Patent US5879965A successfully refreshed from Google Patents.
US5879965A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication
Assignee: Micron Technology Inc
•
Filing: 1997-06-19
•
Granted: 1999-03-09
•
Expires: 2017-06-19
Abstract
Abstract A conductive plastic lead frame and method of manufacturing same, suitable for use in IC packaging. In a preferred embodiment the lead frame is constructed of a plastic or polymer based lead frame structure with an intrinsic conductive polymer coating. In a second embodiment the lead frame is a composite plastic or polymeric material intermixed with an intrinsic conductive polymer coating.
Inventors
- 👤 Tongbi Jiang
- 👤 Jerrold L. King
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:52
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/40; H10W70/411; H10W70/415; H10W70/456; H10W70/457; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/59; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/934; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
34 words
A method of manufacturing a plastic lead frame for use in packaging IC dice comprising: forming a plastic lead frame structure; and coating said plastic lead frame structure with a intrinsic conductive polymeric material.
Claim 2
Independent Claim
34 words
A method of manufacturing a plastic lead frame for use in packaging IC dice comprising: forming a plastic lead frame structure; and coating said plastic lead frame structure with a intrinsic conductive polymeric material.
Claim 3
Dependent Claim
26 words
The method of manufacturing in claim 1, wherein said forming a plastic lead frame structure is by stamping or etching from a sheet of polymeric material.
Claim 4
Dependent Claim
23 words
The method of manufacturing in claim 1, wherein said forming a plastic lead frame structure is by injection molding plastic or polymer material.
Claim 5
Dependent Claim
23 words
The method of manufacturing in claim 1, wherein said forming a plastic lead frame structure is by compression molding plastic or polymer material.
Claim 6
Dependent Claim
22 words
The method of manufacturing in claim 1, wherein said coating is by dipping said plastic lead frame structure into a solvent dispersion.
Claim 7
Dependent Claim
17 words
The method of manufacturing in claim 5, wherein said solvent dispersion further comprises an intrinsic conductive polymer.
Claim 8
Dependent Claim
15 words
The method of manufacturing in claim 5, wherein said intrinsic conductive polymer is a polyaniline.
Claim 9
Independent Claim
28 words
A method of manufacturing a plastic lead frame for use in packaging IC dice comprising injection molding composite plastic material further comprising intermixed plastic and intrinsic conductive polymer.
Claim 10
Independent Claim
28 words
A method of manufacturing a plastic lead frame for use in packaging IC dice comprising injection molding composite plastic material further comprising intermixed plastic and intrinsic conductive polymer.
Claim 11
Independent Claim
65 words
A method of manufacturing an IC package comprising: forming a conductive plastic lead frame; attaching an IC die to said conductive plastic lead frame; connecting a plurality of die bond pads on said IC die to a plurality of lead frame fingers from said conductive plastic lead frame; encapsulating said die and lead frames so attached and connected; and finishing said electronic package for use.
Claim 12
Independent Claim
65 words
A method of manufacturing an IC package comprising: forming a conductive plastic lead frame; attaching an IC die to said conductive plastic lead frame; connecting a plurality of die bond pads on said IC die to a plurality of lead frame fingers from said conductive plastic lead frame; encapsulating said die and lead frames so attached and connected; and finishing said electronic package for use.
Claim 13
Dependent Claim
27 words
The method of claim 9, wherein said conductive plastic lead frame further comprises a plastic or polymer lead frame structure with a coating of intrinsic conductive polymer.
Claim 14
Dependent Claim
23 words
The method of claim 9, wherein said conductive plastic lead frame further comprises a polymeric lead frame structure with a coating of copper.
Claim 15
Dependent Claim
15 words
The method of claim 9, wherein said lead frame structure is injection or compression molded.
Claim 16
Dependent Claim
20 words
The method of claim 9, wherein said lead frame structure is stamped from a sheet of said plastic or polymer.
Claim 17
Dependent Claim
20 words
The method of claim 9, wherein said lead frame structure is etched from a sheet of said plastic or polymer.
Claim 18
Dependent Claim
36 words
The method of claim 9, wherein said conductive plastic lead frame includes: an intrinsic conductive polymeric lead frame having a coating of at least one conductive polymeric material thereon for the formation of an intermetallic connection.
Claim 19
Dependent Claim
33 words
The method of claim 15, wherein said conductive plastic lead frame includes: a polymeric lead frame having a plurality of coatings of conductive metal layers thereon for the formation of an intermetallic connection.
Claim 20
Dependent Claim
24 words
The method of claim 15, wherein said conductive plastic lead frame includes: a polymeric lead frame having composite metal layers thereon for intermetallic connections.
Claim 21
Dependent Claim
35 words
The method of claim 15, wherein said conductive plastic lead frame includes: an intrinsic conductive polymeric lead frame having a coating of at least one conductive metal thereon for the formation of a metallic connection.
Claim 22
Dependent Claim
27 words
The method of claim 15, wherein the polymeric lead frame having a coatings of conductive metal thereon includes a coating of copper and a coating of nickel.
Claim 23
Dependent Claim
31 words
The method of claim 15, wherein the polymeric lead frame having a coatings of conductive metal thereon includes a coating of copper, a coating of nickel, and a coating of palladium.
Claim 24
Dependent Claim
27 words
The method of claim 15, wherein the polymeric lead frame having a coatings of conductive metal thereon includes a coating of copper and a coating of silver.
Claim 25
Dependent Claim
27 words
The method of claim 15, wherein the polymeric lead frame having a coatings of conductive metal thereon includes a coating of copper and a coating of gold.
Claim 26
Independent Claim
36 words
A method of manufacturing a circuit card comprising attaching one or more IC packages to a circuit card wherein at least one of said one or more IC packages contains an intrinsic conductive plastic lead frame.
Claim 27
Independent Claim
36 words
A method of manufacturing a circuit card comprising attaching one or more IC packages to a circuit card wherein at least one of said one or more IC packages contains an intrinsic conductive plastic lead frame.
Claim 28
Dependent Claim
22 words
The method of claim 23, wherein at least one of said one or more IC packages contains a conductive plastic lead frame.
References Cited (Backward Citations)
US3440027A
Cited
US3868765A
Cited
US4089733A
Cited
US4079511A
Cited
US4234666A
Cited
US4281556A
Cited
US4677526A
Cited
US4906802A
Cited
US5231756A
Cited
US5341027A
Cited
US5612259A
Cited
US5616953A
Cited
US5600179A
Cited
US5770479A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-08 | 2002-09-07 | 2003-03-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-08 | 2006-09-07 | 2007-03-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-08 | 2010-09-07 | 2011-03-09 | $7700.00 | Window Closed / Lapsed |