Molded chip carrier

Claim 2

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body which includes a generally peripheral wall that defines an integrally molded protective cavity, said peripheral wall having an exterior surface, a top surface, and an inward-facing surface, and protected within the integrally molded cavity a mounting site for such electronic component; wherein each of said first and said second molded sections has an exposed surface; but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface; a conductive material deposit, on the exposed surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend, continuously along said exterior, top, and inward-facing surfaces of said generally peripheral wall, into said integrally molded protective cavity; whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body.

Claim 3

The carrier of claim 1, wherein: the electrical leads extend into said integrally molded cavity to inner ends that are immediately adjacent to said mounting site; whereby such electrical connections between the inner ends of the leads and a component installed on the mounting site need span only a very short gap that is well within and entirely protected by the integrally molded cavity.

Claim 4

The carrier of claim 2, wherein: the electrical leads slope radially outward and upward from within the cavity to the top surface of the wall, and extend radially outward along the top of the wall.

Claim 5

The carrier of claim 2, wherein: the mounting site comprises a component-mounting pedestal formed within the integrally molded protective cavity; and the inner ends of the leads are elevated from a bottom surface of the integrally molded cavity; whereby such electrical connections while spanning said short gap between the inner ends of the leads and a component installed on the mounting-site pedestal are elevated from a bottom surface of the integrally molded cavity.

Claim 6

The carrier of claim 1, wherein: a generally peripheral channel is defined in said top surface of the wall; and the conductive material extends, at two sides of the channel, downward into the channel; and extends across the channel.

Claim 7

The carrier of claim 5, further comprising: a protective cap having a projecting ridge extending therefrom, said projecting ridge being receivable within the channel.

Claim 8

The chip carrier as defined in claim 1, wherein: said first molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit; and said second molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit.

Claim 9

The chip carrier as defined in claim 7 wherein said first and second molded sections form an integral carrier body having a top portion, a bottom portion, and at least one side portion, said second molded section forming a plurality of noninterconnecting, continuous paths extending from said top portion, along said side portion and to said bottom portion, said conductive material being deposited on said paths.

Claim 10

The chip carrier as defined in claim 8 wherein said second molded section includes a plurality of fin-like shaped projections extending along said side and bottom portions of said carrier body, and each continuous path extends along an outer edge of one of said fin-like projections.

Claim 11

The chip carrier as defined in claim 8 wherein said conductive material is a metallic deposit.

Claim 12

The chip carrier as defined in claim 10 wherein said second molded section is made from a nonconductive material having a catalyst which makes said material receptive to adherent metalization.

Claim 13

The chip carrier as defined in claim 1, wherein: said second molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit; and said first molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit, said second molded section being molded about said first molded section.

Claim 14

The chip carrier as defined in claim 12 wherein said integral carrier body includes a top portion, a bottom portion and at least one side portion, said first portion having a plurality of non-overlapping, continuous paths formed thereon that extend for said to portion along said side portions to said bottom portion.

Claim 15

The chip carrier as defined in claim 13 wherein said first molded section forms a plurality of fin-like projections extending along said side and bottom portions of said carrier body, and each of said continuous paths extends along an outer edge of one of said fin-like projections.

Claim 16

The chip carrier as defined in claim 13 wherein said conductive material is a metallic deposit.

Claim 17

The chip carrier as defined in claim 15 wherein said first molded section is made from a nonconductive material having a catalyst that makes the material receptive to adherent metalization.

Claim 18

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body; wherein each of said first and said second molded sections has an exposed outer surface; but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed outer surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed outer surface; a conductive material deposit, on the outer surface that is relatively more susceptible to receiving a deposit of conductive material; and wherein: said first molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit; said second molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit; and said integral carrier body includes a top portion, a bottom portion, and at least one side portion, said top portion having a continuous channel extending therein and further including a protective cap having a projecting ridge extending therefrom, said projecting ridge being receivable in said channel.

Claim 19

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body; wherein each of said first and said second molded sections has an exposed outer surface; but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed outer surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed outer surface; a conductive material deposit, on the outer surface that is relatively more susceptible to receiving a deposit of conductive material; and wherein: said first molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit; said second molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit; and said integral carrier body includes a top portion, a bottom portion, and at least one side portion, said top portion having a continuous channel extending therein and further including a protective cap having a projecting ridge extending therefrom, said projecting ridge being receivable in said channel.

Claim 20

The chip carrier as defined in claim 17 wherein each of said continuous paths extend across and form a portion of said channel that extends into said top portion.

Claim 21

The chip carrier as defined in claim 18 wherein said conductive deposit is a metallic deposit.

Claim 22

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component; wherein each of said first and said second molded sections has an exposed surface; but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface; a conductive material deposit, on the surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity; whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body; wherein the integral carrier body further comprises at least one side portion that has a top; and wherein at least along part of the top of the side portion, the electrical leads are defined along surfaces that are recessed by distances substantially equal to the respective thicknesses of the leads; whereby the leads are flush with the top of the side portion, along at least a part of the top of the side portion.

Claim 23

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component; wherein each of said first and said second molded sections has an exposed surface; but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface; a conductive material deposit, on the surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity; whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body; wherein the integral carrier body further comprises at least one side portion that has a top; and wherein at least along part of the top of the side portion, the electrical leads are defined along surfaces that are recessed by distances substantially equal to the respective thicknesses of the leads; whereby the leads are flush with the top of the side portion, along at least a part of the top of the side portion.

Claim 24

The carrier of claim 20, wherein: said side portion further has an outer surface; and from the top of the side portion the leads extend downward along the outer surface along outward-projecting fins defined in the outer surface.

Claim 25

The carrier of claim 21, wherein: the carrier body also has a bottom portion, and J-shaped bosses defined in the bottom portion; and the leads extend downward from the fins to and along undersurfaces of the J-shaped bosses.

Claim 26

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body; each of said first and said second molded sections having an exposed outer surface; but one of said molded sections being relatively much more susceptible to receiving a deposit of conductive material on its exposed outer surface, and the other of said molded sections being relatively much more resistant to receiving such a deposit on its exposed outer surface; and a conductive material deposit, on the outer surface that is relatively more susceptible to receiving a deposit of conductive material; and wherein: said first molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit; said second molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit; said first and second molded sections form an integral carrier body having a top portion, a bottom portion, and at least one side portion, said second molded section forming a plurality of noninterconnecting, continuous paths extending from said top portion, along said side portion and to said bottom portion, said conductive material being deposited on said paths; and said top portion has a continuous channel extending therein and further including a protective cap having a continuous projecting ridge extending therefrom, said projecting ridge being receivable in said channel.

Claim 27

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body; each of said first and said second molded sections having an exposed outer surface; but one of said molded sections being relatively much more susceptible to receiving a deposit of conductive material on its exposed outer surface, and the other of said molded sections being relatively much more resistant to receiving such a deposit on its exposed outer surface; and a conductive material deposit, on the outer surface that is relatively more susceptible to receiving a deposit of conductive material; and wherein: said first molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit; said second molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit; said first and second molded sections form an integral carrier body having a top portion, a bottom portion, and at least one side portion, said second molded section forming a plurality of noninterconnecting, continuous paths extending from said top portion, along said side portion and to said bottom portion, said conductive material being deposited on said paths; and said top portion has a continuous channel extending therein and further including a protective cap having a continuous projecting ridge extending therefrom, said projecting ridge being receivable in said channel.

Claim 28

The chip carrier as defined in claim 23 wherein each of said continuous paths extends across and forms a portion of said channel that extends into said top portion.

Claim 29

The chip carrier as defined in claim 24 wherein said conductive material is a metallic deposit.

Claim 30

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body; each of said first and said second molded sections having an exposed outer surface; but one of said molded sections being relatively much more susceptible to receiving a deposit of conductive material on its exposed outer surface, and the other of said molded sections being relatively much more resistant to receiving such a deposit on its exposed outer surface; and a conductive material deposit, on the outer surface that is relatively more susceptible to receiving a deposit of conductive material; and wherein: said second molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit; said first molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit, said second molded section being molded about said first molded section; and said integral carrier body includes a top portion, a bottom portion, and at least one side portion, said top portion having a continuous channel extending therein and further including a protective cap having a projecting ridge extending therefrom, said projecting ridge being receivable within said channel.

Claim 31

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body; each of said first and said second molded sections having an exposed outer surface; but one of said molded sections being relatively much more susceptible to receiving a deposit of conductive material on its exposed outer surface, and the other of said molded sections being relatively much more resistant to receiving such a deposit on its exposed outer surface; and a conductive material deposit, on the outer surface that is relatively more susceptible to receiving a deposit of conductive material; and wherein: said second molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit; said first molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit, said second molded section being molded about said first molded section; and said integral carrier body includes a top portion, a bottom portion, and at least one side portion, said top portion having a continuous channel extending therein and further including a protective cap having a projecting ridge extending therefrom, said projecting ridge being receivable within said channel.

