel having an inlet adjacent to, and extending substantially continuously around the peripheral edge of the substrate surface, the channel having a length l of about 10 mm to about 100 mm for a pressure of process gas of about 10 mTorr to about 100 mTorr.
Claim 47
Dependent Claim 34 words
The process chamber of claim 38 wherein the channel comprises a width w of about 1 to about 1000 mils for a pressure of process gas of about 10 mTorr to about 100 mTorr.
Claim 48
Dependent Claim 32 words
The process chamber of claim 38 wherein the focus ring comprises a fixed portion and a movable portion, the channel being formed between the fixed and movable portions of the focus ring.
Claim 49
Dependent Claim 26 words
The process chamber of claim 38 wherein the wall of the focus ring comprises a conical surface that tapers toward the peripheral edge of the substrate.
Claim 50
Dependent Claim 34 words
The process chamber of claim 41 wherein the conical surface of the wall forms an angle of from about 10° to about 75° with an axis substantially vertical to the surface of the substrate.
Claim 51
Dependent Claim 113 words
A process chamber for processing a substrate having a surface with a peripheral edge, the process chamber comprising: (a) a process chamber having a gas distributor for distributing process gas in the process chamber; (c) a plasma generator for forming a plasma from the process gas; (b) a support for supporting a substrate; and (d) a focus ring comprising (i) a wall surrounding the substrate and having a conical surface that tapers towards the peripheral edge of the substrate, and (ii) a channel in the wall, the channel having an inlet adjacent to, and extending substantially continuously around the peripheral edge of the substrate surface, whereby process gas can flow into the channel.
Claim 52
Dependent Claim 113 words
A process chamber for processing a substrate having a surface with a peripheral edge, the process chamber comprising: (a) a process chamber having a gas distributor for distributing process gas in the process chamber; (c) a plasma generator for forming a plasma from the process gas; (b) a support for supporting a substrate; and (d) a focus ring comprising (i) a wall surrounding the substrate and having a conical surface that tapers towards the peripheral edge of the substrate, and (ii) a channel in the wall, the channel having an inlet adjacent to, and extending substantially continuously around the peripheral edge of the substrate surface, whereby process gas can flow into the channel.
Claim 53
Dependent Claim 24 words
The process chamber of claim 43 wherein the substantially the entire surface of the wall facing the substrate consists essentially of the conical surface.
Claim 54
Dependent Claim 34 words
The process chamber of claim 43 wherein the conical surface of the wall forms an angle of from about 10° to about 75° with an axis substantially vertical to the surface of the substrate.
Claim 55
Dependent Claim 35 words
The process chamber of claim 43 wherein the inlet of the channel comprises a width w of about 1 to about 1000 mils for a pressure of process gas of about 10 to 100 mTorr.
Claim 56
Dependent Claim 35 words
The process chamber of claim 43 wherein the channel comprises a length l of about 10 mm to about 100 mm for a pressure of process gas of about 10 mTorr to about 100 mTorr.
Claim 57
Dependent Claim 32 words
The process chamber of claim 43 wherein the focus ring comprises a fixed portion and a movable portion, the channel being formed between the fixed and movable portions of the focus ring.
Claim 58
Dependent Claim 87 words
A process chamber for processing a substrate having a surface with a peripheral edge, the process chamber comprising: (a) a process chamber having a gas distributor for distributing process gas in the process chamber; (c) a plasma generator for forming a plasma from the process gas; (b) a support for supporting a substrate; and (d) a focus ring comprising a wall surrounding the substrate, substantially the entire surface of the wall facing the substrate comprising a conical surface that tapers towards the peripheral edge of the substrate.
Claim 59
Dependent Claim 87 words
A process chamber for processing a substrate having a surface with a peripheral edge, the process chamber comprising: (a) a process chamber having a gas distributor for distributing process gas in the process chamber; (c) a plasma generator for forming a plasma from the process gas; (b) a support for supporting a substrate; and (d) a focus ring comprising a wall surrounding the substrate, substantially the entire surface of the wall facing the substrate comprising a conical surface that tapers towards the peripheral edge of the substrate.
Claim 60
Dependent Claim 34 words
The process chamber of claim 49 wherein the conical surface of the wall forms an angle of from about 10° to about 75° with an axis substantially vertical to the surface of the substrate.
Claim 61
Dependent Claim 29 words
The process chamber of claim 49 wherein the wall comprises a channel having an inlet adjacent to, and extending substantially continuously around the peripheral edge of the substrate surface.
Claim 62
Dependent Claim 35 words
The process chamber of claim 51 wherein the inlet of the channel comprises a width w of about 1 to about 1000 mils for a pressure of process gas of about 10 to 100 mTorr.
Claim 63
Dependent Claim 35 words
The process chamber of claim 51 wherein the channel comprises a length l of about 10 mm to about 100 mm for a pressure of process gas of about 10 mTorr to about 100 mTorr.
Claim 64
Dependent Claim 32 words
The process chamber of claim 49 wherein the focus ring comprises a fixed portion and a movable portion, the channel being formed between the fixed and movable portions of the focus ring.

References Cited (Backward Citations)

US4645218A Cited
JPS6235627A Cited
US5228501A Cited
US4869801A Cited
US5298465A Cited
US5330607A Cited
US5213658A Cited
US5246532A Cited
US5271788A Cited
US5352294A Cited
US5423918A Cited
US5552124A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-04-05 2002-10-05 2003-04-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-04-05 2006-10-05 2007-04-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-04-05 2010-10-05 2011-04-06 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag