Micro individual integrated circuit package

Claim 1

A micro hermetic single die integrated circuit package comprising: a heat exchange element having an outer surface and an inner planar surface, a die having planar front and back surfaces, a plurality of area pads distributed in a predetermined configuration on the front surface of said die, a plurality of wires having inner and outer extremities, said inner extremities of said wires being bonded respectively to said area pads, said wires emanating orthogonally from said front surface of said die, the back surface of said die being attached to said inner planar surface of said heat exchange element, a cover plate having planar inner and outer surfaces, a plurality of holes formed in said cover plate, said holes being homologously positioned with respect to said plurality of area pads on said die, a seal ring attached to the respective peripheries of the inner surfaces of said heat exchange element and said cover plate, said outer extremities of said wires being disposed within said holes and being accessible at the outer surface of said cover plate, and means for sealing said wires to said cover plate, thereby effecting an hermetic package.