Claim 32

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component; wherein each of said first and said second molded sections has an exposed surface; but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface; a conductive material deposit, on the surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity; whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body; wherein said second molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit; wherein said first molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit, said second molded section being molded about said first molded section; wherein said integral carrier body includes a top portion, a bottom portion and at least one side portion, said first portion having a plurality of nonoverlapping, continuous paths formed thereon that extend from said top portion along said side portions to said bottom portion; and wherein said top portion has a continuous channel extending therein; and further including a protective cap having a projecting ridge extending therefrom, said projecting ridge being receivable in said channel.

Claim 33

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component; wherein each of said first and said second molded sections has an exposed surface; but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed surface; a conductive material deposit, on the surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity; whereby electrical connections between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body; wherein said second molded section is made from a nonconductive material that is more resistant to receiving a conductive deposit; wherein said first molded section is made from a nonconductive material that is more susceptible to receiving a conductive deposit, said second molded section being molded about said first molded section; wherein said integral carrier body includes a top portion, a bottom portion and at least one side portion, said first portion having a plurality of nonoverlapping, continuous paths formed thereon that extend from said top portion along said side portions to said bottom portion; and wherein said top portion has a continuous channel extending therein; and further including a protective cap having a projecting ridge extending therefrom, said projecting ridge being receivable in said channel.

Claim 34

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component; wherein each of said first and said second molded sections has an exposed outer surface; but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed outer surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed outer surface; a conductive material deposit, on the outer surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity; whereby electrical connection between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body; wherein the electrical leads extend into said integrally molded cavity to inner ends that are immediately adjacent to said mounting site; whereby such electrical connections between the inner ends of the leads and a component installed on the mounting site need span only a very short gap that is well within and entirely protected by the integrally molded cavity; wherein the integral carrier body further comprises at least one side portion that has a top; and wherein the electrical leads slope radially outward and upward from within the cavity to the top of the side portion, and extend radially outward along the top of the side portion; and wherein at least along part of the top of the side portion, the electrical leads are defined along surfaces that are recessed by distances substantially equal to the respective thicknesses of the leads; whereby the leads are flush with the top of the side portion, along at least a part of the top of the side portion.

Claim 35

A chip carrier having a central portion for receiving an electronic component in chip form, comprising: a first molded section having a first predetermined shape; a second molded section having a second predetermined shape; said first and second molded sections forming an integral carrier body which includes an integrally molded protective cavity, and protected within the integrally molded cavity a mounting site for such electronic component; wherein each of said first and said second molded sections has an exposed outer surface; but one of said molded sections is relatively much more susceptible to receiving a deposit of conductive material on its exposed outer surface, and the other of said molded sections is relatively much more resistant to receiving such a deposit on its exposed outer surface; a conductive material deposit, on the outer surface that is relatively more susceptible to receiving a deposit of conductive material, and defining electrical leads that extend into said integrally molded protective cavity; whereby electrical connection between the electrical leads and a component installed on the mounting site can be made entirely within and protected by the integrally molded cavity of the integral carrier body; wherein the electrical leads extend into said integrally molded cavity to inner ends that are immediately adjacent to said mounting site; whereby such electrical connections between the inner ends of the leads and a component installed on the mounting site need span only a very short gap that is well within and entirely protected by the integrally molded cavity; wherein the integral carrier body further comprises at least one side portion that has a top; and wherein the electrical leads slope radially outward and upward from within the cavity to the top of the side portion, and extend radially outward along the top of the side portion; and wherein at least along part of the top of the side portion, the electrical leads are defined along surfaces that are recessed by distances substantially equal to the respective thicknesses of the leads; whereby the leads are flush with the top of the side portion, along at least a part of the top of the side portion.

Claim 38

The method of claim 29 further including the step of: preparing one of the first and the second molded sections for adhesion promotion prior to the depositing step.

Claim 39

The method of claim 30 wherein said first molded section is formed from a non-conductive material and said second molded section is made from a non-conductive material that is capable of receiving a conductive deposit.

Claim 40

The method of claim 31 wherein said second molded section is formed having a outer exposed surface that defines a plurality of non-interconnecting, conductive paths that receive the conductive material.

Claim 41

The method of claim 32 wherein the conductive material is a metallic deposit.

Claim 42

The method of claim 33 wherein the metallic deposit is placed on the second molded section by adherent metallization.

Claim 43

The method of claim 30 wherein the second molded section is made from a non-conductive material and the first molded section is made from a non-conductive material that is capable of receiving a conductive deposit.

Claim 44

The method of claim 35 wherein the first molded section is formed with an exposed outer surface that defines a plurality of non-intersecting continuous paths that receive the conductive material.

Claim 45

The method of claim 36 wherein the conductive material is a metallic deposit.

Claim 46

The method of claim 37 wherein the metallic deposit is placed on the first molded section by adherent metallization.