US4546405A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat sink for electronic package
Assignee: International Business Machines Corp
•
Filing: 1983-05-25
•
Granted: 1985-10-08
•
Expires: 2003-05-25
Abstract
Abstract A cooling fin assembly for mounting on a semiconductor package that includes a plurality of pins adapted to be affixed to a surface on the package, and a cooling fin means having a thin walled cellular configuration with the cells defining elongated openings in side-by-side relation that extend through the fin means, the pins being seated in the cells of the fin means.
Inventors
- 👤 Eric B. Hultmark
- 👤 Claude G. Metreaud
- 👤 Robert A. Yacavonis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 18:51
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/20; H10W40/22; H10W40/226; H10W40/228
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
150 words
In an electronic semiconductor package having a substrate with at least one integrated circuit semiconductor device mounted thereon, and a lid element forming with the substrate an enclosure for the said semiconductor device, the improvement comprising: a heat dissipating assembly mounted on said lid that includes a plurality of pins made of heat conductive material affixed to said lid, cooling fin structure mounted on said plurality of pins, said fin structure comprised of a thin walled cellular structure with of tubular cells open at both ends arranged in side by side relation, said cells of said thin walled cellular structure are of a honeycomb structure with each cell having an even number of sides of equal length, said plurality of pins seated in a plurality of said cells of said fin structure, the relationship serving as a means to mount said fin structure on said package in heat conducting relationship.
Claim 2
Dependent Claim
150 words
In an electronic semiconductor package having a substrate with at least one integrated circuit semiconductor device mounted thereon, and a lid element forming with the substrate an enclosure for the said semiconductor device, the improvement comprising: a heat dissipating assembly mounted on said lid that includes a plurality of pins made of heat conductive material affixed to said lid, cooling fin structure mounted on said plurality of pins, said fin structure comprised of a thin walled cellular structure with of tubular cells open at both ends arranged in side by side relation, said cells of said thin walled cellular structure are of a honeycomb structure with each cell having an even number of sides of equal length, said plurality of pins seated in a plurality of said cells of said fin structure, the relationship serving as a means to mount said fin structure on said package in heat conducting relationship.
Claim 3
Dependent Claim
23 words
The semiconductor package of claim 1 wherein the lower side of said fin means is spaced from the underlying surface of said lid.
Claim 4
Dependent Claim
34 words
The semiconductor package of claim 2 wherein said pins are provided with shoulder stops spaced from the ends affixed to said lid to control the depth of insertion of said pins into said cells.
Claim 5
Dependent Claim
14 words
The semiconductor package of claim 1 wherein said fin structure is formed of aluminum.
Claim 6
Dependent Claim
14 words
The semiconductor package of claim 1 wherein said fin structure is formed of copper.
Claim 7
Dependent Claim
13 words
The semiconductor package of claim 1 wherein said pins are formed of copper.
Claim 8
Dependent Claim
18 words
The semiconductor package of claim 1 wherein said pins have enlarged heads that are bonded to said lid.
Claim 9
Dependent Claim
38 words
The semiconductor package of claim 1 wherein a plurality of semiconductor devices are mounted on said substrate and enclosed by said lid, and said pins are bonded to said lid and located over a device beneath said lid.
Claim 10
Dependent Claim
42 words
The semiconductor package of claim 1 wherein said pins have a circular cross sectional configuration with a diameter slightly larger than the width of said cells, said pins deforming the walls of said cells upon being introduced, forming a firm frictional engagement.
References Cited (Backward Citations)
US3030553A
Cited
US3198990A
Cited
US4057101A
Cited
US4277816A
Cited
US4296455A
Cited
US4338621A
Cited
SU983838A1
Cited
EP0054597A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-10-07 | 1989-04-08 | 1989-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-10-07 | 1993-04-08 | 1993-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-10-07 | 1997-04-08 | 1997-10-08 | $7700.00 | Window Closed / Lapsed |