Abstract A heat dissipation device for the central processing unit (CPU) with larger area mainly comprises a finned plate and a board member mounted to the finned plate. The finned plate includes a plurality of rows and/or columns of fins extending upwardly from an upper side, wherein gaps are formed among every adjacent fins for the purpose of air circulation, and two separable grooves are defined among every adjacent fin block. The board member includes a hole, and a support member provided in the hole and connected to the periphery defining the hole by a plurality of ribs extending to the support member. A stud is formed on an upper side of the support member and includes a second hole defined therein for rotationally receiving a rotor shaft of fan. At lease one holder is provided at the grooves for mounting the heat dissipation device onto the central processing unit.
A heat dissipation device comprising: a finned plate having a plurality of fins extending in a first direction from an upper side thereof, every two adjacent fins having a gap defined therebetween; a board member mounted on said finned plate having at least one rod extending in a second direction from an underside of said board member; and at least one holder having an end disposed at the gap between the two adjacent fins for mounting said heat dissipation device onto a circuit device, said holder having at least one leg extending in the second direction from the end terminating as a hook for hooking the integrated circuit device, at least one fold being provided adjacent to the leg of said holder to provide a better spring effect, the rod of said board member pressing against the holder to position the holder and to enhance the spring effect thereof.
Claim 2
Dependent Claim
149 words
A heat dissipation device comprising: a finned plate having a plurality of fins extending in a first direction from an upper side thereof, every two adjacent fins having a gap defined therebetween; a board member mounted on said finned plate having at least one rod extending in a second direction from an underside of said board member; and at least one holder having an end disposed at the gap between the two adjacent fins for mounting said heat dissipation device onto a circuit device, said holder having at least one leg extending in the second direction from the end terminating as a hook for hooking the integrated circuit device, at least one fold being provided adjacent to the leg of said holder to provide a better spring effect, the rod of said board member pressing against the holder to position the holder and to enhance the spring effect thereof.
Claim 3
Dependent Claim
34 words
The heat dissipation device according to claim 1, wherein said board member further comprises a side wall extending in the second direction from an edge of said board member to enclose said finned plate.