Heat sink apparatus

Claim 1

A heat sink apparatus adapted to mount on and dissipate heat generated in an electronic device, said heat sink apparatus comprising: a heat conductive base comprising a plate member having a first surface adapted to be in tight contact engagement with a surface of the electronic device and a second surface with a plurality of heat dissipation fins extending therefrom and so arranged to surround a non-finned zone of the second surface of the plate member, the fins being spaced apart from each other to define therebetween gaps serving as air flow passages extending from the non-finned zone to outside the fins; a retainer in the form of a frame having a shape corresponding to the plate member of the heat conductive base, the frame having an inner shoulder fit over a circumferential edge of the plate member, the retainer further comprising a plurality of first, resilient rods extending therefrom with hooked ends adapted to engage an edge of the electronic device so as to retain the heat conductive base on the electronic device; and a fan assembly comprising a support plate having a shape corresponding to the plate member to be supported on and covering the fins, the support plate having an opening formed thereon and corresponding to the non-finned zone, a rotor/blade sub-assembly being rotatably supported on the support plate and within the opening so as to be partially received within the non-finned zone, the support plate further comprising a plurality of second, resilient rods extending therefrom toward the plate member of the heat conductive base, each of the second rods having a free end with a hook formed thereon to be releasably engageable with corresponding notches formed on the heat conductive base so as to fix the fan assembly on the heat conductive base.