US5701951A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat dissipation device for an integrated circuit
Assignee: Individual
•
Filing: 1994-12-20
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Granted: 1997-12-30
•
Expires: 2014-12-20
Abstract
Abstract A heat dissipation device for an integrated circuit includes a heat-conducting base plate having a bottom surface which is adapted to contact the upper surface of the integrated circuit, and a corrugated porous heat dissipating plate made of a flexible heat conducting material and fixed on the upper surface of the base plate so as to transfer heat from the base plate to the heat dissipating plate for heat dissipation. The heat dissipating plate has a plurality of ventilation holes formed therethrough, which are located over the base plate so as to enhance currents of air in the spaces between the base plate and the heat dissipating plate. Accordingly, the heat dissipating area in a unit of the space occupied by the heat dissipating plate is large enough to offer a quick and effective heat dissipation. Preferably, the base plate is made of an insulating material so as to prevent electric conduction from the integrated circuit to the base plate in case that the insulating coating of the integrated circuit is broken.
Inventors
- 👤 Amigo Jean
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:10
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/43; F; F28; F28F; F28F2215/00
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
136 words
A heat dissipation device for an integrated circuit, comprising: a heat-conducting base plate having a bottom surface which is adapted to contact an upper surface of the integrated circuit, and a corrugated perforated heat dissipating plate made of a flexible heat conducting material and fixed on an upper surface of said base plate so as to transfer heat from said base plate to said perforated heat dissipating plate for heat dissipation; said perforated heat dissipating plate having a plurality of ventilation holes formed therethrough, which are located over said base plate so as to enhance air flow in a space between said base plate and said perforated heat dissipating plate; and said perforated heat dissipating plate further having imperforate parts intervening with said ventilating holes, said imperforate parts being greater in area than said ventilating holes.
Claim 2
Dependent Claim
136 words
A heat dissipation device for an integrated circuit, comprising: a heat-conducting base plate having a bottom surface which is adapted to contact an upper surface of the integrated circuit, and a corrugated perforated heat dissipating plate made of a flexible heat conducting material and fixed on an upper surface of said base plate so as to transfer heat from said base plate to said perforated heat dissipating plate for heat dissipation; said perforated heat dissipating plate having a plurality of ventilation holes formed therethrough, which are located over said base plate so as to enhance air flow in a space between said base plate and said perforated heat dissipating plate; and said perforated heat dissipating plate further having imperforate parts intervening with said ventilating holes, said imperforate parts being greater in area than said ventilating holes.
Claim 3
Dependent Claim
125 words
A heat dissipation device for an integrated circuit, comprising a heat-conducting base plate having a bottom surface which is adapted to contact an upper surface of the integrated circuit, and a corrugated heat dissipating plate made of a sheet of imperforate heat conducting material and fixed on an upper surface of said base plate, said corrugated heat dissipating plate having a plurality of first bent portions in contact with said base plate, a plurality of second bent portions extending away from said base plate, regions between said first bent portions and second bent portions, and a plurality of ventilation holes formed in said corrugated heat dissipating plate within said second bent portions and said regions, said first bent portions being free of said ventilation holes.
Claim 4
Dependent Claim
125 words
A heat dissipation device for an integrated circuit, comprising a heat-conducting base plate having a bottom surface which is adapted to contact an upper surface of the integrated circuit, and a corrugated heat dissipating plate made of a sheet of imperforate heat conducting material and fixed on an upper surface of said base plate, said corrugated heat dissipating plate having a plurality of first bent portions in contact with said base plate, a plurality of second bent portions extending away from said base plate, regions between said first bent portions and second bent portions, and a plurality of ventilation holes formed in said corrugated heat dissipating plate within said second bent portions and said regions, said first bent portions being free of said ventilation holes.
Claim 5
Dependent Claim
33 words
A heat dissipation device as claimed in claim 2, wherein said base plate is made of an insulating material so as to prevent electric conduction from the integrated circuit to said base plate.
Claim 6
Dependent Claim
60 words
A heat dissipation device as claimed in claim 2, further comprising a fan unit which is attached to said base plate and which blows air to said perforated heat dissipating plate and into the space between said base plate and said perforated heat dissipating plate so as to form air current immediately over and under said perforated heat dissipating plate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-29 | 2001-06-30 | 2001-12-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-29 | 2005-06-30 | 2005-12-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-29 | 2009-06-30 | 2009-12-30 | $7700.00 | Window Closed / Lapsed |